Derivation and Validation of a Figure of Merit for Loop Heat Pipes With Medium Temperature Working Fluids

2016 ◽  
Vol 138 (5) ◽  
Author(s):  
Wukchul Joung ◽  
Jinho Lee ◽  
Sanghyun Lee ◽  
Joohyun Lee
Keyword(s):  
Steady State ◽  
Thermal Performance ◽  
Figure Of Merit ◽  
Saturation Pressure ◽  
Heat Pipes ◽  
Working Fluid ◽  
Medium Temperature ◽  
Working Fluids ◽  
Loop Heat Pipes ◽  
Compensation Chamber

The working fluids of loop heat pipes (LHPs) play an important role in the operation of the LHPs by influencing the operating temperatures and the heat transfer limits. Therefore, the proper selection of a working fluid is a key practice in LHP fabrication, and there has been a high demand for an appropriate index that enables the quantitative comparison of the steady-state thermal performance of the working fluids. In this work, a figure of merit for LHPs was theoretically derived and experimentally verified. In particular, the pressure losses in the LHP operation were balanced with the saturation pressure difference between the evaporator and the compensation chamber to derive the figure of merit. This derived figure of merit for LHPs successfully predicted the steady-state thermal performance of the tested working fluids within the variable conductance regime. In the constant conductance regime, the differences in the condenser cooling capacity and in the liquid subcooling for different working fluids determined the thermal performance of each working fluid. The limitations and prospects of the proposed figure of merit were discussed in detail.

Steady State Parametric Modeling of Non-Conventional Loop Heat Pipes

2013 ◽  
Author(s):  
Karthik S. Remella ◽  
Frank M. Gerner ◽  
Ahmed Shuja
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Steady State ◽  
Transfer Coefficient ◽  
Thermal Energy ◽  
Heat Pipes ◽  
Parametric Model ◽  
Parametric Modeling ◽  
Working Fluid ◽  
Loop Heat Pipes

Loop Heat Pipes (LHPs) are used in many thermal management applications, especially for micro-electronics cooling, because of their ability to passively transport thermal energy from a source to a sink. This paper describes the development of a parametric model for a non-conventional LHP operating in steady state, employed to cool Light Emitting Diodes (LEDs). This device is comprised of a flat evaporator, and a finned circular loop wherein condensation and sub-cooling of the working fluid takes place. Unlike a conventional LHP, this device has no compensation chamber. In the mesh screen of the evaporator, the vapor flow entrains liquid and hence the quality of the two-phase mixture leaving the evaporator (xevap) is less than unity (unlike in a conventional LHP where saturated vapor leaves the evaporator). Since this lower quality (approximately 0.2) results in a smaller ratio of latent energy to sensible energy being removed by the condenser and sub-cooler respectively; the ratio of the length of the sub-cooler to condenser length is significantly larger. This results in more stable and controlled operation of the device. Mathematical models of the evaporator, the condenser and the sub-cooler sections are developed, and two closure conditions are employed in this model. For consistency and accuracy, some parameters in the model, such as the natural convection heat transfer coefficient (h o) and a few thermal resistances in the evaporator, are estimated empirically from test data on the device. The empirically obtained value of the heat transfer coefficient is in very good agreement with correlations from the literature. The parametric model accurately predicts the LED board temperature and other temperatures for a specific amount of thermal energy dissipated by the LEDs.

Steady State Numerical Modeling of Non-Conventional Loop Heat Pipes (LHPs)

2012 ◽  
Author(s):  
Karthik S. Remella ◽  
Frank M. Gerner ◽  
Ahmed Shuja ◽  
Praveen Medis
Keyword(s):  
Heat Transfer ◽  
Steady State ◽  
Single Phase ◽  
Heat Pipes ◽  
Working Fluid ◽  
Vapor Interface ◽  
Loop Heat Pipes ◽  
Led Array ◽  
Fill Volume ◽  
Liquid Vapor

Loop heat pipes (LHPs) transport energy from an evaporator to a condenser in the form of latent heat. In conventional LHPs, the vapor pressure is significantly higher than the liquid pressure across the liquid-vapor interface due to the small pores and the corresponding capillary forces in the wick. This large pressure difference transports the single phase vapor after evaporation from the evaporator to the condenser and once the vapor is condensed, a single phase liquid from the condenser back to the evaporator. This current work involves the development of a steady state design model of the LHP system consisting of a planar evaporator package and a finned copper tube loop, which serves as an air-cooled condenser. Although evaporation due to the heat transfer creates the pressure in the vapor which drives the flow, contrasting to the conventional loop heat pipes, the pressure drop across the liquid-vapor interface is much smaller. A positive hydrostatic head is applied to the liquid above the wick and there is entrainment of liquid from the wick in the evaporator. Therefore, the fluid flow leaving the evaporator package is a two-phase flow, assumed to be saturated liquid and saturated vapor in equilibrium. The primary objective of this non-conventional LHP device is to remove the thermal energy dissipated from a Light Emitting Diode (LED) array. A major portion of this energy causes evaporation of the working fluid within the wick. The remaining energy reheats the liquid in both the liquid return line and within the evaporator package. The evaporator package is modeled as a one-dimensional thermal resistance network and these resistances are empirically determined from experiments. It is found that the convective heat transfer co-efficient of air plays a pivotal role in the heat dissipation and hence, is empirically determined in this work. This value is fairly agreeable with the Nusselt number correlation on the air side developed by Hahne et al. [1]. A mass balance relates the fill volume with the length of the condenser. The temperatures within the LHP are predicted by applying the principle of conservation of energy over the evaporator, the condenser and the sub-cooler sections of the heat exchanger loop. Finally, this LHP model predicts an approximate fill volume necessary for the LHP to operate properly.

Minimizing the Wick Thickness in a Planar Microscale Loop Heat Pipe Using Efficient Thermodynamic Design

2011 ◽  
Author(s):  
Navdeep S. Dhillon ◽  
Jim C. Cheng ◽  
Albert P. Pisano
Keyword(s):  
Heat Flow ◽  
Heat Pipe ◽  
Thermal Characteristics ◽  
Heat Pipes ◽  
Working Fluid ◽  
Loop Heat Pipe ◽  
Two Phase ◽  
Loop Heat Pipes ◽  
Evaporator Section ◽  
Compensation Chamber

Theoretical and numerical thermodynamic analysis of the evaporator section of a planar microscale loop heat pipe is presented, to minimize the permissible wick thickness in such a device. In conventional cylindrical loop heat pipes, a minimum wick thickness is required in order to reduce parasitic heat flow, and prevent vapor leakage, into the compensation chamber. By taking advantage of the possibilities allowed by microfabrication techniques, a planar evaporator/compensation chamber design topology is proposed to overcome this limitation, which will enable wafer-based loop heat pipes with device thicknesses on the order of a millimeter or less. Thermodynamic principles governing two-phase flow of the working fluid in a loop heat pipe are analyzed to elucidate the fundamental requirements that would characterize the startup and steady state operation of a planar phase-change device. A three dimensional finite element thermal-fluid solver is implemented to study the thermal characteristics of the evaporator section and compensation chamber regions of a planar vertically wicking micro-columnated loop heat pipe. The use of in-plane thermal conduction barriers to reduce parasitic heat flow into the compensation chamber is demonstrated.

scholarly journals Experimental Study on Thermal Performance of a Loop Heat Pipe with Different Working Wick Materials

Energies ◽  
2021 ◽  
Vol 14 (9) ◽  
pp. 2453
Author(s):  
Kyaw Zin Htoo ◽  
Phuoc Hien Huynh ◽  
Keishi Kariya ◽  
Akio Miyara
Keyword(s):  
Stainless Steel ◽  
Heat Pipes ◽  
Working Fluid ◽  
Stable Operation ◽  
Loop Heat Pipe ◽  
Heater Surface ◽  
Loop Heat Pipes ◽  
Limited Temperature ◽  
Sintered Stainless Steel ◽  
Continuous Heat

In loop heat pipes (LHPs), wick materials and their structures are important in achieving continuous heat transfer with a favorable distribution of the working fluid. This article introduces the characteristics of loop heat pipes with different wicks: (i) sintered stainless steel and (ii) ceramic. The evaporator has a flat-rectangular assembly under gravity-assisted conditions. Water was used as a working fluid, and the performance of the LHP was analyzed in terms of temperatures at different locations of the LHP and thermal resistance. As to the results, a stable operation can be maintained in the range of 50 to 520 W for the LHP with the stainless-steel wick, matching the desired limited temperature for electronics of 85 °C at the heater surface at 350 W (129.6 kW·m−2). Results using the ceramic wick showed that a heater surface temperature of below 85 °C could be obtained when operating at 54 W (20 kW·m−2).

scholarly journals Literature review: Steady-state modelling of loop heat pipes

2015 ◽  
Vol 75 ◽  
pp. 709-723 ◽  
Author(s):  
Benjamin Siedel ◽  
Valérie Sartre ◽  
Frédéric Lefèvre
Keyword(s):  
Steady State ◽  
Literature Review ◽  
Heat Pipes ◽  
Loop Heat Pipes

How to improve the thermal performance of pulsating heat pipes: A review on working fluid

2018 ◽  
Vol 91 ◽  
pp. 630-638 ◽  
Author(s):  
Mohammad Alhuyi Nazari ◽  
Mohammad H. Ahmadi ◽  
Roghayeh Ghasempour ◽  
Mohammad Behshad Shafii
Keyword(s):  
Thermal Performance ◽  
Heat Pipes ◽  
Working Fluid

Effects of Surface Coating of Nanoparticles on Thermal Performance of Open Loop Pulsating Heat Pipes

2012 ◽  
Author(s):  
Mehdi Taslimifar ◽  
Maziar Mohammadi ◽  
Ali Adibnia ◽  
Hossein Afshin ◽  
Mohammad Hassan Saidi ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Heat Transfer ◽  
Heat Pipe ◽  
Thermal Performance ◽  
Surface Coating ◽  
Heat Pipes ◽  
Open Loop ◽  
Working Fluid ◽  
Pulsating Heat Pipe ◽  
Performance Of Heat Transfer

Homogenous dispersing of nanoparticles in a base fluid is an excellent way to increase the thermal performance of heat transfer devices especially Heat Pipes (HPs). As a wickless, cheap and efficient heat pipe, Pulsating Heat Pipes (PHPs) are important candidates for thermal application considerations. In the present research an Open Loop Pulsating Heat Pipe (OLPHP) is fabricated and tested experimentally. The effects of working fluid namely, water, Silica Coated ferrofluid (SC ferrofluid), and ferrofluid without surface coating of nanoparticles (ferrofluid), charging ratio, heat input, and application of magnetic field on the overall thermal performance of the OLPHPs are investigated. Experimental results show that ferrofluid has better heat transport capability relative to SC ferrofluid. Furthermore, application of magnetic field improves the heat transfer performance of OLPHPs charged with both ferrofluids.

A Comprehensive Experimental Investigation of the Performance of Closed-Loop Pulsating Heat Pipes

2017 ◽  
Vol 139 (9) ◽  
Author(s):  
M. Halimi ◽  
A. Abbas Nejad ◽  
M. Norouzi
Keyword(s):  
Thermal Resistance ◽  
Flow Regime ◽  
Thermal Performance ◽  
Closed Loop ◽  
Heat Pipes ◽  
Filling Ratio ◽  
Working Fluid ◽  
Physical Parameters ◽  
Two Phase ◽  
Laboratory Conditions

Closed-loop pulsating heat pipes (CLPHPs) are a new type of two-phase heat transfer devices that can transfer considerable heat in a small space via two-phase vapor and liquid pulsating flow and work with various types of two-phase instabilities so the operating mechanism of CLPHP is not well understood. In this work, two CLPHPs, made of Pyrex, were manufactured to observe and investigate the flow regime that occurs during the operation of CLPHP and thermal performance of the device under different laboratory conditions. In general, various working fluids were used in filling ratios of 40%, 50%, and 60% in horizontal and vertical modes to investigate the effect of thermo-physical parameters, filling ratio, nanoparticles, gravity, CLPHP structure, and input heat flux on the thermal performance of CLPHP. The results indicate that three types of flow regime may be observed given laboratory conditions. Each flow regime exerts a different effect on the thermal performance of the device. There is an optimal filling ratio for each working fluid. The increased number of turns in CLPHP generally improves the thermal performance of the system reducing the effect of the type of the working fluid on the aforementioned performance. The adoption of copper nanoparticles, which positively affect fluid motion, decreases the thermal resistance of the system as much as 6.06–42.76% depending on laboratory conditions. Moreover, gravity brings about positive changes in the flow regime decreasing thermal resistance as much as 32.13–52.58%.

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