Mechanics Design for Stretchable, High Areal Coverage GaAs Solar Module on an Ultrathin Substrate

2014 ◽  
Vol 81 (12) ◽  
Author(s):  
Xiaoting Shi ◽  
Renxiao Xu ◽  
Yuhang Li ◽  
Yihui Zhang ◽  
Zhigang Ren ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
System Level ◽  
Stretchable Electronics ◽  
Element Analysis ◽  
Solar Module ◽  
Strain Isolation ◽  
Areal Coverage

The trench design of substrate together with curvy interconnect formed from buckling provides a solution to stretchable electronics with high areal coverage on an ultrathin substrate, which are critically important for stretchable photovoltaics. In this paper, an improved trench design is proposed and verified by finite element analysis (FEA), through use of a heterogeneous design, to facilitate strain isolation and avoid possible fracture/delamination issue. A serpentine design of interconnect is also devised to offer ∼440% interconnect level stretchability, which is >3.5 times that of previous trench design, and could transform into 20% system-level stretchability, even for areal coverage as high as ∼90%.

scholarly journals Finite Element Analysis of System-Level Electronic Packages for Space Applications

2015 ◽  
Vol 2015 ◽  
pp. 1-9
Author(s):  
Adrien Lambert ◽  
Ahsan Mian ◽  
Justin Hogan ◽  
Todd Kaiser ◽  
Brock LaMeres
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Cooling System ◽  
System Level ◽  
Primary System ◽  
Electronic Systems ◽  
Element Analysis ◽  
Space Applications ◽  
Flight Operations ◽  
Radiation Sensor

Thermal analysis was required in order to aid in the design and testing of a radiation tolerant computing (RTC) system using a radiation sensor. During development of the system, different test beds were employed in order to characterize the radiation sensor and its supporting electronic systems. The most common preliminary tests are high altitude balloon tests which allow the sensor to experience cosmic radiation at high altitudes, consistent with space flight operations. In this study, finite element analysis (FEA) was used to evaluate primary system architecture, system support structures, and the flight payload in order to determine if the system would survive preliminary and future testing. ANSYS FEA software was used to create thermal models which accurately simulated convective cooling, system heat generation, and solar radiation loading on the exterior of the payload. The results of the models were then used to optimize payload PC board (PCB) design to ensure that the internal electronic systems would be within acceptable operating temperatures.

scholarly journals Hybrid Simulation Approach on MEMS Piezoresistive Microcantilever Sensor for Biosensing Applications

2009 ◽  
Vol 74 ◽  
pp. 283-286 ◽  
Author(s):  
Rosminazuin A. Rahim ◽  
Badariah Bais ◽  
Burhanuddin Yeop Majlis
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Circuit Simulation ◽  
Hybrid Simulation ◽  
Optimal Performance ◽  
System Level ◽  
Simulation Approach ◽  
Element Analysis ◽  
System Level Simulation ◽  
Stress Changes

This paper uses a hybrid simulation approach in CoventorWare design environment which combines finite element analysis and circuit simulation modeling to obtain the optimal performance of piezoresistive microcantilever sensor. A 250 μm x 100 μm x 1 μm SiO2 cantilever integrated with 0.2 μm thick Si piezoresistor were used in this study. A finite element analysis on piezoresistive microcantilever sensor was conducted in CoventorWare Analyzer environment which incorporates MemMech and MemPZR modules. The sensor sensitivity was obtained by measuring resistivity changes in piezoresistive material in response to surface stress changes of microcantilever. The simulation results were later integrated with system-level simulation solver called Architect to enable the optimization of the sensor circuit output. It involves a hybrid approach which uniquely combined FEM analysis and piezoresistive modeling using circuit simulation environment which results in optimal performance of MEMS piezoresistive microcantilever sensor.

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