A Review on Laser Processing in Electronic and MEMS Packaging

2017 ◽  
Vol 139 (3) ◽  
Author(s):  
Kaysar Rahim ◽  
Ahsan Mian
Keyword(s):  
Laser Processing ◽  
Microelectromechanical Systems ◽  
Mechanical Effect ◽  
Future Trend ◽  
Small Scale ◽  
Attractive Alternative ◽  
Mems Devices ◽  
Processing Technologies ◽  
Mems Packaging ◽  
Heating And Cooling

The packaging of electronic and microelectromechanical systems (MEMS) devices is an important part of the overall manufacturing process as it ensures mechanical robustness as well as required electrical/electromechanical functionalities. The packaging integration process involves the selection of packaging materials and technology, process design, fabrication, and testing. As the demand of functionalities of an electronic or MEMS device is increasing every passing year, chip size is getting larger and is occupying the majority of space within a package. This requires innovative packaging technologies so that integration can be done with less thermal/mechanical effect on the nearby components. Laser processing technologies for electronic and MEMS packaging have potential to obviate some of the difficulties associated with traditional packaging technologies and can become an attractive alternative for small-scale integration of components. As laser processing involves very fast localized and heating and cooling, the laser can be focused at micrometer scale to perform various packaging processes such as dicing, joining, and patterning at the microscale with minimal or no thermal effect on surrounding material or structure. As such, various laser processing technologies are currently being explored by researchers and also being utilized by electronic and MEMS packaging industries. This paper reviews the current and future trend of electronic and MEMS packaging and their manufacturing processes. Emphasis is given to the laser processing techniques that have the potential to revolutionize the future manufacturing of electronic and MEMS packages.

Developments in Microelectromechanical Systems (MEMS): A Manufacturing Perspective

2003 ◽  
Vol 125 (4) ◽  
pp. 816-823 ◽  
Author(s):  
Srinivas A. Tadigadapa ◽  
Nader Najafi
Keyword(s):  
Microelectromechanical Systems ◽  
Process Development ◽  
Reliability Testing ◽  
Mems Devices ◽  
Manufacturing Strategy ◽  
Cad Tools ◽  
Fragile State ◽  
Mems Packaging ◽  
Overall Performance

This paper presents a discussion of some of the major issues that need to be considered for the successful commercialization of MEMS products. The diversity of MEMS devices and historical reasons have led to scattered developments in the MEMS manufacturing infrastructure. A good manufacturing strategy must include the complete device plan including package as part of the design and process development of the device. In spite of rapid advances in the field of MEMS there are daunting challenges that lie in the areas of MEMS packaging, and reliability testing. CAD tools for MEMS are starting to get more mature but are still limited in their overall performance. MEMS manufacturing is currently at a fragile state of evolution. In spite of all the wonderful possibilities, very few MEMS devices have been commercialized. In our opinion, the magnitude of the difficulty of fabricating MEMS devices at the manufacturing level is highly underestimated by both the current and emerging MEMS communities. A synopsis of MEMS manufacturing issues is presented here.

Functional Fiber Junctions for Circuit Routing in E-Textiles: Deterministic Alignment of MEMS Layout With Fabric Structure

2021 ◽  
Author(s):  
Sushmita Challa ◽  
M. Shafquatul Islam ◽  
Danming Wei ◽  
Jasmin Beharic ◽  
Dan O. Popa ◽  
...  
Keyword(s):  
Microelectromechanical Systems ◽  
Flexible Substrate ◽  
Fibrous Materials ◽  
Mems Devices ◽  
Image Processing Algorithm ◽  
Mems Packaging ◽  
Alignment Procedure ◽  
Fabric Structure ◽  
Parallel Transfer ◽  
Functional Fiber

Abstract Fabrics and fibrous materials offer a soft, porous, and flexible substrate for microelectromechanical systems (MEMS) packaging in breathable, wearable formats that allow airflow. Device-on-fiber systems require developments in the field of E-Textiles including smart fibers, functional fiber intersections, textile circuit routing, and alignment methods that adapt to irregular materials. In this paper, we demonstrate a MEMS-on-fabric layout workflow that obtains fiber intersection locations from high-resolution fabric images. We implement an image processing algorithm to drive the MEMS layout software, creating an individualized MEMS “gripper” layout designed to grasp fibers on a specific fabric substrate during a wafer-to-fabric parallel transfer step. The efficiency of the algorithm in terms of a number of intersections identified on the complete image is analyzed. The specifications of the MEMS layout design such as the length of the MEMS gripper, spatial distribution, and orientation are derivable from the MATLAB routine implemented on the image. Furthermore, the alignment procedure, tolerance, and hardware setup for the alignment method of the framed sample fabric to the wafer processed using the custom gripper layout are discussed along with the challenges of the release of MEMS devices from the Si substrate to the fabric substrate.

On the Micromechanical Characterization of Metallic MEMS by a Hybrid Microtester

2015 ◽  
Author(s):  
Jennifer Wardlow ◽  
Seyed Allameh
Keyword(s):  
Mechanical Properties ◽  
Microelectromechanical Systems ◽  
Local Deformation ◽  
Small Scale ◽  
Large Displacements ◽  
Mems Devices ◽  
Surface Flaws ◽  
Micromechanical Characterization ◽  
Position Monitoring

Mechanical testing of microelectromechanical systems (MEMS) components helps investigate the reliability of MEMS devices used especially in vital applications such as life-supporting, medical, aerospace or automotive technologies. This paper discusses the development and use of a hybrid micromechanical system that combines the advantages of a macroscale slow-action screw-driven stage producing large displacements with a small-scale fast-action piezo-driven actuator. The main advantage is to study mechanical properties of small structures such as thick and thin films developing cracks that travel on millimeter scale during fatigue. The combination of piezo position monitoring with image-recognition-based local deformation determination allows specification of the beginning of phenomena such as micro-void-induced softening with relative accuracy. Such studies are most useful for investigation of the onset of nucleation of microcracks from fatigue-induced surface flaws. The significance of finding the onset of crack propagation lies in the fact that crack initiation constitutes the major portion of fatigue life for small structures (occasionally up to 99.3%).

Development of Conformal PDMS and Parylene Coatings for Microelectronics and MEMS Packaging

2005 ◽  
Author(s):  
Hyungsuk Lee ◽  
Junghyun Cho
Keyword(s):  
Mechanical Properties ◽  
Microelectromechanical Systems ◽  
Protective Coatings ◽  
Harsh Environments ◽  
Small Scale ◽  
Mems Packaging ◽  
Atomic Force ◽  
Innovative Solution ◽  
Extensive Surface ◽  
Dynamic Nanoindentation

There is a growing demand in the development of small-scale devices in microelectronics and microelectromechanical systems (MEMS). Packaging and reliability of such devices are of great concern as they introduce a number of unique packaging issues that are distinct and different from typical electronic packaging applications. In addition, the packaging or encapsulation materials are often exposed to harsh environments, for which their performance is drastically degraded. Importantly, such devices become lighter and smaller, precluding the use of conventional packaging materials and schemes. Given that, surface protective coatings can provide an innovative solution for some of the aforementioned issues. Polymers have indeed shown such a potential for use either as a standalone coating, or an intermediate layer for the subsequent harder, stiffer coatings. In this study, we explore processes and properties of the three coating systems: i) PDMS, ii) Parylene (para-xylylene), iii) Parylene/PDMS. In particular, parylene coating on PDMS is a focus of this study. The parylene coating having much higher mechanical properties than PDMS provided a way to enhance the surface properties of this PDMS. Proper surface modification of PDMS via oxygen plasma seemed to be essential to generate desirable microstructures of parylene coating. Mechanical properties of such coatings are systematically examined via a nanoindenter. The dynamic nanoindentation is also employed to assess viscoelastic properties, as well as depth-dependent mechanical properties. While characterizing the films using the nanoindentation, the substrate effect influenced the indentation data. In addition, extensive surface characterizations are carried out using atomic force microscope (AFM), scanning electron microscope (SEM), and optical microscopy.

Investigation of the Deposition and Integration of Hard Coatings for Moving MEMS Applications

1999 ◽  
Vol 605 ◽  
Author(s):  
P.M. Adams ◽  
R.E. Robertson ◽  
R.C. Cole ◽  
D. Hinkley ◽  
G. Radhakrishnan
Keyword(s):  
Microelectromechanical Systems ◽  
Fundamental Problem ◽  
Three Dimensional ◽  
Hard Coatings ◽  
Three Dimensions ◽  
Small Scale ◽  
Mems Devices ◽  
Wear Resistant ◽  
Integrated Electronics ◽  
Poly Silicon

AbstractMicroelectromechanical systems (MEMS) have been identified as a key technology for small-scale satellites, integrated sensors, and intelligent control systems. Using methods developed for highly integrated electronics, mechanical components are co-fabricated on planar wafers and subsequently etched free for mechanical movements in three dimensions. A major design limitation for these systems is their inability to withstand prolonged sliding surface contact. The fundamental problem is that the surface properties of silicon and poly-silicon, two of the most widely used materials for MEMS, are highly unsuitable for moving MEMS devices, resulting in high wear during operation. This work explores the feasibility and benefits of depositing thin, wear-resistant, low-friction coatings on silicon or poly-silicon. To achieve this goal, three-dimensional test silicon microstructures have been fabricated. Wear-resistant titanium carbide (TiC) coatings are deposited on these test structures using a novel non-line-of-sight pulsed laser deposition (PLD) process. In parallel, this paper addresses the integration of the TiC coating directly into the MEMS fabrication processes and its compatibility with standard silicon processing.

Key Reliability Factors for IC and MEMS Packaging

2000 ◽  
Author(s):  
Reza Ghaffarian
Keyword(s):  
Microelectromechanical Systems ◽  
Technology Development ◽  
High Reliability ◽  
Pressure Sensors ◽  
Cost Savings ◽  
Industrial Applications ◽  
Current Status ◽  
Mems Devices ◽  
Mems Packaging ◽  
Commercial Off The Shelf

Abstract During the last decade, research and development of microelectromechanical systems (MEMS) has shown a significant promise for a variety of commercial applications including automobile and medical purposes. For example, accelerometers are widely used for air bag in automobile and pressure sensors for various industrial applications. Some of the MEMS devices have potential to become the commercial-off-the-shelf (COTS) components. While high reliability/harsh environmental applications including aerospace require much more sophisticated technology development, they would achieve significant cost savings if they could utilize COTS components in their systems. This paper reviews the current status of IC and MEMS packaging technology with emphasis on reliability, compares the norm for IC packaging reliability evaluation and identifies challenges for development of reliability methodologies for MEMS, and finally proposes the use of COTS MEMS in order to start generating statistically meaningful reliability data as a vehicle for future standardization of reliability test methodology for MEMS packaging.

scholarly journals A Novel Seedless TSV Process Based on Room Temperature Curing Silver Nanowires ECAs for MEMS Packaging

Micromachines ◽  
2019 ◽  
Vol 10 (6) ◽  
pp. 351 ◽  
Author(s):  
Meng ◽  
Cheng ◽  
Yang ◽  
Sun ◽  
Luo
Keyword(s):  
Room Temperature ◽  
Microelectromechanical Systems ◽  
Silver Nanowires ◽  
Low Cost ◽  
Mems Devices ◽  
Filling Process ◽  
Conductive Adhesives ◽  
Mems Packaging ◽  
Wide Range ◽  
High Efficient

The through-silicon-vias (TSVs) process is a vital technology in microelectromechanical systems (MEMS) packaging. The current via filling technique based on copper electroplating has many shortcomings, such as involving multi-step processes, requiring sophisticated equipment, low through-put and probably damaging the MEMS devices susceptible to mechanical polishing. Herein, a room temperature treatable, high-efficient and low-cost seedless TSV process was developed with a one-step filling process by using novel electrically conductive adhesives (ECAs) filled with silver nanowires. The as-prepared ECAs could be fully cured at room temperature and exhibited excellent conductivity due to combining the benefits of both polymethyl methacrylate (PMMA) and silver nanowires. Complete filling of TSVs with the as-prepared 30 wt% silver nanowires ECAs was realized, and the resistivity of a fully filled TSV was as low as 10−3 Ω·cm. Furthermore, the application of such novel TSV filling process could also be extended to a wide range of different substrates, showing great potential in MEMS packaging, flexible microsystems and many other applications.

scholarly journals QPOs in compact binaries from small scale eruptions in an inner magnetized disk

2020 ◽  
Author(s):  
Nicolas Scepi ◽  
Mitchell C Begelman ◽  
Jason Dexter
Keyword(s):  
Rapid Heating ◽  
Small Scale ◽  
Type B ◽  
Periodic Oscillations ◽  
X Ray ◽  
Compact Binaries ◽  
Heating And Cooling ◽  
Low Mass ◽  
X Ray Binaries ◽  
Standard Disk

Abstract Dwarf novæ (DNe) and low mass X-ray binaries (LMXBs) are compact binaries showing variability on time scales from years to less than seconds. Here, we focus on explaining part of the rapid fluctuations in DNe, following the framework of recent studies on the monthly eruptions of DNe that use a hybrid disk composed of an outer standard disk and an inner magnetized disk. We show that the ionization instability, that is responsible for the monthly eruptions of DNe, is also able to operate in the inner magnetized disk. Given the low density and the fast accretion time scale of the inner magnetized disk, the ionization instability generates small, rapid heating and cooling fronts propagating back and forth in the inner disk. This leads to quasi-periodic oscillations (QPOs) with a period of the order of 1000 s. A strong prediction of our model is that these QPOs can only develop in quiescence or at the beginning/end of an outburst. We propose that these rapid fluctuations might explain a subclass of already observed QPOs in DNe as well as a, still to observe, subclass of QPOs in LMXBs. We also extrapolate to the possibility that the radiation pressure instability might be related to Type B QPOs in LMXBs.

MEMS Post-Packaging by Localized Heating

2000 ◽  
Author(s):  
Liwei Lin
Keyword(s):  
Vapor Deposition ◽  
Microelectromechanical Systems ◽  
Chemical Vapor ◽  
Research Subject ◽  
Major Research ◽  
Research Directions ◽  
Mems Packaging ◽  
Fusion Bonding ◽  
Localized Heating ◽  
Pressure Chemical

Abstract This work addresses important post-packaging issues for microelectromechanical systems (MEMS) and introduces specific research directions by means of localized heating and bonding. MEMS packaging has become a major research subject due to the stringent packaging requirements in the emerging filed of MEMS. Establishing a versatile post-packaging process not only advances the field scientifically but also helps product commercialization in industry. An innovative post-packaging approach by localized heating and bonding is proposed and presented in this paper. Various post-packaging processes are demonstrated, including an integrated LPCVD (Low Pressure Chemical Vapor Deposition) sealing process, localized silicon-gold eutectic bonding, localized silicon-glass fusion bonding, localized solder bonding and localized CVD bonding processes.

Sign in / Sign up

Export Citation Format

Share Document