scholarly journals Anisotropic Thermal Response of Packed Copper Wire

2017 ◽  
Vol 9 (4) ◽  
Author(s):  
Andrew A. Wereszczak ◽  
J. Emily Cousineau ◽  
Kevin Bennion ◽  
Hsin Wang ◽  
Randy H. Wiles ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Copper Wire ◽  
Thermal Response ◽  
Laser Flash ◽  
Test Methods ◽  
Element Analysis ◽  
Fea Model ◽  
Apparent Thermal Conductivity ◽  
The Wire ◽  
Packing Efficiency

The apparent thermal conductivity of packed copper wire test specimens was measured parallel and perpendicular to the axis of the wire using laser flash, transient plane source, and transmittance test methods. Approximately 50% wire packing efficiency was produced in the specimens using either 670- or 925-μm-diameter copper wires that both had an insulation coating thickness of 37 μm. The interstices were filled with a conventional varnish material and also contained some remnant porosity. The apparent thermal conductivity perpendicular to the wire axis was about 0.5–1 W/mK, whereas it was over 200 W/mK in the parallel direction. The Kanzaki model and an finite element analysis (FEA) model were found to reasonably predict the apparent thermal conductivity perpendicular to the wires but thermal conductivity percolation from nonideal wire-packing may result in their underestimation of it.

scholarly journals Heat Dissipation in Epoxy/Amine-Based Gradient Composites with Alumina Particles: A Critical Evaluation of Thermal Conductivity Measurements

Polymers ◽  
2018 ◽  
Vol 10 (10) ◽  
pp. 1131 ◽  
Author(s):  
Matthias Morak ◽  
Philipp Marx ◽  
Mario Gschwandl ◽  
Peter Filipp Fuchs ◽  
Martin Pfost ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Heat Dissipation ◽  
Critical Evaluation ◽  
Laser Flash ◽  
Element Analysis ◽  
Epoxy Amine ◽  
Alumina Particles ◽  
Laser Flash Analysis ◽  
Key Aspects ◽  
Guarded Heat Flow Meter

Abstract: For the design of the next generation of microelectronic packages, thermal management is one of the key aspects and must be met by the development of polymers with enhanced thermal conductivity. While all polymer classes show a very low thermal conductivity, this shortcoming can be compensated for by the addition of fillers, yielding polymer-based composite materials with high thermal conductivity. The inorganic fillers, however, are often available only in submicron- and micron-scaled dimensions and, consequently, can sediment during the curing reaction of the polymer matrix. In this study, an epoxy/amine resin was filled with nano- and submicron-scaled alumina particles, yielding a gradient composite. It was found that the thermal conductivity according to laser flash analysis of a sliced specimen ranged from 0.25 to 0.45 W·m−1·K−1 at room temperature. If the thermal conductivity of an uncut specimen was measured with a guarded heat flow meter, the ‘averaged’ thermal conductivity was measured to be only 0.25 W·m−1·K−1. Finite element analysis revealed that the heat dissipation through a gradient composite was of intermediate speed in comparison with homogeneous composites exhibiting a non-gradient thermal conductivity of 0.25 and 0.45 W·m−1·K−1.

Effects of Fin Configuration on Heat Transfer Rate in Packed Bed Reactors for Improvement of Their Thermal Characteristics

2010 ◽  
Author(s):  
Koichi Nakaso ◽  
Takuro Aoki ◽  
Jun Fukai
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Heat Transfer Rate ◽  
Transfer Rate ◽  
Thermal Response ◽  
Packed Bed ◽  
Packed Bed Reactors ◽  
Apparent Thermal Conductivity ◽  
Spiral Type ◽  
Thermal Conductivities

Packed bed reactors are utilized for catalysts, chemical heat pumps, etc. Because the effective thermal conductivities of the packed beds of particles are generally low (≈10−1 W/mK), this matter often results in low performance and degradation of catalyst. Many heat transfer tubes with fins and/or much filler with high thermal conductivities are inserted in the packed bed reactors to improve heat transfer rate. In return to this, the volume of reactive particles packed into the reactors, or stored energy, decreases. In this study, the effect of fin configurations on the heat transfer rate in the reactors is numerically investigated. Three configurations of fins are studied. (1) “Sheet type” is a longitudinal fin attached on the heat transfer tubes. It is placed to connect between heat transfer tubes. (2) “Straight type” is several longitudinal fins in the half length of the tube pitch attached on the tube with radial structure. (3) “Spiral type” is many narrow rectangular fins attached on the tube with spiral structure. To discuss the effect of fin configuration on the heat transfer generally, the heat conduction equation in the packed bed around the tube is converted to the dimensionless form. The transient temperature responses in the packed bed and fins at a uniform temperature are calculated when the temperature of the tube surface is stepwise changes. In another analytical system, a homogeneous body around the tube is assumed. To evaluate the thermal performance of the fin, apparent thermal conductivity is defined as the thermal conductivity which gives the same thermal response as that calculated in the heterogeneous system. As a result, the spiral type rather than the straight and sheet types effectively increases apparent thermal conductivity. The apparent thermal conductivity of the spiral type is two-three times larger than the straight type, and ten times as large as the sheet type. This result indicates dispersion of fins in packed bed is essential to improve the thermal response in the reactors.

scholarly journals Effect of Groundwater Flow and Thermal Conductivity on the Ground Source Heat Pump Performance at Bangkok and Hanoi: A Numerical Study

2021 ◽  
Author(s):  
Arif Widiatmojo ◽  
Youhei Uchida ◽  
Isao Takashima
Keyword(s):  
Thermal Conductivity ◽  
Groundwater Flow ◽  
Heat Pump ◽  
Line Source ◽  
Thermal Response ◽  
Ground Source Heat Pump ◽  
Source Method ◽  
Ground Source ◽  
Apparent Thermal Conductivity ◽  
Infinite Line

In recent decades, the fast-growing economies of Southeast Asian countries have increased the regional energy demand per capita. The statistic indicates Southeast Asian electricity consumption grows for almost 6% annually, with space cooling becoming the fastest-growing share of electricity use. The ground source heat pump technology could be one of the solutions to improve energy efficiency. However, currently, there are limited data on how a ground source heat pump could perform in such a climate. The thermal response test is widely used to evaluate the apparent thermal conductivity of the soil surrounding the ground heat exchanger. In common practice, the apparent thermal conductivity can be calculated from the test result using an analytical solution of the infinite line source method. The main limitation of this method is the negligence of the physical effect of convective heat transfer due to groundwater flow. While convection and dispersion of heat are two distinctive phenomena, failure to account for both effects separately could lead to an error, especially in high groundwater flow. This chapter discusses the numerical evaluation of thermal response test results in Bangkok, Thailand, and Hanoi, Vietnam. We applied a moving infinite line source analytical model to evaluate the value of thermal conductivity and groundwater flow velocity. While determining the ground thermal properties in a high accuracy is difficult, the moving infinite line source method fulfills the limitation of the infinite line source method. Further, we evaluated the five-year performance of the ground source heat pump system coupled with two vertical ground heat exchangers in Bangkok and Hanoi. The results suggest the importance of groundwater flow to enhance the thermal performance of the system.

Tire Bead Overheating in Urban Buses and Trucks Using Drum Brake Systems

1998 ◽  
Vol 26 (1) ◽  
pp. 51-62
Author(s):  
A. L. A. Costa ◽  
M. Natalini ◽  
M. F. Inglese ◽  
O. A. M. Xavier
Keyword(s):  
Heat Transfer ◽  
Finite Element Analysis ◽  
Finite Element ◽  
Thermal Energy ◽  
Structural Integrity ◽  
Experimental Temperature ◽  
Temperature Profiles ◽  
Element Analysis ◽  
Drum Brake ◽  
Fea Model

Abstract Because the structural integrity of brake systems and tires can be related to the temperature, this work proposes a transient heat transfer finite element analysis (FEA) model to study the overheating in drum brake systems used in trucks and urban buses. To understand the mechanics of overheating, some constructive variants have been modeled regarding the assemblage: brake, rims, and tires. The model simultaneously studies the thermal energy generated by brakes and tires and how the heat is transferred and dissipated by conduction, convection, and radiation. The simulated FEA data and the experimental temperature profiles measured with thermocouples have been compared giving good correlation.

Highly thermally conductive UHMWPE/NG composites with the segregated structure and their application for heat spreader

2020 ◽  
pp. 089270572096564
Author(s):  
Xiao Wang ◽  
Hui Lu ◽  
Jun Chen
Keyword(s):  
Thermal Conductivity ◽  
Laser Flash ◽  
Heating Process ◽  
X Ray Diffraction ◽  
Heat Spreader ◽  
Conductive Composites ◽  
Compression Direction ◽  
Thermal Analyzer ◽  
Thermally Conductive ◽  
Plane Direction

In this work, ultra-high molecular weight polyethylene (UHMWPE)/natural flake graphite (NG) polymer composites with the extraordinary high thermal conductivity were prepared by a facile mixed-heating powder method. Morphology observation and X-ray diffraction (XRD) tests revealed that the NG flakes could be more tightly coated on the surface of UHMWPE granules by mixed-heating process and align horizontally (perpendicular to the hot compression direction of composites). Laser flash thermal analyzer (LFA) demonstrated that the thermal conductivity (TC) of composites with 21.6 vol% of NG reached 19.87 W/(m·K) and 10.67 W/(m·K) in the in-plane and through-plane direction, respectively. Application experiment further demonstrated that UHMWPE/NG composites had strong capability to dissipate the heat as heat spreader. The obtained results provided a valuable basis for fabricating high thermal conductive composites which can act as advanced thermal management materials.

scholarly journals Enhanced electrical conductivity and mechanical properties in thermally stable fine-grained copper wire

2021 ◽  
Vol 2 (1) ◽  
Author(s):  
Qingzhong Mao ◽  
Yusheng Zhang ◽  
Yazhou Guo ◽  
Yonghao Zhao
Keyword(s):  
Mechanical Properties ◽  
Thermal Stability ◽  
Electrical Conductivity ◽  
Yield Strength ◽  
High Speed ◽  
Copper Wire ◽  
Rapid Development ◽  
Dislocation Slip ◽  
Ultrafine Grains ◽  
The Wire

AbstractThe rapid development of high-speed rail requires copper contact wire that simultaneously possesses excellent electrical conductivity, thermal stability and mechanical properties. Unfortunately, these are generally mutually exclusive properties. Here, we demonstrate directional optimization of microstructure and overcome the strength-conductivity tradeoff in copper wire. We use rotary swaging to prepare copper wire with a fiber texture and long ultrafine grains aligned along the wire axis. The wire exhibits a high electrical conductivity of 97% of the international annealed copper standard (IACS), a yield strength of over 450 MPa, high impact and wear resistances, and thermal stability of up to 573 K for 1 h. Subsequent annealing enhances the conductivity to 103 % of IACS while maintaining a yield strength above 380 MPa. The long grains provide a channel for free electrons, while the low-angle grain boundaries between ultrafine grains block dislocation slip and crack propagation, and lower the ability for boundary migration.

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