scholarly journals Erratum: “A Novel Approach to Low Profile Heat Sink Design” [Journal of Heat Transfer, 2010, 132(9), p. 091401]

2010 ◽  
Vol 132 (12) ◽  
Author(s):  
J. Stafford ◽  
E. Walsh ◽  
V. Egan ◽  
P. Walsh ◽  
Y. S. Muzychka
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Novel Approach ◽  
Low Profile ◽  
Heat Sink Design

Thermal Analysis of Miniature Low Profile Heat Sinks With and Without Fins

2009 ◽  
Vol 131 (3) ◽  
Author(s):  
V. Egan ◽  
P. A. Walsh ◽  
E. Walsh ◽  
R. Grimes
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Volume Flow Rate ◽  
Electronic Devices ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Superior Performance ◽  
Low Profile ◽  
In Series ◽  
Heat Sink Design

Reliable and efficient cooling solutions for portable electronic devices are now at the forefront of research due to consumer demand for manufacturers to downscale existing technologies. To achieve this, the power consumed has to be dissipated over smaller areas resulting in elevated heat fluxes. With regard to cooling such devices, the most popular choice is to integrate a fan driven heat sink, which for portable electronic devices must have a low profile. This paper presents an experimental investigation into such low profile cooling solutions, which incorporate one of the smallest commercially available fans in series with two different heat sink designs. The first of these is the conventionally used finned heat sink design, which was specifically optimized and custom manufactured in the current study to complement the driving fan. While the second design proposed is a novel “finless” type heat sink suitable for use in low profile applications. Together the driving fan and heat sinks combined were constrained to have a total footprint area of 465 mm2 and a profile height of only 5 mm, making them ideal for use in portable electronics. The objective was to evaluate the performance of the proposed finless heat sink design against a conventional finned heat sink, and this was achieved by means of thermal resistance and overall heat transfer coefficient measurements. It was found that the proposed finless design proved to be the superior cooling solution when operating at low fan speeds, while at the maximum fan speed tested of 8000 rpm both provided similar performance. Particle image velocimetry measurements were used to detail the flow structures within each heat sink and highlighted methods, which could further optimize their performance. Also, these measurements along with corresponding global volume flow rate measurements were used to elucidate the enhanced heat transfer characteristics observed for the finless design. Overall, it is shown that the proposed finless type heat sink can provide superior performance compared with conventional finned designs when used in low profile applications. In addition a number of secondary benefits associated with such a design are highlighted including lower cost, lower mass, lower acoustics, and reduced fouling issues.

A Novel Approach to Low Profile Heat Sink Design

2010 ◽  
Vol 132 (9) ◽  
Author(s):  
Jason Stafford ◽  
Ed Walsh ◽  
Vanessa Egan ◽  
Pat Walsh ◽  
Yuri S. Muzychka
Keyword(s):  
Forced Convection ◽  
Heat Sink ◽  
Theoretical Study ◽  
Convection Heat Transfer ◽  
Transfer Rates ◽  
Novel Approach ◽  
Low Profile ◽  
Small Footprint ◽  
Convection Cooling ◽  
Heat Sink Design

This paper discusses the importance of developing cooling solutions for low profile devices. This is addressed with an experimental and theoretical study on forced convection cooling solution designs that could be implemented into such devices. Conventional finned and corresponding finless designs of equal exterior dimensions are considered for three different heat sink profiles ranging from 1 mm to 4 mm in combination with a commercially available radial blower. The results show that forced convection heat transfer rates can be enhanced by up to 55% using finless designs at low profiles with relatively small footprint areas. Overall, this paper provides optimization and geometry selection criteria, which are relevant to designers of low profile cooling solutions.

scholarly journals A Numerical and Experimental Study of a Novel Heat Sink Design for Natural Convection Cooling of LED Grow Lights

Energies ◽  
2020 ◽  
Vol 13 (16) ◽  
pp. 4046
Author(s):  
Ram Adhikari ◽  
Dawood Beyragh ◽  
Majid Pahlevani ◽  
David Wood
Keyword(s):  
Heat Transfer ◽  
Natural Convection ◽  
Heat Sink ◽  
Large Scale ◽  
High Efficiency ◽  
Experimental Testing ◽  
Growth Stages ◽  
Air Cooling ◽  
Convection Cooling ◽  
Heat Sink Design

Light-emitting diode (LED) grow lights are increasingly used in large-scale indoor farming to provide controlled light intensity and spectrum to maximize photosynthesis at various growth stages of plants. As well as converting electricity into light, the LED chips generate heat, so the boards must be properly cooled to maintain the high efficiency and reliability of the LED chips. Currently, LED grow lights are cooled by forced convection air cooling, the fans of which are often the points of failure and also consumers of a significant amount of power. Natural convection cooling is promising as it does not require any moving parts, but one major design challenge is to improve its relatively low heat transfer rate. This paper presents a novel heat sink design for natural convection cooling of LED grow lights. The new design consists of a large rectangular fin array with openings in the base transverse to the fins to increase air flow, and hence the heat transfer. Numerical simulations and experimental testing of a prototype LED grow light with the new heat sink showed that openings achieved their intended purpose. It was found that the new heat sink can transfer the necessary heat flux within the safe operating temperature range of LED chips, which is adequate for cooling LED grow lights.

An Application of the Fractal Theory in the Design of Heat Sink for Precision Measurement Instrument

2005 ◽  
Vol 295-296 ◽  
pp. 717-722 ◽  
Author(s):  
S.R. Lee ◽  
Z.G. Li ◽  
B.G. Wang ◽  
H.S. Chiou
Keyword(s):  
Heat Transfer ◽  
Temperature Variation ◽  
Temperature Control ◽  
Heat Sink ◽  
High Performance ◽  
Laser Interferometer ◽  
Fractal Theory ◽  
Measurement Instrument ◽  
Measurement Instruments ◽  
Heat Sink Design

Temperature variation on accuracy and stability in measurement instruments is an important issue. High performance and miniaturized instruments have rigorous requirements on temperature. Heat transfer and temperature control are important in instruments design. For laser interferometer, temperature variation will adversely affect the frequency stability of the laser and the measuring precision. In order to effectively stabilize the frequency, a simple and effective heat sink design for laser interferometer is presented. It is based on the fractal theory and the heat transfer characteristics to allow higher dissipation for temperature control to generate higher heat transfer area in a finite space. Experimental results in frequency stabilization clearly show that this method is effective.

The Development of an Integrated Fan and Heat Sink Solution for Thermal Management in Low Profile Applications

2006 ◽  
Author(s):  
Ed Walsh ◽  
Ronan Grimes
Keyword(s):  
Heat Flux ◽  
Thermal Management ◽  
Heat Sink ◽  
Heat Sinks ◽  
Portable Electronics ◽  
Low Profile ◽  
Convection Cooling ◽  
New Methodologies ◽  
Heat Sink Design ◽  
Management Issues

The increasing heat flux densities from portable electronics are leading to new methodologies being implemented to provide thermal management within such devices. Many technologies are under development to transport heat within electronic equipment to allow it to be transported into the surroundings via conduction, natural convection and radiation. Few have considered the approach of implementing a forced convection cooling solution in such devices. This work addresses the potential of a low profile integrated fan and heat sink solution to electronics thermal management issues of the future, particularly focusing upon possible solutions in low profile portable electronics. We investigate two heat sink designs with mini channel features, applicable to low profile applications. The thermal performance of the heat sinks is seen to differ by approximately 40% and highlights the importance of efficient heat sink design at this scale.

Forced Convection Air Cooling of Simulated Low Profile Electronic Components: Part 2—Heat Sink Effects

1991 ◽  
Vol 113 (1) ◽  
pp. 27-32 ◽  
Author(s):  
G. L. Lehmann ◽  
J. Pembroke
Keyword(s):  
Heat Transfer ◽  
Forced Convection ◽  
Flow Rate ◽  
Heat Sink ◽  
Heat Sinks ◽  
Air Cooling ◽  
Channel Spacing ◽  
Heat Transfer Behavior ◽  
Low Profile ◽  
Transfer Behavior

Forced convection air cooling of an array of low profile, card-mounted components has been investigated. A simulated array is attached to one wall of a low aspect ratio duct. This is the second half of a two-part study. In this second part the presence of a longitudinally finned heat sink is considered. The heat sink is a thermally passive “flow disturbance”. Laboratory measurements of the heat transfer rates downstream of the heat sink are reported and compared with the measured values which occur when no heat sinks are present. Data are presented for three heat sink geometries subject to variations in channel spacing and flow rate. In the flow range considered laminar, transitional and turbulent heat transfer behavior has been observed. The presence of a heat sink appears to “trip” the start of transition at lower Reynolds numbers than when no heat sinks are present. A Reynolds number based on component length provides a good correlation of the heat transfer behavior due to variations in flow rate and channel spacing. Heat transfer is most strongly effected by flow rate and position relative to the heat sink. Depending on the flow regime (laminar or turbulent) both relative enhancement and reductions in the component Nusselt number have been observed. The impact of introducing a heat sink is greatest for flow rates corresponding to transitional behavior.

Novel Heat Sink Design Utilizing Ionic Wind for Efficient Passive Thermal Management of Grid-Scale Power Routers

2015 ◽  
Vol 7 (3) ◽  
Author(s):  
Noris Gallandat ◽  
J. Rhett Mayor
Keyword(s):  
Heat Transfer ◽  
Natural Convection ◽  
Numerical Model ◽  
Heat Transfer Enhancement ◽  
Thermal Management ◽  
Heat Sink ◽  
Ionic Wind ◽  
Transfer Enhancement ◽  
Enhancement Method ◽  
Heat Sink Design

This paper presents a numerical model assessing the potential of ionic wind as a heat transfer enhancement method for the cooling of grid distribution assets. Distribution scale power routers (13–37 kV, 1–10 MW) have stringent requirements regarding lifetime and reliability, so that any cooling technique involving moving parts such as fans or pumps are not viable. A new heat sink design combining corona electrodes with bonded fin arrays is presented. The model of the suggested design is solved numerically. It is predicted that applying a voltage of 5 kV on the corona electrodes could increase the heat removed by a factor of five as compared to natural convection.

Thermal Performance of Two and Three Dimensional Radial Flow Heat Sinks

2009 ◽  
Author(s):  
Ronan Grimes ◽  
Kieran Hanly ◽  
Edmond Walsh
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Angular Displacement ◽  
Three Dimensional ◽  
Heat Sinks ◽  
Electronic Systems ◽  
Two Dimensional ◽  
Pressure Drops ◽  
Low Profile ◽  
Fin Spacing

Space and power constraints in many contemporary electronic systems place a greater importance than ever on efficient thermal management solutions. This paper investigates the performance and optimisation of air cooled heat sinks suitable for deployment in compact electronic devices. The heat sinks examined have circular footprint, with air flowing from the centre, radially outwards through radially aligned channels. Heat sink height is examined through experiments which were performed on heat sinks with high and low fins, with two and three dimensional flow and heat transfer phenomena respectively. In both cases the effect of angular fin spacing is investigated to determine optimum fin spacing for a range of heat sink pressure drops. Heat transfer correlations from literature which were originally developed for parallel finned heat sinks are compared with the experimental data. The main findings of the paper are that the performance of the high profile two dimensional heat sink is more sensitive to fin angular displacement than low profile three dimensional heat sinks. The parallel fin correlations from literature were found to predict the performance of the three dimensional heat sinks more accurately than the two dimensional heat sinks.

An Experimental and Theoretical Study of Finned and Finless Heat Sinks for Low Profile Applications

2009 ◽  
Author(s):  
Jason Stafford ◽  
Ed Walsh ◽  
Vanessa Egan ◽  
Pat Walsh ◽  
Yuri S. Muzychka
Keyword(s):  
Heat Transfer ◽  
Forced Convection ◽  
Heat Sink ◽  
Theoretical Study ◽  
Convection Heat Transfer ◽  
Heat Sinks ◽  
Duct Flow ◽  
Transfer Rates ◽  
Low Profile ◽  
Small Footprint

This paper discusses the importance of developing cooling solutions for low profile devices. This is addressed with an experimental and theoretical study on forced convection cooling solution designs that could be implemented into such devices. Conventional finned and corresponding finless designs of equal exterior dimensions are considered for three different heat sink profiles ranging from 1mm to 4mm profile in combination with a commercially available radial blower. The results show that forced convection heat transfer rates can be enhanced by up to 55% using finless designs at low profiles with relatively small footprint areas. The advantages of both finned and finless geometries are presented along with the limitations of the customary finned heat sink design at low profile scales. The results also show large increases in heat transfer rates over that predicted which can be attained at the low profile scale based on geometry selection. Dimensionless comparisons are made between experimental results and combined hydrodynamic and thermally developing duct flow theory which is representative of the flow regime within both the finned and finless geometries. Overall, this paper provides optimization and geometry selection criteria which are relevant to designers of low profile cooling solutions.

COP Improvement of Thermoelectric Cooler through the Optimization of Heat Dissipation System

2014 ◽  
Vol 554 ◽  
pp. 241-245 ◽  
Author(s):  
Mohd Bin Sulaiman Hafis ◽  
Mohd Jamir Mohd Ridzuan ◽  
Ahamad Zaidi Ahmad Firdaus ◽  
S.M. Shahril ◽  
Ramli Nur Farahana ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Thermal Performance ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Cooling System ◽  
Thermoelectric Cooler ◽  
Base Area ◽  
Experimental Works ◽  
Heat Sink Design ◽  
Dissipation System

This paper presents theoretical and experimental works on the effect of heat transfer for a thermoelectric (TE) cooling system. The study focuses on thermal performance of the system through the optimisation of heat dissipation system for two prototypes that have aluminium and copper heat sink design, respectively. The study revealed that heat sink base area and fin height influenced thermal performance.

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