Comparison of Electronic Component Durability Under Uniaxial and Multiaxial Random Vibrations

2014 ◽  
Vol 137 (1) ◽  
Author(s):  
Matthew Ernst ◽  
Ed Habtour ◽  
Abhijit Dasgupta ◽  
Michael Pohland ◽  
Mark Robeson ◽  
...  
Keyword(s):  
Degrees Of Freedom ◽  
Failure Modes ◽  
Accumulation Rate ◽  
Center Of Mass ◽  
Dynamic Environment ◽  
Test Method ◽  
Printed Wiring Board ◽  
Uniaxial Testing ◽  
Out Of Plane ◽  
Wiring Board

Multiaxial and uniaxial vibration experiments were conducted in order to study the differences in failure modes and fatigue life for the two types of excitation. An electrodynamic (ED) shaker capable of controlled vibration in six degrees of freedom (DOF) was employed for the experiments. The test specimen consisted of six large inductors insertion mounted on a printed wiring board (PWB). Average damage accumulation rate (DAR) in the inductor leads was measured for random excitations in-plane, out-of-plane, and both directions simultaneously. Under simultaneous multiaxial excitation, the average DAR was found to be 2.2 times greater than the sum of the in-plane and out-of-plane DARs. The conclusion was that multiple-step sequential uniaxial testing may significantly overestimate the durability of large/heavy structures with high center of mass in a multiaxial dynamic environment. Additionally, a test method utilizing uniaxial vibration along a direction other than the principal directions of the structure was examined. This method was found to have significant limitations, but showed better agreement with simultaneous multiaxial vibration experiments.

Warpage Measurement Using Projection Moire´ System and Two Automatic Image Segmentation Algorithms

2007 ◽  
Author(s):  
Wei Tan ◽  
I. Charles Ume
Keyword(s):  
Image Segmentation ◽  
Electronic Packages ◽  
Printed Wiring Board ◽  
Segmentation Algorithms ◽  
Out Of Plane ◽  
Cte Mismatch ◽  
Image Models ◽  
Wiring Board ◽  
Plane Displacement ◽  
Projection Moire

Out-of-plane displacement (warpage) has been a major reliability concern for board-level electronic packaging. Printed wiring board (PWB) and component warpage results from CTE mismatch among the materials that make up the PWB assembly (PWBA). Warpage occurring during surface-mount assembly reflow processes and normal operations may lead to serious reliability problems. In this paper, a projection moire´ warpage measurement system and two types of automatic image segmentation algorithms were presented. In order to use the projection moire´ technique to separately determine the warpage of a PWB and assembled electronic packages in a PWBA, two image segmentation algorithms based on mask image models and active contour models (snakes) were developed. They were used to detect package locations in a PWBA displacement image generated by the projection moire´ system. The performances of the mask image and snake approaches based on their resolutions, processing rates, and measurement efficiencies were evaluated in this research. Real-time composite Hermite surface models were constructed to estimate the PWB warpage values underneath the electronic packages. The above automatic image segmentation algorithms were integrated with the projection moire´ system to accurately evaluate the warpage of PWBs and assembled chip packages individually.

Characterization and Modeling of Printed Wiring Board Warpage and its Effect on LGA Separable Interconnects

2004 ◽  
Vol 127 (2) ◽  
pp. 178-184 ◽  
Author(s):  
J. Cepeda-Rizo ◽  
Hsien-Yang Yeh ◽  
N. Teneketges
Keyword(s):  
Printed Wiring Board ◽  
Out Of Plane ◽  
Mechanical Fastening ◽  
Laminate Theory ◽  
Wiring Board ◽  
Plane Displacement

The paper presents a study on printed wiring board (PWB) warpage caused by the mechanical fastening of separable interconnects, known as land grid array (LGA) package assemblies. Out-of-plane displacement of the PWB were measured and characterized, as well as force-per-pin values of the LGA, and correlations were made between the two. Classical laminate theory was utilized to describe the warpage behavior of the assembly and a model was presented to solve the out-of-plane displacements. An overall assessment of the assembly was made and compared to the mechanical specification of the LGA.

scholarly journals Test Method Development and Determination of Three-Dimensional Strength and Failure Modes of Polyvinyl Chloride Structural Foams

2017 ◽  
Vol 139 (3) ◽  
Author(s):  
Akira Miyase ◽  
Su Su Wang
Keyword(s):  
Polyvinyl Chloride ◽  
Failure Modes ◽  
Test Methods ◽  
Shear Loading ◽  
Test Method ◽  
Damage And Failure ◽  
Out Of Plane ◽  
Loading Modes ◽  
Structural Foams

A comprehensive study has been conducted to develop proper test methods for accurate determination of failure strengths along different material directions of closed-cell polymer-based structural foams under different loading modes. The test methods developed are used to evaluate strengths and failure modes of commonly used H80 polyvinyl chloride (PVC) foam. The foam's out-of-plane anisotropic and in-plane isotropic cell microstructures are considered in the test methodology development. The effect of test specimen geometry on compressive deformation and failure properties is addressed, especially the aspect ratio of the specimen gauge section. Foam nonlinear constitutive relationships, strength and failure modes along both in-plane and out-of-plane (rise) directions are obtained in different loading modes. Experimental results reveal strong transversely isotropic characteristics of foam microstructure and strength properties. Compressive damage initiation and progression prior to failure are investigated in an incremental loading–unloading experiment. To evaluate foam in-plane and out-of-plane shear strengths, a scaled shear test method is also developed. Shear loading and unloading experiments are carried out to identify the causes of observed large shear damage and failure modes. The complex damage and failure modes in H80 PVC foam under different loading modes are examined, both macroscopically and microscopically.

Case Studies of Brittle Interfacial Failures in Area Array Solder Interconnects

2000 ◽  
Author(s):  
George M. Wenger ◽  
Richard J. Coyle ◽  
Patrick P. Solan ◽  
John K. Dorey ◽  
Courtney V. Dodd ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Case Studies ◽  
Failure Modes ◽  
Electroless Nickel ◽  
Electrical Performance ◽  
Printed Wiring Board ◽  
Solder Interconnects ◽  
Area Array ◽  
Surface Finishes ◽  
Soldering Reaction

Abstract A common pad finish on area array (BGA or CSP) packages and printed wiring board (PWB) substrates is Ni/Au, using either electrolytic or electroless deposition processes. Although both Ni/Au processes provide flat, solderable surface finishes, there are an increasing number of applications of the electroless nickel/immersion gold (ENi/IAu) surface finish in response to requirements for increased density and electrical performance. This increasing usage continues despite mounting evidence that Ni/Au causes or contributes to catastrophic, brittle, interfacial solder joint fractures. These brittle, interfacial fractures occur early in service or can be generated under a variety of laboratory testing conditions including thermal cycling (premature failures), isothermal aging (high temperature storage), and mechanical testing. There are major initiatives by electronics industry consortia as well as research by individual companies to eliminate these fracture phenomena. Despite these efforts, interfacial fractures associated with Ni/Au surface finishes continue to be reported and specific failure mechanisms and root cause of these failures remains under investigation. Failure analysis techniques and methodologies are crucial to advancing the understanding of these phenomena. In this study, the scope of the fracture problem is illustrated using three failure analysis case studies of brittle interfacial fractures in area array solder interconnects. Two distinct failure modes are associated with Ni/Au surface finishes. In both modes, the fracture surfaces appear to be relatively flat with little evidence of plastic deformation. Detailed metallography, scanning electron microscopy (SEM), energy dispersive x-ray analysis (EDX), and an understanding of the metallurgy of the soldering reaction are required to avoid misinterpreting the failure modes.

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