High Heat Flux With Small Scale Monodisperse Sprays

2012 ◽  
Vol 134 (12) ◽  
Author(s):  
Sergio Escobar-Vargas ◽  
Jorge E. Gonzalez ◽  
Drazen Fabris ◽  
Ratnesh Sharma ◽  
Cullen Bash
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Film Thickness ◽  
Liquid Film ◽  
Heat Dissipation ◽  
High Heat ◽  
Heat Fluxes ◽  
Liquid Film Thickness ◽  
Small Scale ◽  
High Heat Flux

This work is aimed at cooling small surfaces (1.3 mm × 2 mm and 3 mm × 5 mm) using spray from thermal ink jet (TIJ) atomizers. Particular interests in this work include obtaining heat fluxes near the critical heat flux (CHF), understanding the correlation between the heat dissipation efficiency (η) and the liquid film thickness (δ) through experimental data, and understanding the primary mode of heat transfer on spray cooling at different liquid film thickness. Current experimental results indicate that high heat fluxes (∼4 × 107 W/m2) are obtained for controlled conditions of cooling mass flow rate, higher efficiencies are achieved at smaller liquid film thickness (δ ≈ 5 μm → η ≈ 0.9), and the heat transfer by conduction through the film becomes dominant as δ decreases.

Heat Transfer Enhancement in Compact Phase Change Microchannel Heat Exchangers for High Flux Laser Diodes

2018 ◽  
Author(s):  
Jensen Hoke ◽  
Todd Bandhauer ◽  
Jack Kotovsky ◽  
Julie Hamilton ◽  
Paul Fontejon
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Phase Change ◽  
Flow Boiling ◽  
Laser Diodes ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Maximum Heat ◽  
Average Maximum

Liquid-vapor phase change heat transfer in microchannels offers a number of significant advantages for thermal management of high heat flux laser diodes, including reduced flow rates and near constant temperature heat rejection. Modern laser diode bars can produce waste heat loads >1 kW cm−2, and prior studies show that microchannel flow boiling heat transfer at these heat fluxes is possible in very compact heat exchanger geometries. This paper describes further performance improvements through area enhancement of microchannels using a pyramid etching scheme that increases heat transfer area by ∼40% over straight walled channels, which works to promote heat spreading and suppress dry-out phenomenon when exposed to high heat fluxes. The device is constructed from a reactive ion etched silicon wafer bonded to borosilicate to allow flow visualization. The silicon layer is etched to contain an inlet and outlet manifold and a plurality of 40μm wide, 200μm deep, 2mm long channels separated by 40μm wide fins. 15μm wide 150μm long restrictions are placed at the inlet of each channel to promote uniform flow rate in each channel as well as flow stability in each channel. In the area enhanced parts either a 3μm or 6μm sawtooth pattern was etched vertically into the walls, which were also scalloped along the flow path with the a 3μm periodicity. The experimental results showed that the 6μm area-enhanced device increased the average maximum heat flux at the heater to 1.26 kW cm2 using R134a, which compares favorably to a maximum of 0.95 kw cm2 dissipated by the plain walled test section. The 3μm area enhanced test sections, which dissipated a maximum of 1.02 kW cm2 showed only a modest increase in performance over the plain walled test sections. Both area enhancement schemes delayed the onset of critical heat flux to higher heat inputs.

A Mathematical Modeling Method for Capillary Limit of Micro Heat Pipe with Sintered Wick

2011 ◽  
Vol 175 ◽  
pp. 335-341
Author(s):  
Xi Bing Li ◽  
Chang Long Yang ◽  
Gong Di Xu ◽  
Wen Yuan ◽  
Shi Gang Wang
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Pipe ◽  
Heat Dissipation ◽  
High Heat ◽  
Experimental Investigations ◽  
High Heat Flux ◽  
Micro Heat Pipe ◽  
Copper Powders ◽  
Capillary Limit

With heat flux increasing and cooling space decreasing in microelectronic and chemical products, micro heat pipe has become an ideal heat dissipation device in high heat-flux products. Through the analysis of its working principle, the factors that affect its heat transfer limits and the patterns in which copper powders are arrayed in circular cavity, this paper first established a mathematical model for the crucial factors in affecting heat transfer limits in a circular micro heat pipe with a sintered wick, i.e. a theoretical model for capillary limit, and then verified its validity through experimental investigations. The study lays a powerful theoretical foundation for designing and manufacturing circular micro heat pipes with sintered wicks.

Cooling of a Heated Surface by Mist Flow

1994 ◽  
Vol 116 (1) ◽  
pp. 167-172 ◽  
Author(s):  
S. L. Lee ◽  
Z. H. Yang ◽  
Y. Hsyua
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Liquid Film ◽  
Heated Surface ◽  
High Heat ◽  
Dynamic Interaction ◽  
High Heat Flux ◽  
Steady Temperature ◽  
Mist Flow ◽  
High Level

Cooling requirements in modern industrial applications, such as the removal of heat from electronic equipments, often demand the simultaneous attainment of a high heat flux and a low and relatively uniform and steady temperature of the heated surface to be cooled. The conventional single-phase convection cooling obviously cannot be expected to function adequately, since the heat flux there is directly proportional to the temperature difference between the heated surface and the surrounding medium. To maintain a high heat flux, the temperature of the heated surface usually must be kept at a high level. An attractive alternative is cooling by a spray, which takes advantage of the significant latent heat of evaporation of the liquid. However, in conventional industrial spray coolings, such as in the case of the cooling tower of a power plant, the temperature of the heated surface usually remains relatively high and is nonuniform and unsteady containing numerous flashy hot spots. In order to optimize the performance of the spray cooling of a heated surface by a mist flow, a clear understanding is required of (1) the dynamic interaction between the droplets and the carrier fluid and (2) the thermal reception of the droplets at the heated surface. It is the dynamic interaction between the phases that is causing the droplets to deposit onto the heated surface. The thermal reception at the heated wall develops mass and heat transfer leading to the mode of cooling of the heated surface. In the present study, an experimental investigation was made of the combination of the dynamic depositional behavior of droplets in a water droplet-air mist flow with the use of a specially designed particle-sizing two-dimensional laser-Doppler anemometer. Also, the heat transfer characteristics at the heated surface were investigated in relation to droplet deposition on the heated surface for wide ranges of droplet size, droplet concentration, mist flow velocity, and heat flux. It was discovered that over a certain suitable range of combination of these parameters, a superbly effective cooling scheme could be established by the evaporation on the outside surface of an ultrathin liquid film. Such a film was formed on the heated surface by the continuous deposition of fine droplets from the mist flow. Under these conditions, the heat flux is primarily related to the evaporation of the ultrathin liquid film on the heated surface and thus depends less on the temperature difference between the heated surf ace and the ambient mist flow. The heated surface is quenched to a low, relatively uniform and steady temperature at a very high level of heat flux. Heat transfer enhancement as high as seven times has been found so far. This effective heat transfer scheme is here termed mist cooling.

Heat Transfer and Hydraulic Characteristics of Cooling Water in a Flat Plate Heat Sink for High Heat Flux IGBT

2016 ◽  
Author(s):  
Chang-Nian Chen ◽  
Ji-Tian Han ◽  
Wei-Ping Gong ◽  
Tien-Chien Jen
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Flat Plate ◽  
Heat Sink ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Hydraulic Characteristics ◽  
Flow Rates ◽  
Plate Heat

High heat flux is very dangerous for electronic heat transfer, such as IGBT (Insulated Gate Bipolar Transistor) cooling. In order to explore and master the heat transfer and hydraulic characteristics for IGBT cooling, experiments have been carried out to study the situation mentioned above in a flat plate heat sink, which was designed for high heat flux IGBT cooling. The geometrical parameters of the test section are as follows: outline dimension 229 mm × 124 mm × 30 mm; flow channels of 229 mm × 3 mm × 4 mm in total of 20. The experiments performed at atmospheric pressure and with inlet temperatures of 25–35°C, heat fluxes of 3.5–18.9 kW/m2. The influence of temperatures, heat fluxes on IGBT surface temperature and the cooling effect of the liquid cold plate have been investigated under a range of flow rates of 280–2300 kg/m2s. It was found that the heat transfer enhancement was very obvious using this kind of small sized channel for IGBT cooling, which was tens of times of the effect than air cooling or triple of the effect than that in normal sized channels. And the heat transfer enhancement increases with increasing heat fluxes and flow rates, while it decreases with increasing inlet temperatures. Most of the experimental results show good cooling effect as expected. However, it is dangerous for the cooling system under high heat fluxes when the system starts or stops suddenly, when the Respond Time (RT) is less than 5 seconds to cut off heated power. Also, the cooling performance is bad when the heat fluxes increased greatly, which is considered as abnormal situation in operating. The effect on IGBT surface temperature of heat flux is more obvious when the average Nusselt Number is smaller. For hydraulic characteristics observed, it was found that the flow friction increased with flow rates increasing, but the pressure drops of heated flow channels ahead were slightly larger than those back, especially under large flow rates conditions. That is because the temperatures of flow heated in channels ahead are lower than those back, which causes the fluid viscosity to be higher. At last, this paper suggested a series of method for enhancing heat transfer in flat plate heat sink, and also gave some ways to avoid heat transfer dangerous situations for IGBT cooling, which can provide a basis for thermodynamic and hydraulic calculation of flat plate heat sink design and lectotype.

scholarly journals Analytical Solutions of Heat Transfer and Film Thickness with Slip Condition Effect in Thin-Film Evaporation for Two-Phase Flow in Microchannel

2015 ◽  
Vol 2015 ◽  
pp. 1-15 ◽  
Author(s):  
Ahmed Jassim Shkarah ◽  
Mohd Yusoff Bin Sulaiman ◽  
Md. Razali bin Hj Ayob
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Film Thickness ◽  
Liquid Film ◽  
Two Phase Flow ◽  
Current Model ◽  
Liquid Film Thickness ◽  
Phase Flow ◽  
Two Phase ◽  
Analytical Results

Physical and mathematical model has been developed to predict the two-phase flow and heat transfer in a microchannel with evaporative heat transfer. Sample solutions to the model were obtained for both analytical analysis and numerical analysis. It is assumed that the capillary pressure is neglected (Morris, 2003). Results are provided for liquid film thickness, total heat flux, and evaporating heat flux distribution. In addition to the sample calculations that were used to illustrate the transport characteristics, computations based on the current model were performed to generate results for comparisons with the analytical results of Wang et al. (2008) and Wayner Jr. et al. (1976). The calculated results from the current model match closely with those of analytical results of Wang et al. (2008) and Wayner Jr. et al. (1976). This work will lead to a better understanding of heat transfer and fluid flow occurring in the evaporating film region and develop an analytical equation for evaporating liquid film thickness.

Prediction of Refrigerant Flow Boiling Hysteresis With an Augmented Separated-Flow Model

2016 ◽  
Author(s):  
Jianwei Gao ◽  
Hongxia Li ◽  
Saif Almheiri ◽  
TieJun Zhang
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Surface Temperature ◽  
Flow Model ◽  
Flow Boiling ◽  
Separated Flow ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Boiling Hysteresis

Thermal management is essential to compact devices particularly for high heat flux removal applications. As a popular thermal technology, refrigeration cooling is able to provide relatively high heat flux removal capability and uniform device surface temperature. In a refrigeration cycle, the performance of evaporator is extremely important to the overall cooling efficiency. In a well-designed evaporator, effective flow boiling heat transfer can be achieved whereas the critical heat flux (CHF) or dryout condition must be avoided. Otherwise the device surface temperature would rise significantly and cause device burnout due to the poor heat transfer performance of film boiling. In order to evaluate the influence of varying imposed heat fluxes, saturated flow boiling in the evaporator is systematically studied. The complete refrigerant flow boiling hysteresis between the imposed heat flux and the exit wall superheat is characterized. Upon the occurrence of CHF at the evaporator wall exit, the wall heat flux redistributes due to the axial wall heat conduction, which drives the dryout point to propagate upstream in the evaporator. As a result, a significant amount of thermal energy is stored in the evaporator wall. While the heat flux starts decreasing, the dryout point moves downstream and closer to the exit. The stored heat in the wall dissipates slowly and leads to the delay in rewetting or quenching, which is the key to understand and predict the flow boiling hysteresis. In order to reveal the transient heat releasing mechanism, an augmented separated-flow model is developed to predict the moving rewetting point and minimum heat flux at the evaporator exit, and the model predictions are further validated by experimental data from a refrigeration cooling testbed.

scholarly journals Spray Cooling On Enhanced Surfaces: a Review of the Progress and Mechanisms

2021 ◽  
Author(s):  
Rui-Na Xu ◽  
Gaoyuan Wang ◽  
Peixue Jiang
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Gas Flow ◽  
Rapid Development ◽  
Spray Cooling ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Next Generation ◽  
Structured Surfaces

Abstract The rapid development of electronics, energy and propulsion systems has led us to the point where their performances are limited by cooling capacities. Heat fluxes of 10~100, even over 1,000 W/cm2 need to be dissipated with minimum coolant flow rate in next-generation power electronics. Spray cooling is a high heat flux, uniform and efficient cooling technique proven effective in various applications. However, its cooling capacity and efficiency need to be further improved to meet next-generation ultrahigh-power applications. Engineering of surface properties and structures can fundamentally affect the liquid-wall interactions, thus becoming the most promising way to enhance spray cooling. However, the unclear mechanisms of surface-enhanced spray cooling cause lack of guiding principles for surface design. Here, progress in spray cooling on surfaces with structures of different scales are reviewed and their performances evaluated and compared. Spray cooling can achieve critical heat flux (CHF) above 945 W/cm2 and heat transfer coefficient (HTC) up to 57 W/cm2K on structured surfaces for pressurized nozzle and CHF and HTC up to 1250 W/cm2 and 250 W/cm2K, respectively, on a smooth surface with the assistance of secondary gas flow. CHF enhancement of 110% was achieved on hybrid micro- and nanostructured surfaces. A clear map of enhancement mechanisms is proposed after analysis. Some future concerns are also proposed. This work helps the understanding and design of engineered surfaces in spray cooling and provides insights for interdisciplinary applications of heat transfer and advanced engineering materials.

scholarly journals High heat flux flow boiling of refrigerant R236fa in parallel microchannels

2019 ◽  
Vol 196 ◽  
pp. 00062
Author(s):  
Vladimir Kuznetsov ◽  
Alisher Shamirzaev ◽  
Alexander Mordovskoy
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Flow Boiling ◽  
Nucleate Boiling ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Flux Flow ◽  
Microchannel Heat Exchanger ◽  
Parallel Microchannels

This paper presents the results of an experimental study of the heat transfer during flow boiling of refrigerant R236fa in a horizontal microchannel heat sink. The experiments were performed using closed loop that re-circulates coolant. Microchannel heat exchanger that contains two microchannels with 2x0.4 mm cross-section was used as the test section. The dependence of average heat flux on wall superheat and critical heat flux were measured in the range of mass fluxes from 600 to 1600 kg/m2s and in the range of heat fluxes from 5 to 120 W/cm2. For heat flux greater than 60 W/cm2, nucleate boiling suppression has significant effect on the flow boiling heat transfer, and this leads to decrease of the heat transfer coefficient with heat flux grows.

Pool Boiling Heat Transfer and Bubble Dynamics Over Plain and Enhanced Microchannels

2010 ◽  
Author(s):  
Dwight Cooke ◽  
Satish G. Kandlikar
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Bubble Dynamics ◽  
Pool Boiling ◽  
High Heat ◽  
Heat Fluxes ◽  
Electronic Cooling ◽  
High Heat Flux ◽  
Heat Of Evaporation ◽  
Cooling Ability

Pool boiling is of interest in high heat flux applications because of its potential for removing large amount of heat resulting from the latent heat of evaporation and little pressure drop penalty for circulating coolant through the system. However, the heat transfer performance of pool boiling systems is not adequate to match the cooling ability provided by enhanced microchannels operating under single-phase conditions. The objective of this work is to evaluate the pool boiling performance of structured surface features etched on a silicon chip. The performance is normalized with respect to a plain chip. This investigation also focuses on the bubble dynamics on plain and structured microchannel surfaces under various heat fluxes in an effort to understand the underlying heat transfer mechanism. This work is expected to lead to improved enhancement features for extending the pool boiling option to meet the high heat flux removal demands in electronic cooling applications.

Effects of High Frequency Droplet Train Impingement on Spreading-Splashing Transition, Film Hydrodynamics and Heat Transfer

2016 ◽  
Vol 138 (2) ◽  
Author(s):  
Taolue Zhang ◽  
Jorge Alvarado ◽  
J. P. Muthusamy ◽  
Anoop Kanjirakat ◽  
Reza Sadr
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Surface Temperature ◽  
Liquid Film ◽  
High Frequency ◽  
High Heat ◽  
High Heat Flux ◽  
Droplet Impingement ◽  
Dry Out ◽  
The Impact

The objective of this study is to investigate the effects of droplet-induced crown propagation regimes (spreading and splashing) on liquid film hydrodynamics and heat transfer. In this work, the effects of high frequency droplet train impingement on spreading-splashing transition, liquid film hydrodynamics and surface heat transfer were investigated experimentally. HFE-7100 droplet train was generated using a piezo-electric droplet generator at a fixed flow rate of 165 mL/h. Optical and IR images were captured at stable droplet impingement conditions to visualize the thermal physical process. The droplet-induced crown propagation transition phenomena from spreading to splashing were observed by increasing the droplet Weber number. The liquid film hydrodynamics induced by droplet train impingement becomes more complex when the surface was heated. Bubbles and micro-scale fingering phenomena were observed outside the impact crater under low heat flux conditions. Dry-out was observed outside the impact craters under high heat flux conditions. IR images of the heater surface show that heat transfer was most effective within the droplet impact crater zone due to high fluid inertia including high radial momentum caused by high-frequency droplet impingement. Time-averaged heat transfer measurements indicate that the heat flux-surface temperature curves are linear at low surface temperature and before the onset of dry-out. However, a sharp increase in surface temperature can be observed when dry-out appears on the heater surface. Results also show that strong splashing (We = 850) is unfavorable for heat transfer at high heat flux conditions due to instabilities of the liquid film, which lead to the onset of dry-out. In summary, the results show that droplet Weber number is a significant factor in the spreading-splashing transition, liquid film hydrodynamics and heat transfer.

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