Effect of Solder Joint Thickness on Intermetallic Compound Growth Rate of Cu/Sn/Cu Solder Joints During Thermal Aging

2016 ◽  
Vol 138 (4) ◽  
Author(s):  
Yan Zhu ◽  
Fenglian Sun
Keyword(s):  
Growth Rate ◽  
Intermetallic Compound ◽  
Solder Joint ◽  
Aging Time ◽  
Thermal Aging ◽  
Solder Joints ◽  
Control Element ◽  
Joint Thickness ◽  
Intermetallic Compound Growth ◽  
Peak Value

The sandwich structure Cu/Sn/Cu solder joints with different thicknesses of the solder layers (δ) are fabricated using a reflow solder method. The microstructure and composition of the solder joints are observed and analyzed by scanning electron microscopy (SEM). Results show that the thickness of intermetallic compound (IMC) and Cu concentration in the solder layers increase with the decrease of δ after reflow. During thermal aging, the thickness of IMC does not increase according to the parabolic rule with the increase of aging time; the solder joint thickness affects markedly the growth rate of IMC layer. At the beginning of thermal aging, the growth rate of IMC in the thinner solder joints (δ ≤ 25 μm) is higher than that in the thicker ones (δ ≥ 30 μm). The growth rate of IMC (δ ≤ 25 μm) decreases in the thinner solder joints, while increases in the thicker solder joints (δ ≥ 40 μm) and is nearly invariable when the δ equals to 30 μm with aging time extending. The growth rate of IMC increases first and then decreases after reaching a peak value with the increase of δ in the later stage during aging. The main control element for IMC growth transfers from Cu to Sn with the reduction of size.

Microstructure Evolution of Sn-2.5Ag-2.0Ni Solder Joint with Various Ni Platings on SiCp/Al Composites

2010 ◽  
Vol 638-642 ◽  
pp. 3811-3818
Author(s):  
Mao Wu ◽  
Xin Bo He ◽  
Shu Bin Ren ◽  
Ming Li Qin ◽  
Xuan Hui Qu
Keyword(s):  
Growth Rate ◽  
Shear Strength ◽  
Intermetallic Compound ◽  
Solder Joint ◽  
Aging Time ◽  
Microstructure Evolution ◽  
Thermal Stresses ◽  
Solder Joints ◽  
Electroless Ni

A novel Sn-2.5Ag-2.0Ni alloy has been developed for soldering of SiCp/Al composites substrate with various types of Ni coatings. An investigation about electroplated Ni layer, electroless Ni-5 wt.% P, Ni-10wt.% P and Ni-B layers has been carried out. It is found that the solder joints possess a single intermetallic compound (IMC) Ni3Sn4, which coarsens with an increase in aging time. The formation of Ni2SnP has been observed to significantly affect the reliability of the solder joints. But the formation of Ni2SnP can be suppressed by lowering the P contents in as-deposited Ni coatings. It has been also found that the thermal stresses generated in solder joint increases with the decrease of P contents in Ni-P layer. Furthermore, the concentration of thermal stresses in the electroplated Ni solder joint is found to be higher than that in other three electroless Ni layers. Out of four as-deposited Ni coatings, the Ni-B layer exhibits good wettability with solder and low IMC growth rate during aging. Also, the shear strength of solder joint decreases with an increase in aging time and Ni-B solder joint demonstrates the highest shear strength after long term aging.

Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint

2015 ◽  
Vol 27 (1) ◽  
pp. 52-58 ◽  
Author(s):  
Peter K. Bernasko ◽  
Sabuj Mallik ◽  
G. Takyi
Keyword(s):  
Shear Strength ◽  
Intermetallic Compound ◽  
Solder Joint ◽  
Layer Thickness ◽  
Solder Joints ◽  
Ageing Time ◽  
Circuit Board ◽  
Intermetallic Compound Layer ◽  
Content Type ◽  
Surface Mount

Purpose – The purpose of this paper is to study the effect of intermetallic compound (IMC) layer thickness on the shear strength of surface-mount component 1206 chip resistor solder joints. Design/methodology/approach – To evaluate the shear strength and IMC thickness of the 1206 chip resistor solder joints, the test vehicles were conventionally reflowed for 480 seconds at a peak temperature of 240°C at different isothermal ageing times of 100, 200 and 300 hours. A cross-sectional study was conducted on the reflowed and aged 1206 chip resistor solder joints. The shear strength of the solder joints aged at 100, 200 and 300 hours was measured using a shear tester (Dage-4000PXY bond tester). Findings – It was found that the growth of IMC layer thickness increases as the ageing time increases at a constant temperature of 175°C, which resulted in a reduction of solder joint strength due to its brittle nature. It was also found that the shear strength of the reflowed 1206 chip resistor solder joint was higher than the aged joints. Moreover, it was revealed that the shear strength of the 1206 resistor solder joints aged at 100, 200 and 300 hours was influenced by the ageing reaction times. The results also indicate that an increase in ageing time and temperature does not have much influence on the formation and growth of Kirkendall voids. Research limitations/implications – A proper correlation between shear strength and fracture mode is required. Practical implications – The IMC thickness can be used to predict the shear strength of the component/printed circuit board pad solder joint. Originality/value – The shear strength of the 1206 chip resistor solder joint is a function of ageing time and temperature (°C). Therefore, it is vital to consider the shear strength of the surface-mount chip component in high-temperature electronics.

Isothermal Aging Affect to the Growth of Sn-Cu-Ni-1 wt.% TiO2 Composite Solder Paste

2016 ◽  
Vol 700 ◽  
pp. 123-131 ◽  
Author(s):  
Rita Mohd Said ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Mohd Nazree Derman ◽  
Mohd Izrul Izwan Ramli ◽  
Norhayanti Mohd Nasir ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Solder Joint ◽  
Aging Time ◽  
Isothermal Aging ◽  
Composite Solder ◽  
Solder Paste ◽  
Cu Substrate ◽  
Interfacial Imcs ◽  
Planar Shape ◽  
Interfacial Intermetallic Compound

This work investigated the effects of 1.0 wt. % TiO2 particles addition into Sn-Cu-Ni solder paste to the growth of the interfacial intermetallic compound (IMC) on Cu substrate after isothermal aging. Sn-Cu-Ni solder paste with TiO2 particles were mechanically mixed to fabricate the composite solder paste. The composite solder paste then reflowed in the reflow oven to form solder joint. The reflowed samples were then isothermally aged 75, 125 and 150 ° C for 24 and 240 h. It was found that the morphology of IMCs changed from scallop-shape to a more uniform planar shape in both Sn-Cu-Ni/Cu joints and Sn-Cu-Ni-TiO2 /Cu joint. Cu6Sn5 and Cu3Sn IMC were identified and grew after prolong aging time and temperature. The IMCs thickness and scallop diameter of composite solder paste were reduced and the growth of IMCs thickness after isothermal aging become slower as compared to unreinforced Sn-Cu-Ni solder paste. It is suggested that TiO2 particles have influenced the evolution and retarded the growth of interfacial IMCs.

Solderability and Interfacial Intermetallic Compound (IMC) Growth of Sn-Cu-Ni Solder with Additions of Germanium

2016 ◽  
Vol 857 ◽  
pp. 8-12
Author(s):  
Fatin Afeeqa Mohd Sobri ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Che Mohd Ruzaidi Ghazali ◽  
Pavithiran Narayanan
Keyword(s):  
Intermetallic Compound ◽  
Aging Time ◽  
Thermal Aging ◽  
Maximum Force ◽  
Wetting Time ◽  
Interfacial Intermetallic Compound

The wettability of Sn-Cu-Ni with Germanium (Ge) additions of 0 ppm, 10 ppm, 60 ppm, 100 ppm and 200 ppm were investigated with Gen3 machine. The range of the wettability shows the lowest and the highest reading of wetting time and maximum force. Three different conditions were investigated which consist of as soldered, reflowed and aged. Further interfacial IMC observation was done for 0 ppm and 60 ppm of Ge to investigate the growth of interfacial IMC after thermal aging. From the measurement, the thickness of IMC for 0 ppm Ge is 2.075μm, 3.936μm and 4.502μm with aging time at 24,120 and 240 hours respectively. While for 60 ppm Ge, the IMC thickness are much lower with 1.8μm, 3.11μm and 4.154μm at the same aging time with 0ppm Ge. The results indicate that 60 ppm of Ge in Sn-Cu-Ni has the lowest wetting time, higher maximum force and slow IMC growth.

Cracking of the Intermetallic Compound Layer in Solder Joints Under Drop Impact Loading

2011 ◽  
Vol 133 (3) ◽  
Author(s):  
Tong An ◽  
Fei Qin
Keyword(s):  
Intermetallic Compound ◽  
Solder Joint ◽  
Impact Loading ◽  
Driving Force ◽  
Solder Joints ◽  
Compound Layer ◽  
Drop Impact ◽  
Lead Free ◽  
Intermetallic Compound Layer ◽  
Crack Driving Force

The significant difference between failure modes of lead-containing and lead-free solder joints under drop impact loading remains to be not well understood. In this paper, we propose a feasible finite element approach to model the cracking behavior of solder joints under drop impact loading. In the approach, the intermetallic compound layer/solder bulk interface is modeled by the cohesive zone model, and the crack driving force in the intermetallic compound layer is evaluated by computing the energy release rate. The numerical simulation of a board level package under drop impact loading shows that, for the lead-containing Sn37Pb solder joint, the damage in the vicinity of the intermetallic compound layer initiates earlier and is much greater than that in the lead-free Sn3.5Ag solder joint. This damage relieves the stress in the intermetallic compound layer and reduces the crack driving force in it and consequently alleviates the risk of the intermetallic compound layer fracturing.

Effect of Thermal Aging on the Interfacial of Sn-Zn and Sn-Zn-Bi Solders Joint on Cu Substrate

2016 ◽  
Vol 700 ◽  
pp. 113-122 ◽  
Author(s):  
Mohd Noor Ervina Efzan ◽  
Mohd Mustafa Al Bakri Abdullah
Keyword(s):  
Solder Joint ◽  
Aging Time ◽  
Thermal Aging ◽  
Intermetallic Layer ◽  
Cu Substrate

In this paper, the effect of thermal aging to the Sn-Zn and Sn-Zn-Bi solders on Cu substrate was studied. Sn-Zn was chosen and the effect of addition of Bi was investigated in this work. In this research, Sn-9Zn and Sn-6Zn-4Bi were subjected to thermal aging for 24h, 72h, 120h at 75°C and 100°C respectively. Both solder shown increased of thickness intermetallic layer with increasing time. However, Sn-9Zn recorded higher increment of intermetallic layer compared to Sn-6Zn-4Bi. The hardness of solder joint on Cu substrate was decreased for both solders with increasing aging time.

Effect of Sb Addition on Microstructure and Shear Strength of Sn-Ag Solder Joints

2004 ◽  
Vol 261-263 ◽  
pp. 501-506 ◽  
Author(s):  
H.T. Lee ◽  
C.L. Yang ◽  
Ming He Chen ◽  
C.S. Li
Keyword(s):  
Mechanical Properties ◽  
Growth Rate ◽  
Shear Strength ◽  
Intermetallic Compound ◽  
Solder Joints ◽  
Thermal Storage ◽  
Experimental Results ◽  
Storage Test ◽  
Ag3sn Phase ◽  
Epma Analysis

The effect of Sb addition on microstructure, intermetallic compound (IMC) and mechanical properties of Sn-Ag solder joints is investigated. The compositions of selected solders are Sn2.58Ag, Sn2.82Ag1.75Sb, Sn2.87Ag4.75Sb and Sn2.7Ag8.78Sb. Experimental results show that most of the added Sb are solved in -Sn matrix, and the rest react with the Ag3Sn to form Ag3(Sb,Sn) phase, which contributes to suppress the coarsening of Ag3Sn phase. SbSn phase can be observed in β-Sn matrix as the Sb addition exceeds 4.75% and remains stable during the thermal storage test. The solder microhardness increases with increasing Sb. And the growth rate of interfacial IMC layer decreases as Sb addition increases. EPMA analysis indicates there are some Sb diffusing into the interfacial IMC layer. Shear strength of solder joints are raised by adding Sb. The shear strength by as-soldered condition are 27.8MPa (0%Sb), 29MPa (1.75%Sb), 30.4MPa (4.75%Sb) and 43.4MPa (8.78%Sb) respectively

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