Controlled Wetting in Nanoporous Membranes for Thin Film Evaporation

2016 ◽  
Vol 138 (8) ◽  
Author(s):  
Kyle L. Wilke ◽  
Banafsheh Barabadi ◽  
TieJun Zhang ◽  
Evelyn N. Wang

With the ever increasing cooling demands of advanced electronics, thin film evaporation has emerged as one of the most promising thermal management solutions. High heat transfer rates can be achieved in thin films of liquids due to a small conduction resistance through the film to the evaporating interface. In thin film evaporation, maintaining a stable liquid film to attain high evaporation rates is challenging. We investigated nanoporous anodic aluminum oxide (AAO) membranes to supply liquid to the evaporating surface via capillarity. In this work, we achieved enhanced experimental control via the creation of a hydrophobic section within the nanopore. By creating a non-wetting section, the liquid is confined within the membrane to a region of well-controlled geometry. This non-wetting section also prevents flooding, where the formation of a thick liquid film degrades device performance. When heat flux is applied to the membrane surface, the liquid wicks into the membrane from the bottom and becomes pinned at the onset of the hydrophobic layer. As a result, the wetting in the membrane is controlled, flooding is prevented, and a stable evaporating surface in achieved. With this approach, thin film evaporation from nanoporous media can now be studied for varying parameters such as pore size, porosity, and location of the meniscus within the pore.

Author(s):  
Rong Xiao ◽  
Kuang-Han Chu ◽  
Evelyn N. Wang

The heat generation rates of high performance electronics motivate the development of new thermal management solutions. Thin film evaporation with a jet impingement or spray system promise high heat fluxes up to 1000 W/cm2 with low thermal resistances. However, challenges with implementation currently limit the ability to reach the theoretical limits. In this work, we investigated the utilization of micro-/nanostructured surfaces to control the liquid film thickness and provide a sufficient liquid flow rate to achieve high heat removal rates. We developed a model to predict the propagation rates of the liquid film, which accounted for the curvature of the liquid meniscus. We also fabricated test devices with pillar diameters ranging from 500 nm to 10 μm, spacings of 3.5 μm to 10 μm, and heights of 5 μm to 15 μm, and validated the model with confocal microscopy and high speed imaging. Heaters and temperature sensors were also integrated onto the back side of the chip to investigate heat transfer performance. When heat was applied, the structures significantly enhanced the heat dissipation rates and reduced the thermal resistance. The heat dissipation rate was also found to be positively correlated to the propagation rate of the liquid film. However, surface fouling in the experiments led to challenges to maintain a stable liquid film, and decreased the heat removal capability. This work provides insights to designing micro-/nanostructured surfaces for thin film evaporation to meet the heat dissipation demands of future high performance electronic systems.


Author(s):  
Rong Xiao ◽  
Shalabh C. Maroo ◽  
Evelyn N. Wang

Recent advancements in integrated circuits demand the development of novel thermal management schemes that can dissipate ultra-high heat fluxes with high heat transfer coefficients. Previous study demonstrated the potential of thin film evaporation on micro/nanostructured surfaces [1–11]. Theoretical calculations indicate that heat transfer coefficients on the order of 106 W/m2K and heat fluxes of 105 W/cm2 can be achievable with water [1, 5–6]. However, in previous experimental setup, the coolant has to propagate across the surface which limits the increase in heat flux and the heat transfer coefficient, while adding complexity to the system design. This work aims to decouple the propagation of the coolant from the evaporation process through a novel experimental configuration. Thin nanoporous membranes of 13 mm diameter were used where a metal layer was deposited on the top surface to serve as a resistance heater. Liquid was supplied from the bottom of the membrane, driven through the nanopores by capillary force, and evaporated from the top surface. Heat transfer coefficient over 104 W/m2K was obtained with isopropyl alcohol (IPA) as the coolant, which is only two orders of magnitude smaller than the theoretical limit. This work offers insights into optimal experimental designs towards achieving kinetic limits of heat transfer for thin film evaporation based thermal management solutions.


Author(s):  
Rong Xiao ◽  
Evelyn N. Wang

The increasing performance of integrated chips has introduced a growing demand for new thermal management technologies. While various thermal management schemes have been studied, thin film evaporation promises high heat dissipation rates (1000 W/cm2) with low thermal resistances. However, methods to form a thin liquid film including jet impingement and sprays have challenges associated with achieving the desired film thickness. In this work, we investigated novel microstructures to control the thickness of the thin film where the liquid is driven by capillarity. Micropillar arrays with diameters ranging from 2 μm to 10 μm, spacings between pillars ranging from 5 μm to 10 μm, and heights of 4.36 μm were studied. A semi-analytical model was developed to predict the propagation rate of the liquid film, which was validated with experiments. The heat transfer performance was investigated on the micropillar arrays with microfabricated heaters and temperature sensors. The behavior of the thin liquid film under varying heat fluxes was studied. This work demonstrates the potential of micro- and nanostructures to dissipate high heat fluxes via thin film evaporation.


2013 ◽  
Vol 102 (12) ◽  
pp. 123103 ◽  
Author(s):  
Rong Xiao ◽  
Shalabh C. Maroo ◽  
Evelyn N. Wang

Author(s):  
Hani H. Sait ◽  
Steve M. Demsky ◽  
HongBin Ma

An analytical model describing thin film evaporation is developed that includes the effects of surface tension, frictional shear stress, wetting characteristics and disjoining pressure. The effects of thermal conductivity of working fluids and operating temperature on the evaporating thin film region are also studied. The results indicate that when the thermal conductivity of the working fluid increases, a high heat flux can be removed from the evaporating thin film region. The operating temperature affects the thin film evaporation. The higher the operating temperature, the more heat flux can be removed from the region. The information of thin film evaporation presented in the paper results in a better understanding of heat transfer mechanism occurring in micro heat pipes.


Author(s):  
Zhengmao Lu ◽  
Shankar Narayanan ◽  
Daniel Hanks ◽  
Rishi Raj ◽  
Rong Xiao ◽  
...  

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