Experimental Investigation on Heat Transfer Performance of a Flat Plate Heat Pipe With MWCNTS-Acetone Nanofluid

2017 ◽  
Vol 139 (6) ◽  
Author(s):  
Xiaohong Hao ◽  
Bei Peng ◽  
Yi Chen ◽  
Gongnan Xie
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Aspect Ratio ◽  
Thermal Resistance ◽  
Heat Pipe ◽  
Mass Concentration ◽  
Heat Transfer Performance ◽  
Transfer Performance ◽  
Plate Heat ◽  
Flat Plate Heat Pipe

This paper experimentally investigates how different mass concentration and aspect ratio multiwall carbon nanotubes (MWCNTs) acetone nanofluid affects the heat transfer performance of a flat plate heat pipe (FPHP). Different mass concentration and aspect ratio MWCNTs-acetone nanofluids are prepared without any surfactants or additives using the two-step method. Aspect ratios of MWCNTs are 666 (M1) and 200 (M2), respectively, and their according mass concentrations are 0.002, 0.005, 0.01, and 0.015 wt. %, respectively. The thermal resistance and wall temperature of the FPHP are experimentally obtained when the above-mentioned nanofluids are used as working fluid. The results showed that different mass concentration affects the heat transfer performance, therefore, there is an optimal MWCNTs-acetone nanofluid mass concentration (about 0.005wt. %). Also, the results showed that the thermal resistances of the FPHP with M1-acetone nanofluid (0.005 wt. %) and M2-acetone nanofluid (0.005 wt. %) are reduced 40% and 16%, respectively. Based on the above experimental phenomenon, this paper discusses the reasons for enhancement and decrement of heat transfer performance of the different mass concentration. For the M1-acetone nanofluid, the investigated FPHP has a thermal resistance of 0.26 °C/W and effective thermal conductivity 3212 W/m k at a heat input of 160 W. For the M2-acetone nanofluid, the investigated FPHP has a thermal resistance of 0.33 °C/W and effective thermal conductivity 2556 W/m k at a heat input of 150 W. The nanofluid FPHP investigated here provides a new approach in designing a high efficient next generation heat pipe cooling devices.

Experimental Investigation of Heat Transfer Enhancement of the Heat Pipe Using CuO-Water Nanofluid

2010 ◽  
Vol 160-162 ◽  
pp. 507-512 ◽  
Author(s):  
Dong Dong Li ◽  
Wei Lin Zhao ◽  
Zong Ming Liu ◽  
Bao Jie Zhu
Keyword(s):  
Heat Transfer ◽  
Experimental Investigation ◽  
Thermal Resistance ◽  
Heat Pipe ◽  
Mass Concentration ◽  
Heat Transfer Performance ◽  
Input Power ◽  
Distilled Water ◽  
Transfer Performance ◽  
Start Up

This paper presents an experimental investigation of the heat transfer characteristics of the heat pipe with CuO-water nanofluid. For this purpose, CuO nanoparticles of 30 nm size were dispersed in distilled water to form stable suspension containing 0.1% ~ 2.0% mass concentrations of nanoparticles, and then the heat pipe was produced after CuO-water nanofluid was added in it as the working fluid. Experimental results show that the use of CuO-water nanofluid hold a lower start-up temperature and shorter start-up time for the evaporation section of the heat pipe compared to distilled water. Their heat transfer performance of the evaporation section and condenser section has been improved than that of distilled water. The heat transfer coefficient of nanofluid is higher than that of the base liquid and found to increase by 29.4% and 125.0% for the mass concentration of 0.5% compared with the heat pipe using distilled water while the input power ranging from 15W to 45W. By examining the thermal resistance, it was found that the thermal resistance has been significantly decreased compared with the heat pipe with distilled water. The thermal resistance of heat pipe using CuO-water nanofluid at a mass concentration of 0.5% is 0.36K/W when the input power is 45W, while the thermal resistance of heat pipe using distilled water is 0.80K/W. Further analysis indicates that the heat pipe using CuO-water nanofluid at 1.0% mass concentrations has the best heat transfer performance.

Investigation on Heat Transfer Performance of Heat Pipe Grinding Wheel in Dry Grinding

2016 ◽  
Vol 138 (11) ◽  
Author(s):  
Qingshan He ◽  
Yucan Fu ◽  
Jiajia Chen ◽  
Wei Zhang
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Heat Pipe ◽  
Heat Transfer Performance ◽  
Grinding Wheel ◽  
Grinding Temperature ◽  
Transfer Performance ◽  
Equivalent Thermal Conductivity ◽  
Dry Grinding ◽  
Pipe Heat

The use of fluid in grinding enhances heat exchange at the contact zone and reduces grinding temperature. However, the massive use of fluid can cause negative influences on environment and machining cost. In this paper, a novel method of reducing grinding temperature based on heat pipe technology is proposed. One new heat pipe grinding wheel and its heat transfer principle are briefly introduced. A heat transfer mathematical model is established to calculate equivalent thermal conductivity of heat pipe grinding wheel. Compared with the wheel without heat pipe, heat transfer effect of heat pipe grinding wheel is presented, and the influences of heat flux input, cooling condition, wheel speed, and liquid film thickness on heat transfer performance are investigated. Furthermore, dry grinding experiments with two different wheels are conducted to verify the cooling effectiveness on grinding temperature. The results show that thermal conductivity of the wheel with heat pipe can be greatly improved compared to the one without heat pipe; heat transfer performance of heat pipe grinding wheel can change with different grinding conditions; meanwhile, grinding temperatures can be significantly decreased by 50% in dry grinding compared with the wheel without heat pipe.

scholarly journals Analysis on start up and heat transfer performance of mercury heat pipe under alternating heating power

2021 ◽  
Vol 248 ◽  
pp. 01004
Author(s):  
Chongju Hu ◽  
Xiuxiang Zhang ◽  
Hongyan Wang ◽  
Bo Wu ◽  
Pinghua Zhang
Keyword(s):  
Heat Transfer ◽  
Steady State ◽  
Thermal Resistance ◽  
Heat Pipe ◽  
Heat Transfer Performance ◽  
Transfer Performance ◽  
Start Up ◽  
Steady State Temperature ◽  
Temperature Heat ◽  
Fluctuation Amplitude

Heat pipe may be affected by the high temperature heat source during operation, resulting in unsteady oscillation heating. In this paper, the influence of alternating power and period on the start-up and heat transfer performance of mercury heat pipe is studied by using the method of equivalent thermal resistance of heat pipe. The results are as follows:1) The start-up time of alternating power heating and steady-state power heating is basically equal; 2) For the alternating power heating, the steady-state temperature of heat pipe changes periodically, increasing the alternating period or the amplitude of alternating power will lead to the increase of the fluctuation amplitude of heat pipe temperature, and the influence of alternating period is greater than that of changing the amplitude of alternating power. 3) Under the condition of alternating power heating, the steady-state thermal resistance of heat pipe changes periodically. The fluctuation amplitude of steady-state thermal resistance of heat pipe increases with the increase of alternating period and alternating power amplitude, and the influence of alternating power amplitude is greater than that of alternating period.

Effect of Increasing Wick Evaporation Area on Heat Transfer Performance for Loop Heat Pipes

2013 ◽  
Vol 711 ◽  
pp. 223-228 ◽  
Author(s):  
Shen Chun Wu ◽  
Jhih Huang Gao ◽  
Zih Yan Huang ◽  
Dawn Wang ◽  
Cho Jeng Huang ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Thermal Resistance ◽  
Heat Pipe ◽  
Surface Area ◽  
Heat Transfer Performance ◽  
Heat Pipes ◽  
Loop Heat Pipe ◽  
Transfer Performance ◽  
Loop Heat Pipes ◽  
Heat Transfer Capacity

This study investigates the effects of increasing the evaporating area of wick in a loop heat pipe (LHP). This work attempts to improve the performance of the loop heat pipe by increasing the number of grooves and thereby the surface area of the wick. The number of grooves is increased from eight to twelve. Experimental results show that increasing the number of grooves not only increases the surface area of the wick but also enhances LHP performance. When the evaporating surface area increases by 50%, which corresponds to increasing the number of grooves from eight to twelve, the heat transfer capacity increases from 310W to 470W and the thermal resistance is reduced from 0.21°C/W to 0.17°C/W. According to preliminary measurements, increasing the number of grooves in the loop heat pipe is highly promising for improving the heat transfer performance.

Research on Thermal Resistance of Micro Heat Pipe with Sintered Wick

2013 ◽  
Vol 589-590 ◽  
pp. 552-558
Author(s):  
Xi Bing Li ◽  
Xun Wang ◽  
Yun Shi Ma ◽  
Zhong Liang Cao
Keyword(s):  
Heat Transfer ◽  
Thermal Resistance ◽  
Heat Pipe ◽  
Heat Transfer Performance ◽  
High Heat ◽  
Working Fluid ◽  
Transfer Performance ◽  
Total Thermal Resistance ◽  
Vapor Cavity ◽  
Micro Heat Pipe

As a highly efficient heat dissipation unit, a micro heat pipe is widely used in high heat flux microelectronic chips, and its thermal resistance is crucial to heat transfer capacity. Through analyses of the structure and heat transfer performance of a circular heat pipe with sintered wick, the theoretical model of total thermal resistance was established on heat transfer theory, and then simplified, finally a testing platform was set up to test for total thermal resistance performance. The testing results show that when the micro heat pipe is in optimal heat transfer state, its total thermal resistance conform well with that from the theoretical model, and its actual thermal resistance is much lower than that of the rod made of the material with perfect thermal conductivity and of the same geometric size. With the increment of heat transfer capability, the total thermal resistance of a micro heat pipe with sintered wick decreases first, then increases and reaches the minimum when it is in the optimal heat transfer state. The greater total thermal resistance in low heat transfer performance is mainly caused by too much working fluid accumulating in evaporator and the lower velocity in vapor cavity, and the greater total thermal resistance in high heat transfer performance is mainly due to the working fluid drying up in condenser. Total thermal resistance is related to many factors, such as thermal conductivity of tube-shell material, wall thickness, wick thickness, copper powders grain size and porosity, the lengths of condenser and evaporator, and the diameter of vapor cavity etc.. Therefore, the structure parameters of a micro heat pipe with sintered wick should be reasonably designed according to the specific conditions to ensure its heat transfer capacity and total thermal resistance to meet the requirements.

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