Characterization and Modeling of the Heat Transfer Performance of Nanostructured Cu Micropost Wicks

2011 ◽  
Vol 133 (10) ◽  
Author(s):  
Youngsuk Nam ◽  
Stephen Sharratt ◽  
Gilhwan Cha ◽  
Y. Sungtaek Ju

Micro heat pipes incorporating advanced wicks are promising for the thermal management of power electronics. We report the heat transfer performance of superhydrophilic Cu micropost wicks fabricated on thin silicon substrates using electrochemical deposition and controlled chemical oxidation. For a fixed post diameter, the interpost spacing and hence solid fraction is found to be a main design factor affecting the effective heat transfer coefficient and critical heat flux. The effective heat transfer coefficient >10 W/cm2 K and the critical heat flux >500 W/cm2 over 2 mm × 2 mm heating areas are demonstrated. Copper oxide nanostructures formed on the micropost surfaces significantly enhance the critical heat flux without compromising the effective heat transfer coefficient. An approximate numerical model is developed to help interpret the experimental data. A surface energy minimization algorithm is used to predict the static equilibrium shape of a liquid meniscus, which is then imported into a finite element model to predict the effective heat transfer coefficient. The advanced wick structures and experimental and modeling approaches developed in this work will help develop thin and lightweight thermal management solutions for high-power-density semiconductor devices.

Author(s):  
Youngsuk Nam ◽  
Stephen Sharratt ◽  
Y. Sungtaek Ju

Micro-heat pipes incorporating advanced wicks are promising for the thermal management of power electronics. We report the heat transfer performance of superhydrophilic Cu micropost wicks fabricated on thin silicon substrates using electrochemical deposition and controlled chemical oxidation. For a fixed post diameter, the inter-post spacing and hence solid fraction is found to be a main design factor affecting the effective heat transfer coefficient and critical heat flux. The effective heat transfer coefficient as high as 20 W/cm2 K and the critical heat flux >500 W/cm2 over 2 mm × 2 mm heating areas are demonstrated. Copper oxide nanostructures formed on the micropost surfaces significantly enhance the critical heat flux without compromising the effective heat transfer coefficient. The advanced wick structures and experimental approaches developed in this work will help develop thin and lightweight thermal management solutions for high-power density semiconductor devices.


Author(s):  
Suchismita Sarangi ◽  
Justin A. Weibel ◽  
Suresh V. Garimella

Immersion cooling strategies often employ surface enhancements to improve the pool boiling heat transfer performance. Sintered particle/powder coatings with different constituent particle sizes and total layer thicknesses have been commonly used on smooth surfaces to reduce the wall superheat and increase the critical heat flux during pool boiling. However, the role of the particle morphology on pool boiling has not been explicitly investigated. Since the morphology of the particles affects the pore shape, permeability, surface roughness, effective conductivity and diffusivity of the sintered coating, it will impact the heat transfer coefficient and critical heat flux during boiling. In this study, pool boiling of FC-72 is experimentally investigated using copper surfaces coated with a layer of sintered copper particles of irregular, dendritic and spherical morphologies. In order to isolate the effect of particle morphology, particles with the same effective diameter (90–106 μm) are sintered under controlled conditions that yield the same porosity (∼60%) and coating thickness (∼6 particle diameters) for all samples tested. The effects of particle morphology on the incipient wall superheat, nucleate boiling heat transfer coefficient, and critical heat flux are analyzed. The morphology of the pore structure in the coating formed by sintering is observed with SEM images; bubble nucleation and departure characteristics affecting the heat transfer performance of the coatings are qualitatively assessed with the aid of high-speed flow visualizations to corroborate the trends observed in the boiling curves. The irregular particles are observed to show the highest heat transfer coefficient, followed by dendritic and then spherical particles. The critical heat flux is found to be independent of the particle morphology.


Author(s):  
Chaxiu Guo ◽  
Dongwei Zhang ◽  
Junjie Zhou ◽  
Wujun Zhang ◽  
Xinli Wei

The heat flux on the receiver tube is non-uniform because of uneven solar flux and receiver structure, which causes overheating and thermal stress failure of receiver and affected safe operations of the Concentrated Solar Power (CSP) system. In order to reduce the temperature difference in receiver tube wall and improve the efficiency of CSP system, the ternary eutectic salt LiF-NaF-KF (46.5-11.5-42 wt.%, hereafter FLiNaK), which has a better high thermal stability than that of nitrate salts at operating temperature of 900 °C, is selected as HTF, and heat transfer performance of FLiNaK in a corrugated receive tube with non-uniform heat flux is simulated by CFD software in the present work. The numerical results reveal that the non-uniform heat flux has a great influence on the temperature distributions of the receive tube and FLiNaK salt. Compared with the result of bare tube, the corrugated tube can not only significantly reduce the temperature difference in tube wall and salt by improving the uniformity of temperature distribution but also enhance the heat transfer of the salt, where the heat transfer coefficient increases with the Reynolds number and heat flux. Moreover, the enhanced effect of the corrugated tube depends on both the pitch and the height of ridges. It is found that the heat transfer coefficient of the salt gets a maximum when the ratio of the height of ridge to the pitch is 0.2. The research presented here may provide guidelines for design optimization of receiver tube in CSP system.


2014 ◽  
Vol 1081 ◽  
pp. 270-274
Author(s):  
Zui Xian Yu ◽  
Xue Sheng Wang ◽  
Qin Zhu Chen

A new preparation technique of carbon steel/stainless steel clad tube was introduced, and the contact surface was well combined. Meanwhile, with the using of tube heat exchanger, the experiment on the heat transfer performance of the clad tube was done. Comparing the 10/316 clad tube and the 316 stainless steel tube, the effects on the heat transfer performance of 316 stainless steel tube attached to carbon steel was evaluated. It is showed that overall heat transfer coefficient of 10/316 clad tubes is higher than that of stainless steel tube. The average heat transfer coefficient of 10/316 clad tubes is about 18.7%~34.4% higher than that of stainless steel tube. Experimental investigation indicates that, by brazing and cold drawing, the 10/316 clad tube was well combined and the thermal conductivity was better than that of stainless steel tube.


2013 ◽  
Vol 832 ◽  
pp. 160-165 ◽  
Author(s):  
Mohammad Alam Khairul ◽  
Rahman Saidur ◽  
Altab Hossain ◽  
Mohammad Abdul Alim ◽  
Islam Mohammed Mahbubul

Helically coiled heat exchangers are globally used in various industrial applications for their high heat transfer performance and compact size. Nanofluids can provide excellent thermal performance of this type of heat exchangers. In the present study, the effect of different nanofluids on the heat transfer performance in a helically coiled heat exchanger is examined. Four different types of nanofluids CuO/water, Al2O3/water, SiO2/water, and ZnO/water with volume fractions 1 vol.% to 4 vol.% was used throughout this analysis and volume flow rate was remained constant at 3 LPM. Results show that the heat transfer coefficient is high for higher particle volume concentration of CuO/water, Al2O3/water and ZnO/water nanofluids, while the values of the friction factor and pressure drop significantly increase with the increase of nanoparticle volume concentration. On the contrary, low heat transfer coefficient was found in higher concentration of SiO2/water nanofluids. The highest enhancement of heat transfer coefficient and lowest friction factor occurred for CuO/water nanofluids among the four nanofluids. However, highest friction factor and lowest heat transfer coefficient were found for SiO2/water nanofluids. The results reveal that, CuO/water nanofluids indicate significant heat transfer performance for helically coiled heat exchanger systems though this nanofluids exhibits higher pressure drop.


Author(s):  
Minghui Hu ◽  
Dongsheng Zhu ◽  
Jialong Shen

It is requested to develop a microscale and high performance heat exchanger for small size energy equipments. The heat transfer performance of the water film on the condensing coils of the microscale evaporative condenser was studied for a single-stage compressed refrigeration cycle system. Under various operation conditions, the effects of the spray density and the head-on air velocity on the heat transfer performance of the water film were investigated. The results show that the microscale heat transfer coefficient of the water film αw increases with the increase of spray density and decreases with the increase of head-on air velocity. The results indicate that the key factor affecting the microscale heat transfer of the water film is the spray density. As the results, it is measured that the present device attained high heat transfer quantity despite the weight is light. In addition, via regression analysis of the experimental data, the correlation equation for calculating the microscale heat transfer coefficient of the water film was obtained, its regression correlation coefficient R is 0.98 and the standard deviation is 7.5%. Finally, the correlations from other works were compared. The results presented that the experimental correlation had better consistency with the correlations from other works. In general, the obtained experimental results of the water film heat transfer are helpful to the design and practical operation of the microscale evaporative condensers.


Sign in / Sign up

Export Citation Format

Share Document