A Coupled Electromagnetic and Thermal Model for Picosecond and Nanometer Scale Plasmonic Lithography Process

2014 ◽  
Vol 2 (3) ◽  
Author(s):  
Ion-Hong Chao ◽  
Liang Pan ◽  
Cheng Sun ◽  
Xiang Zhang ◽  
Adrienne S. Lavine

Plasmonic lithography may become a mainstream nanofabrication technique in the future. Experimental results show that feature size with 22 nm resolution can be achieved by plasmonic lithography. In the experiment, a plasmonic lens (PL) is used to focus the laser energy with resolution much higher than the diffraction limit and features are created in the thermally sensitive phase-change material (PCM) layer. The energy transport mechanisms are still not fully understood in the lithography process. In order to predict the lithography resolution and explore the energy transport mechanisms involved in the process, customized electromagnetic wave (EMW) and heat transfer (HT) models were developed in comsol. Parametric studies on both operating parameters and material properties were performed to optimize the lithography process. The parametric studies show that the lithography process can be improved by either reducing the thickness of the phase-change material layer or using a material with smaller real refractive index for that layer.

Author(s):  
Ion-Hong Chao ◽  
Liang Pan ◽  
Cheng Sun ◽  
Xiang Zhang ◽  
Adrienne S. Lavine

Plasmonic lithography may become a mainstream nano-fabrication technique in the future. Experimental results show that feature size with 22 nm resolution can be achieved by plasmonic lithography. In the experiment, a plasmonic lens is used to focus the laser energy with resolution much higher than the diffraction limit and features are created in the thermally sensitive phase change material layer. The energy transport mechanisms are still not fully understood in the lithography process. In order to predict the lithography resolution and explore the energy transport mechanisms involved in the process, customized electromagnetic wave and heat transfer models are developed in COMSOL. Parametric studies on both operating parameters and material properties are performed for optimizing the lithography process. Parametric studies show that the lithography process can be improved by either reducing the thickness of the phase change material layer or using a material with smaller real refractive index for that layer.


Energy ◽  
2016 ◽  
Vol 106 ◽  
pp. 63-72 ◽  
Author(s):  
P. Zhang ◽  
Z.W. Ma ◽  
Z.Y. Bai ◽  
J. Ye

2008 ◽  
Author(s):  
Mustapha Faraji ◽  
Hamid El Qarnia

The aim of the present work is to study the thermal performance of a hybrid heat sink used for cooling management of protruding substrate-mounted electronic chips. The power generated in electronic chips is dissipated in phase change material (PCM n-ecosane with melting temperature Tm = 36°C) that filled a rectangular enclosure. The advantage of using this cooling strategy is that the PCMs are able to absorb a high amount of heat generated by electronic component (EC) without acting the fan, during the charging process (melting of the PCM). A (2D) mathematical model was developed in order to analyze and optimize a heat sink. The governing equations for masse, momentum and energy transport were developed and discretised by using the volume control approach. The resulting algebraic equations were next solved iteratively by using TDMA algorithm. Numerical investigations were conducted in order to optimize the thermal performance of the heat sink. The optimization involves determination of the key parameters of the heat sink that maximize the time required by the base of the electronic component to reach a critical temperature.


2019 ◽  
Vol 123 (48) ◽  
pp. 29192-29202 ◽  
Author(s):  
Hari Krishna Chilukoti ◽  
Tianhang Zhou ◽  
Vikram Reddy Ardham ◽  
Michael C. Böhm ◽  
Florian Müller-Plathe

2012 ◽  
Vol 557-559 ◽  
pp. 1436-1439
Author(s):  
Yan Lai Zhang ◽  
Lei Luo ◽  
Shao Zheng Wu ◽  
Zhao Zhang ◽  
Chang Qian Li ◽  
...  

The microencapsulated phase change material is a kind of functional material with latent heat. It may be used applied heat storage and energy transport systems. Methods of the microcapsule production and four kinds of production process are introduced.


2018 ◽  
Vol 49 (6) ◽  
pp. 509-528 ◽  
Author(s):  
Orawan Aumporn ◽  
Belkacem Zeghmati ◽  
Xavier Chesneau ◽  
Serm Janjai

Sign in / Sign up

Export Citation Format

Share Document