Research on Ultrasonic-Assisted Fixed-Abrasive Lapping Technology for Engineering Ceramics Cylindrical Part

2017 ◽  
Vol 5 (2) ◽  
Author(s):  
Feng Jiao ◽  
Bo Zhao
Keyword(s):  
Ultrasonic Vibration ◽  
Material Removal ◽  
High Efficiency ◽  
Removal Rate ◽  
Tangential Force ◽  
Cylindrical Part ◽  
Engineering Ceramics ◽  
Machining Quality ◽  
Ultrasonic Assisted ◽  
Fixed Abrasive

Lapping is a key processing step for precision parts, which directly affects machining quality, precision, and efficiency. Due to some drawbacks of free-abrasive lapping such as deep scratches on the lapped surface, lower lapping efficiency for lower lapping speed, severe waste of abrasive, high-processing cost, and so on, conventional fixed-abrasive lapping (CFL) technology was proposed and developed recently. Meanwhile, considering the unique advantages of the ultrasonic-assisted machining during the processing of those hard and brittle materials and the effect of ultrasonic vibration on the self-sharpening characteristic of abrasive pellet, a novel ultrasonic-assisted fixed-abrasive lapping (UAFL) technology is put forward and corresponding lapping device for engineering ceramics cylindrical part is developed in this paper. Meanwhile, UAFL mechanism and characteristics were studied theoretically and experimentally. Research results show that superimposed ultrasonic vibration changes the lapping movement characteristics and material removal mechanism to a certain extent, helping to heighten material removal rate, smoothen the waveform of tangential force, reduce the average tangential force, and improve surface machining quality. UAFL can be regarded as a high efficiency and precision processing technology for engineering ceramics cylindrical part.

Research on Ultrasonic Aided Fixed-Abrasive Lapping Technology for Engineering Ceramics Cylindrical Part

2016 ◽  
Author(s):  
Feng Jiao ◽  
Bo Zhao
Keyword(s):  
Surface Quality ◽  
Ultrasonic Vibration ◽  
Tangential Force ◽  
Abrasive Particle ◽  
Cylindrical Part ◽  
Depth Of Cut ◽  
Machining Accuracy ◽  
Engineering Ceramics ◽  
Vibration Assistance ◽  
Fixed Abrasive

As the final machining procedure of precision components, lapping is often regarded as an important step affecting surface quality, machining accuracy and machining efficiency. Due to some drawbacks of free-abrasive lapping such as deep scratches on the lapped surface, lower lapping efficiency for lower lapping speed, severe waste of abrasive, high processing cost, and so on, fixed-abrasive lapping technology was put forward and developed recently. Meanwhile, considering the unique advantages of the ultrasonic vibration aided machining in the processing of hard-brittle materials such as engineering ceramics, optical glass, etc. and the influence of ultrasonic vibration on the self-sharpening characteristic of abrasive pellet, a novel ultrasonic aided fixed-abrasive lapping technology for engineering ceramics cylindrical part is put forward and corresponding lapping device is developed in this paper. Through theoretical analysis on the ultrasonic aided lapping mechanism, it is found that the value and direction of grain movement speed will change due to the superimposition of ultrasonic vibration, which will lead to the change of cutting angles and further affect the lapping performance. Assuming every abrasive particle is a cutting insert, under the assistance of axial ultrasonic vibration, negative rake of the grain will increase, even change to positive value, so as to sharpen the lapping grains and benefit the lapping processing. Moreover, when ultrasonic vibration is superimposed to the lapping tool, motion locus of abrasive grains will present sinusoid. As a result, the locus of single grain may self-interfere in actual lapping process and make blank cutting. So the depth of cut of abrasive grain will increase under the same lapping pressure, leading to the increase of MRR under the same lapping conditions. Finally, a series of contrast lapping experiments were carried out and some lapping characteristics were researched. Experimental results show that ultrasonic vibration assistance can help to heighten material removal rate, smoothen the waveform of tangential force, reduce the average tangential force and improve surface quality. Ultrasonic aided lapping with fixed abrasive is a high efficiency and precision processing technology for engineering ceramics cylindrical part.

Comparative Study and Mathematical Modeling of Machining Parameters in Ultrasonic-Assisted EDM of AISI H13 Tool Steel by the Application of Workpiece Vibration

2010 ◽  
Vol 154-155 ◽  
pp. 1604-1613
Author(s):  
Mohammad Reza Shabgard ◽  
Babak Sadizadeh ◽  
Keivan Amini ◽  
Hamid Pourziaie
Keyword(s):  
Comparative Study ◽  
Ultrasonic Vibration ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Correct Selection ◽  
Machining Parameters ◽  
Machining Performance ◽  
Ultrasonic Assisted ◽  
Aisi H13

The correct selection of the machining parameters is one of the most significant issues to take into consideration in Ultrasonic-assisted Electrical Discharge Machining (US-EDM) and EDM processes. In the present work, a study has been made to develop and extract statistical models to show the relationship between important machining performance data (material removal rate (MRR), tool wear ratio (TWR) and surface roughness Ra) and the input machining parameters (pulse current, and pulse-on time) in the EDM and US-EDM of AISI H13. The models obtained were used to analyze the effects of input parameters on machining performance. In addition, a comparative study was carried out to investigate the effect of ultrasonic vibration of the workpiece on machining performance. The results show that Ultrasonic vibration of the workpiece can significantly reduce the inactive pulses and improves the stability of process. Also US-EDM is effective in attaining a high material removal rate (MRR) in finishing regime in comparison with conventional EDM. The results of Analysis of Variance (ANOVA) indicate that the proposed mathematical models can adequately explain the performance within the limits of the factors being studied.

Theoretical and Experimental Research on the Material Removal Rate in Ultrasonic Aided Lapping of ZTA Ceramic

2009 ◽  
Vol 76-78 ◽  
pp. 240-245
Author(s):  
Feng Jiao ◽  
Bo Zhao
Keyword(s):  
Material Removal ◽  
Production Efficiency ◽  
High Efficiency ◽  
Removal Rate ◽  
Processing Method ◽  
Ultrasonic Machining ◽  
Precision Engineering ◽  
Engineering Ceramic ◽  
Fixed Abrasive ◽  
Free Abrasive

Lower machining efficiency of traditional lapping with free abrasive restricts the enhancement of the precision parts’ production efficiency. It is necessary to improve lapping efficiency on the premise of guarantee of lapping quality. In this paper, a new ultrasonic aided lapping technology was developed by combining lapping technology and ultrasonic machining technology and a series of lapping experiments of ZTA engineering ceramic with and without ultrasonic assistance were carried out. The results of theoretical analysis and experimental study show that it is the ultrasonic assistance of the lapping tool that promotes the enhancement of lapping efficiency and the ultrasonic aided lapping technique with fixed abrasive can be regarded as a high efficiency processing method of the precision engineering ceramic part.

Study on the Mechanism of Engineering Ceramics in Rotary Ultrasonic-Vibration Grinding

2013 ◽  
Vol 372 ◽  
pp. 158-164
Author(s):  
Chang Chun Yu
Keyword(s):  
Fracture Mechanics ◽  
Ultrasonic Vibration ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Grinding Force ◽  
Paper Analysis ◽  
Engineering Ceramics

This paper analysis the process of Al2O3 engineering ceramics grinding and study the mechanism of rotary ultrasonic-vibration grinding. Then setting the model of the material removal rate and grinding force, which is based on Creasing fracture mechanics. Results indicate rotary ultrasonic-vibration grinding can apparently improve the material removal rate and cut down the grinding force.

Two Dimensional Ultrasonic Vibration Assisted Chemo-Mechanical Grinding of Si Wafer

2010 ◽  
Vol 126-128 ◽  
pp. 282-288
Author(s):  
Zhen Zhong Wang ◽  
Yong Bo Wu ◽  
Li Bo Zhou ◽  
Yin Biao Guo ◽  
Chen Xu Wu
Keyword(s):  
Ultrasonic Vibration ◽  
Material Removal ◽  
Removal Rate ◽  
Surface Damage ◽  
Vibration Modes ◽  
Two Dimensional ◽  
Mechanical Grinding ◽  
Grinding Method ◽  
Fixed Abrasive ◽  
Si Wafer

As a new fixed-abrasive machining method, chemo-mechanical grinding (CMG) is developed from chemical mechanical polishing (CMP), with the obvious advantage of geometric accuracy determinacy and no slurry. To improve material removal rate and enhance the popularity of CMG, this paper introduces a combined grinding method, i.e., two dimensional ultrasonic vibration assisted CMG (2D-UACMG). Si wafer is taken as the workpiece and the influence of ultrasonic vibration modes and process parameters on the surface roughness and the material removal is examined. The results show 2D-UACMG can obtain better surface quality with little surface damage at nanometer level compared with the conventional CMG without the ultrasonic vibration.

Investigation into Chemo-Mechanical Fixed Abrasive Polishing of Fused Silica with the Assistance of Ultrasonic Vibration

2012 ◽  
Vol 523-524 ◽  
pp. 155-160 ◽  
Author(s):  
Ya Guo Li ◽  
Yong Bo Wu ◽  
Li Bo Zhou ◽  
Hui Ru Guo ◽  
Jian Guo Cao ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Ultrasonic Vibration ◽  
Material Removal Rate ◽  
Material Removal ◽  
Optical Glass ◽  
Removal Rate ◽  
Fused Silica ◽  
Processing Efficiency ◽  
Machined Surface ◽  
Fixed Abrasive

Ultrasonic vibration assisted processing is well known for the improvement in machined surface quality and processing efficiency due to the reduced forces and tribology-generated heating when grinding hard-brittle materials. We transplanted this philosophy to chemo-mechanical fixed abrasive polishing of optical glass, namely fused silica, in an attempt to improve surface roughness and/or material removal rate. Experiments were conducted to elucidate the fundamental characteristics of chemo-mechanical fixed abrasive polishing of fused silica in the presence and absence of ultrasonic vibration on a setup with an in-house built gadget. The experimental results show that ultrasonic vibration assisted chemo-mechanical fixed abrasive polishing can yield increased material removal rate while maintaining the surface roughness of manufactured optics compared to conventional fixed abrasive polishing without ultrasonic vibration. The mechanism of material removal in fixed abrasive polishing was also delved. We found that the glass material is removed through the synergic effects of chemical and mechanical actions between abrasives and glass and the resultant grinding swarf contains ample Si element as well as Ce element, standing in stark contrast to the polisher that contains abundant Ce element and minor Si element.

Material Removal Rate Characteristics in Ultrasonic Aided Lapping of Engineering Ceramics Based on Single-Point Scratch

2008 ◽  
Vol 375-376 ◽  
pp. 263-267 ◽  
Author(s):  
Feng Jiao ◽  
Bo Zhao ◽  
Chuan Shao Liu ◽  
Xun Sheng Zhu
Keyword(s):  
Ultrasonic Vibration ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Single Point ◽  
Research Result ◽  
Ultrasonic Machining ◽  
Indentation Fracture ◽  
Engineering Ceramics ◽  
Fracture Theory

A new ultrasonic aided lapping technology was developed by combining lapping technology and ultrasonic machining technology. The appended special tangential ultrasonic vibration changes the material removal rate (MRR) characteristics. In order to clarify the influence of ultrasonic vibration, in this paper, the MRR models in ultrasonic aided single-point scratch were deduced based on indentation fracture theory. Through contrast scratching and lapping experiments, the MRR characteristics in ultrasonic aided lapping of engineering ceramics were presented. Research result shows that the MMR in ultrasonic aided lapping is larger than that in conventional lapping under the same conditions; with the increase of ultrasonic generator power and lapping pressure, the MMR in lapping increases correspondingly.

Modeling of High Efficiency Removal in the Grinding of Aluminal/ZrO2 Nanocomposites with the Aid of Two-Dimensional Ultrasonic Vibration

2007 ◽  
Vol 329 ◽  
pp. 451-458 ◽  
Author(s):  
Yan Wu ◽  
A.G. Sun ◽  
Bo Zhao ◽  
Xun Sheng Zhu
Keyword(s):  
Ultrasonic Vibration ◽  
Material Removal Rate ◽  
Material Removal ◽  
High Efficiency ◽  
Removal Rate ◽  
Abrasive Particle ◽  
Experimental Results ◽  
Two Dimensional ◽  
Conventional Grinding ◽  
Vibration Assistance

Based on the single abrasive particle motion locus of elliptical spiral in two-dimensional ultrasonic vibration grinding (WTDUVG), the theoretical model representing the material removal rate are deduced and verified, and the reason of high efficiency material removal by applying two-dimensional ultrasonic vibration is analyzed. Finally, experimental researches on material removal rate of ceramics were carried out using coarse grit diamond wheel both with and without workpiece two-dimensional ultrasonic vibration assistance grinding. Experimental results indicated that (1) Material removal rate (MRR) in vibration grinding process is about 1.5 times as large as that of in conventional grinding, the experimental results are in good agreement with the calculated ones. (2)The material removal rate increases along with increases of the grinding depth and workpiece velocity both in with and without vibration grinding. (3)The vibration grinding surface had no spur and build-up edge and its surface roughness was smaller than CG significantly. Surface quality of WTDUVG is superior to that of conventional grinding, it is easy for ultrasonic vibration grinding that material removal mechanism is ductile regime grinding.

Experimental Study on Removal Characteristics of Ceramic Materials in Ultrasonic Aided High Efficiency Lapping

2014 ◽  
Vol 1027 ◽  
pp. 123-126
Author(s):  
Chang Juan Zhang ◽  
Feng Jiao ◽  
Bo Zhao
Keyword(s):  
Experimental Study ◽  
Material Removal Rate ◽  
Material Removal ◽  
High Efficiency ◽  
Removal Rate ◽  
Ceramic Materials ◽  
Engineering Ceramics ◽  
Research Results

In order to clarify the material removal characteristics of Al2O3 engineering ceramics in ultrasonic aided high efficiency lapping, a series of ultrasonic and conventional lapping contrast experiments were carried out on precision lathe with self-made ultrasonic lapping device. The research results show that the value of material removal rate in ultrasonic aided lapping is about 2~4 times that in conventional lapping, especially in ultrasonic axial lapping. In ultrasonic aided lapping, the better removal characteristics can not be obtained by adopting too high or too low lapping parameters, and there are optimum lapping parameters from which a higher material removal rate value can be achieved.

Modeling of Material Removal in Workpiece Lateral Ultrasonic Vibration Grinding of Fine-Crystalline Zirconia Ceramics

2006 ◽  
Vol 315-316 ◽  
pp. 304-308 ◽  
Author(s):  
Yan Wu ◽  
Bo Zhao ◽  
Xun Sheng Zhu
Keyword(s):  
Surface Roughness ◽  
Ultrasonic Vibration ◽  
Material Removal ◽  
High Efficiency ◽  
Removal Rate ◽  
Average Diameter ◽  
Diamond Wheel ◽  
Movement Model ◽  
Ultrasonic Grinding ◽  
Conventional Grinding

Based on the grain movement model of ultrasonic grinding, models representing the grinding force of single abrasive and the material removal rate (MRR) are deduced and verified. Mechanism of high efficiency material removal in work lateral ultrasonic vibration grinding (WLUVG) was analyzed. The MRR of fine-crystalline ZrO2 ceramics in WLUVG and conventional grinding (CG) with diamond wheel were researched experimentally in this work. The effects on the MRR, the surface roughness and microstructure of the process parameters and the size of abrasive are measured. It has been concluded that: (1) the MRR in ultrasonic grinding process is two times as large as that of in CG. (2) any increase in the amount of energy imparted to the workpiece in terms of the average diameter of grains, grinding depth both in with and without ultrasonic grinding, will result in an increase in the MRR and the surfaces roughness. (3) the ultrasonic grinding surface had no spur and build-up edge and its surface roughness was smaller than CG significantly. Surface quality of vibration grinding is superior to that of CG, it is easy for ultrasonic vibration grinding that material removal mechanism is ductile mode grinding.

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