Variation of the Expansion Coefficient of Nanofluids With Temperature: A Correction for Conductivity Data

2012 ◽  
Vol 3 (4) ◽  
Author(s):  
Efstathios E. Michaelides
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Conductivity Data ◽  
Volumetric Fraction ◽  
Solid Materials ◽  
Strong Function ◽  
Temperature Changes ◽  
Thermal Expansion Coefficients ◽  
High Thermal Expansion ◽  
Expansion Coefficients

The two constituent phases of the nanofluids have thermal expansion coefficients that are significantly different. Moreover, the variability of the thermal expansion coefficients of fluids with temperature is significantly higher than that of solid materials. The mismatch of the thermal expansion coefficients creates changes of the volumetric fraction of solids with temperature changes. The changes can be significant with fluids that have high thermal expansion coefficients, such as refrigerants and fluids that operate close to their critical points. Since the thermal conductivity of nanofluids is a very strong function of the volumetric fraction of the nanoparticles, these changes of the volumetric fraction may cause significant effects on the thermal conductivity of the nanofluids, which must be accounted for in any design process.

Novel Silicon-Elastomers for Advanced Soft Lithography

2006 ◽  
Vol 947 ◽  
Author(s):  
Kyung Choi
Keyword(s):  
Thermal Expansion ◽  
High Resolution ◽  
Soft Lithography ◽  
Materials Properties ◽  
Nano Scale ◽  
Thermal Expansion Coefficients ◽  
High Thermal Expansion ◽  
Expansion Coefficients

ABSTRACTHigh resolution pattern transfers in the nano-scale regime have been considerable challenges in ‘soft lithography’ to achieve nanodevices with enhanced performances. In this technology, the resolution of pattern integrations is significantly rely on the materials' properties of polydimethylsiloxane (PDMS) stamps. Since commercial PDMS stamps have shown limitations in nano-scale resolution soft lithography due to their low physical toughness and high thermal expansion coefficients, we developed stiffer, photocured PDMS silicon elastomers designed, specifically for nano-sized soft lithography and photopatternable nanofabrications.

Preparation and Characterization of Thermally Compatible Leucite-Reinforced Dental Ceramics

2011 ◽  
Vol 308-310 ◽  
pp. 311-314
Author(s):  
Jin Wen ◽  
Shu Zhen Sun
Keyword(s):  
Thermal Expansion ◽  
Dental Ceramics ◽  
Dental Porcelain ◽  
Thermal Expansion Coefficients ◽  
High Thermal Expansion ◽  
Coprecipitation Technique ◽  
Thermal Compatibility ◽  
The Common ◽  
Expansion Coefficients

The high average thermal expansion required for thermal compatibility of dental porcelain with their substrate alloy is supplied by the mineral leucite (KAlSi2O6). In the research, the high thermal expansion coefficients phase leucite was prepared by coprecipitation technique. Three materials with formulae of K2O∶Al2O3∶SiO2= 1∶1∶x ( x=1.4, 2.0, 4.0 ) were investigated for differences in phase, thermal expansion. Unstoichiometric composition where K2O and Al2O3were added properly is advantage to leucite obtained. Coprecipitation processing produced fine leucite powder that would sinter at 1300°C, this temperature is about 200°C lower than of melting method. The average thermal expansion coefficients of leucite is 22.7×10-6/°Cfrom room temperature to 620°C,which is higher than the common porcelain. Changing in the leucite content of dental porcelain would results from thermal expansion coefficients of porcelain variation, which could be responsible for changes in porcelain-metal thermal compatibility.

Measurements of Thermal Properties of Gaskets for the Design of Bolted Flange Joints Under Thermal Conduction Conditions

2006 ◽  
Author(s):  
Takahiro Ohmura ◽  
Kanji Hanashima ◽  
Junichi Nyumura ◽  
Toshiyuki Sawa
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Thermal Properties ◽  
Effective Thermal Conductivity ◽  
Linear Thermal Expansion ◽  
Absolute Temperature ◽  
Thermal Expansion Coefficients ◽  
Expansion Coefficients ◽  
Bolted Flange ◽  
The Relationship

In this study, the thermal properties of the gaskets, which were used for designing the bolted flange joints, such as effective thermal conductivity, specific heat, linear thermal expansion coefficient and so on were measured. Especially, the effective thermal conductivities were measured by using the heat flow method. The relationship between the gasket structure and the thickness was shown by using an equivalent thermal resistance, and an empirical equation of effective thermal conductivity, which was related to the bulk density and absolute temperature, was proposed by deriving the heat conduction in solid, radiation and gas. Also, in the measurement of the linear thermal expansion coefficients of the gaskets, the measured values were shown to change substantially below 150 °C, and to depend on the heating rate and the load applied on the gasket sample.

Thermophysical Properties of Gd2O3 Doped SrHfO3 Ceramic

2015 ◽  
Vol 816 ◽  
pp. 237-241 ◽  
Author(s):  
Wen Ma ◽  
Yi Ren ◽  
Xi Long Jin ◽  
Ya Hong Liang ◽  
Bao Dong Chen ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Phase Transitions ◽  
High Temperature ◽  
Solid State ◽  
Solid State Reaction Method ◽  
Reaction Method ◽  
Long Period ◽  
Thermal Expansion Coefficients ◽  
Expansion Coefficients

Gd2O3 (10mol%) doped SrHfO3 (Sr (Hf0.9Gd0.1)O2.95) was synthesized by solid state reaction method. The phase stability of the synthesized Sr (Hf0.9Gd0.1)O2.95 powder at high temperature of 1450 oC for a long period and in a temperature range of RT-1400 oC was characterized by XRD and DSC, respectively. The thermal expansion coefficients (TECs) of bulk Sr (Hf0.9Gd0.1)O2.95 were recorded by a high-temperature dilatometer, indicating that the phase transitions of SrHfO3 are suppressed remarkably by doping Gd2O3. The thermal conductivity of bulk Sr (Hf0.9Gd0.1)O2.95 at 1000 oC is ~1.95 W/m·K, which is ~11% lower than that of bulk 8YSZ.

scholarly journals Infrared receptors in pyrophilous (“fire loving”) insects as model for new un-cooled infrared sensors

2011 ◽  
Vol 2 ◽  
pp. 186-197 ◽  
Author(s):  
David Klocke ◽  
Anke Schmitz ◽  
Helmut Soltner ◽  
Herbert Bousack ◽  
Helmut Schmitz
Keyword(s):  
Forest Fires ◽  
Pressure Increase ◽  
Organic Liquids ◽  
Infrared Sensors ◽  
Ir Radiation ◽  
Temperature Changes ◽  
Thermal Expansion Coefficients ◽  
Analytical Formulas ◽  
High Thermal Expansion ◽  
Expansion Coefficients

Beetles of the genus Melanophila and certain flat bugs of the genus Aradus actually approach forest fires. For the detection of fires and of hot surfaces the pyrophilous species of both genera have developed infrared (IR) receptors, which have developed from common hair mechanoreceptors. Thus, this type of insect IR receptor has been termed photomechanic and shows the following two special features: (i) The formation of a complex cuticular sphere consisting of an outer exocuticular shell as well as of a cavernous microfluidic core and (ii) the enclosure of the dendritic tip of the mechanosensitive neuron inside the core in a liquid-filled chamber. Most probably a photomechanic IR sensillum acts as a microfluidic converter of infrared radiation which leads to an increase in internal pressure inside the sphere, which is measured by a mechanosensitive neuron. A simple model for this biological IR sensor is a modified Golay sensor in which the gas has been replaced by a liquid. Here, the absorbed IR radiation results in a pressure increase of the liquid and the deflection of a thin membrane. For the evaluation of this model analytical formulas are presented, which permits the calculation of the pressure increase in the cavity, the deformation of the membrane and the time constant of an artificial leak to compensate ambient temperature changes. Some organic liquids with high thermal expansion coefficients may improve the deflection of the membrane compared to water.

scholarly journals Polytope Sector-Based Synthesis and Analysis of Microarchitectured Materials With Tunable Thermal Conductivity and Expansion

2015 ◽  
Author(s):  
Jonathan B. Hopkins ◽  
Howon Lee ◽  
Nicholas X. Fang ◽  
Christopher M. Spadaccini
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Material Property ◽  
Analytical Methods ◽  
Positive Zero ◽  
Bulk Property ◽  
Thermal Expansion Coefficients ◽  
Expansion Coefficients ◽  
Projection Microstereolithography ◽  
2D And 3D

The aim of this paper is to (1) introduce an approach, called Polytope Sector-based Synthesis, for synthesizing 2D or 3D microstructural architectures that exhibit a desired bulk-property directionality (e.g., isotropic, cubic, orthotropic, etc.), and (2) provide general analytical methods that can be used to rapidly optimize the geometric parameters of these architectures such that they achieve a desired combination of bulk thermal conductivity and thermal expansion properties. Although the methods introduced can be applied to general beam-based microstructural architectures, we demonstrate their utility in the context of an architecture that can be tuned to achieve a large range of extreme thermal expansion coefficients — positive, zero, and negative. The material-property-combination region that can be achieved by this architecture is determined within an Ashby-material-property plot of thermal expansion vs. thermal conductivity using the analytical methods introduced. Both 2D and 3D versions of the design have been fabricated using projection microstereolithography.

scholarly journals Construction of visual 3-D fabric reinforced composite thermal performance prediction system

2019 ◽  
Vol 23 (5 Part A) ◽  
pp. 2857-2865 ◽  
Author(s):  
Shaofei Wu
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Thermal Performance ◽  
Performance Prediction ◽  
Volume Fraction ◽  
Theoretical Research ◽  
Prediction System ◽  
Reinforced Composites ◽  
Thermal Expansion Coefficients ◽  
Expansion Coefficients

In view of the construction of a visualized 3-D thermal performance prediction system for fabric reinforced composites, the thermal constants analyzer was used to analyze and compare the thermal conductivity of the 3-D fabric reinforced composites by experimental methods, such as fiber volume fraction, internal braiding angle, and different yarn reduction methods and fabric structures. The factors influencing the thermal conductivity of 3-D fabric reinforced composites were studied, and the principle of thermal conductivity was analyzed. The thermal expansion coefficients of 3-D fabric reinforced composites in X- and Y-directions are one order of magnitude smaller than those in Z-directions. When aramid fabric is used as reinforcement, the composites with negative thermal expansion coefficients can be designed. The research results provide the necessary basis for the design, application and theoretical research of the 3-D fabric reinforced composites in heat conduction. Through the research of this paper, it lays a foundation for the process selection, performance design and structure optimization of this kind of material, and promotes the further application of 3-D braided composites.

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