Fabrication of Centimeter Long, Ultra-Low Aspect Ratio Nanochannel Networks in Borosilicate Glass Substrates

Author(s):  
Marie Pinti ◽  
Tanuja Kambham ◽  
Bowen Wang ◽  
Shaurya Prakash

Nanofluidic devices have a broad range of applications resulting from the dominance of surface-fluid interactions. Examples include molecular gating, sample preconcentration, and sample injection. Manipulation of small fluid samples is ideal for micro total analysis systems or lab on chip devices which perform multiple unit operations on a single chip. In this paper, fabrication procedures for two different ultra-low aspect ratio (ULAR) channel network designs are presented. The ULAR provides increased throughput compared to higher aspect ratio features with the same critical dimensions. Channel network designs allow for integration between microscale and nanoscale fluidic networks. A modified calcium assisted glass–glass bonding procedure was developed to fabricate chemically uniform, all glass nanochannels. A polydimethylsiloxane (PDMS)-glass adhesive bonding procedure was also developed as adhesive bonding allows for more robust fabrication with lower sensitivity to surface defects. The fabrication schemes presented allow for a broad array of available parameters for facile selection of device fabrication techniques depending on desired applications for lab on chip devices.

Proceedings ◽  
2018 ◽  
Vol 2 (13) ◽  
pp. 1018
Author(s):  
Giuseppe Fiorentino ◽  
Ben Jones ◽  
Sophie Roth ◽  
Edith Grac ◽  
Murali Jayapala ◽  
...  

A composite, capillary-driven microfluidic system suitable for transmitted light microscopy of cells (e.g., red and white human blood cells) is fabricated and demonstrated. The microfluidic system consists of a microchannels network fabricated in a photo-patternable adhesive polymer on a quartz substrate, which, by means of adhesive bonding, is then connected to a silicon microfluidic die (for processing of the biological sample) and quartz die (to form the imaging chamber). The entire bonding process makes use of a very low temperature budget (200 °C). In this demonstrator, the silicon die consists of microfluidic channels with transition structures to allow conveyance of fluid utilizing capillary forces from the polymer channels to the silicon channels and back to the polymer channels. Compared to existing devices, this fully integrated platform combines on the same substrate silicon microfluidic capabilities with optical system analysis, representing a portable and versatile lab-on-chip device.


Author(s):  
Marie Pinti ◽  
Shaurya Prakash

Hybrid microfluidic and nanofluidic devices have a variety of applications including water desalination, molecular gates and DNA sieving among several other lab-on-chip uses. Most microfluidic and nanofluidic devices currently are fabricated in glass, silicon, polydimethylsiloxane (PDMS), or with a combination of these materials. In order to impart functionality, metals, polymers or auxiliary components are often integrated with these devices. Ultra-low aspect ratio channels have several advantages including critical dimensions on the nanoscale but increased throughput compared to higher aspect ratio channels with the same critical dimension, which is important for applications where a higher volumetric flow rate is desired. Additionally, theoretical analysis is significantly easier as ultra-low aspect ratio channels can be modeled as 1-D systems. The fabrication methods for achieving low aspect ratios (< 0.005) usually require extensive facilities with several innovative fabrication and bonding schemes being previously reported. In this paper, we report on fabrication and bonding of ultra-low aspect ratio microfluidic and nanofluidic devices with aspect ratios at 0.0005 in glass/PDMS devices in contrast to the previous best reported result of 0.005 achieved in a silica device using stamp and stick PDMS bonding. The simplicity of our approach presents a new pathway to achieving the lowest aspect ratio nanochannels ever reported for channels fabricated using an interfacial layer for bonding. Centimeter long nanochannels on a borosilicate substrate were fabricated by standard UV photolithography followed by wet etching. Surface roughness of the fabricated channels is on the same order as the roughness of the initial substrate (2–3 nm) and therefore can enable fabrication of channels with critical dimensions approaching 15 nm or less. Devices were then bonded using a second borosilicate substrate with a thin PDMS adhesion layer (∼ 2 μm). The PDMS adhesion layer allows rapid, facile, and alignment-free bonding compared to traditional fusion or anodic bonds. Successful verification of device operation and functionality was determined by verifying flow in operational devices and with scanning electron microscopy to confirm bonding for the formation of nanochannels.


Author(s):  
Marie Pinti ◽  
Shaurya Prakash

Hybrid microfluidic and nanofluidic devices have recently been developed for a variety of applications including water desalination, molecular gates, and other lab-on-chip uses. In this paper, we report on a 2-step wet etch process to fabricate hybrid microfluidic and nanofluidic devices with controllable features including a sloped nanochannel. The nanochannels with slit-like geometry can be fabricated with dimensions as small as 50 nm depth and a width of 30 μm for a minimum aspect ratio of 0.002. The channels are several cm long.


2018 ◽  
Vol 22 (10) ◽  
Author(s):  
Samir Mekkaoui ◽  
Damien Le Roy ◽  
Marie-Charlotte Audry ◽  
Joël Lachambre ◽  
Véronique Dupuis ◽  
...  

Author(s):  
S. Yegnasubramanian ◽  
V.C. Kannan ◽  
R. Dutto ◽  
P.J. Sakach

Recent developments in the fabrication of high performance GaAs devices impose crucial requirements of low resistance ohmic contacts with excellent contact properties such as, thermal stability, contact resistivity, contact depth, Schottky barrier height etc. The nature of the interface plays an important role in the stability of the contacts due to problems associated with interdiffusion and compound formation at the interface during device fabrication. Contacts of pure metal thin films on GaAs are not desirable due to the presence of the native oxide and surface defects at the interface. Nickel has been used as a contact metal on GaAs and has been found to be reactive at low temperatures. Formation Of Ni2 GaAs at 200 - 350C is reported and is found to grow epitaxially on (001) and on (111) GaAs, but is shown to be unstable at 450C. This paper reports the investigations carried out to understand the microstructure, nature of the interface and composition of sputter deposited and annealed (at different temperatures) Ni-Sb ohmic contacts on GaAs by TEM. Attempts were made to correlate the electrical properties of the films such as the sheet resistance and contact resistance, with the microstructure. The observations are corroborated by Scanning Auger Microprobe (SAM) investigations.


2012 ◽  
Vol 132 (7) ◽  
pp. 567-573
Author(s):  
Hitoshi Tanaka ◽  
Shota Omi ◽  
Jun Katsuma ◽  
Yurie Yamamoto ◽  
Masaki Uchida ◽  
...  

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