A Plasticity Problem Involving Plane Strain and Plane Stress Simultaneously: Groove Formation in the Machining of High-Temperature Alloys

1966 ◽  
Vol 88 (2) ◽  
pp. 142-146 ◽  
Author(s):  
M. C. Shaw ◽  
A. L. Thurman ◽  
H. J. Ahlgren

Although a plane strain plastic analysis represents a good approximation for the central portion of a metal-cutting chip, plane stress better approximates conditions at the free edges of the chip. Therefore the metal-cutting problem is reexamined using both plane strain and plane stress simultaneously. The analysis indicates that the material at the edges of the chip will become plastic at a lower value of stress than will be required by the central constrained region and that the energy per unit volume at the edges of the chip will be greater than at the center. The consequence of these results is discussed in terms of the wear groove frequently observed on a tool under the free edges of the chip, which is particularly troublesome when machining high-temperature alloys.

1988 ◽  
Vol 110 (4) ◽  
pp. 322-325 ◽  
Author(s):  
B. E. Klamecki ◽  
S. Kim

The effects of the stress state transition from plane stress at the workpiece surface to plane strain in the central region of the chip formation zone were studied. A finite element analysis of the incipient chip formation process was performed. The model included heat generation and temperature induced workpiece material property changes. The primary result is that the unique high strain, high strain rate, large free surface characteristics of the metal cutting process can result in qualitatively different deformation behavior across the shear zone. Temperatures are higher in the regions near the surface of the workpiece than in the central region. In extreme cases, this will result in strain hardening behavior in the plain strain regions and thermal softening of the work material near the surface.


Author(s):  
Vasant Pednekar ◽  
Vis Madhavan ◽  
Amir H. Adibi-Sedeh

It is widely known that in practical orthogonal machining experiments, interior sections of the deforming material undergo plane strain deformation whereas material near the side faces of the workpiece undergoes plane stress deformation. This study is aimed at investigating the plane strain to plane stress transition using 3D coupled thermo-mechanical finite element analysis of orthogonal machining. The temperature, stress, strain and strain-rate distributions along different planes of the workpiece are analyzed to obtain estimates of the fraction of material undergoing plane strain deformation for different widths of cut. While it is found that the deformation in the mid-section of the workpiece is close to that observed in 2D plane strain simulations, the deformation along the side faces is quite different from that observed in 2D plane stress simulations, due to the constraint imposed upon the material along the sides by the material in the middle. Though the chip thickness along the sides is smaller than the chip thickness in the middle, the strain, strain-rate, and temperature fields along the side face and mid-section are quite similar. This study confirms that accurate maps of temperature, strain and strain-rate in plane strain deformation can be obtained by observing the side faces. It is found that for the cutting conditions used, a width to depth-of-cut ratio of twenty (not ten, as is commonly assumed) results in a close approximation to plane strain deformation through more than 90% of the width of the work material. For a width to depth-of-cut ratio of ten, significant deviations are observed in the stresses, with respect to their corresponding values in plane strain. Recommendations for the width of cut to depth of cut ratio to be used in experiments for other cutting conditions can be developed based upon similar studies.


1980 ◽  
Vol 102 (4) ◽  
pp. 310-314 ◽  
Author(s):  
W. A. Morcos

Lee and Shaffer’s slip line field solution [11] for orthogonal cutting is generalized to the free oblique continuous cutting problem in plane strain. Comparison of the results as predicted by this solution with those of the plane strain modified Merchant model [8] and experimental results is achieved for some key metal cutting parameters. It is shown that in some respect, the plane strain modified Merchant model [8] predicts values of parameters which are closer to experimental results.


2020 ◽  
Vol 2020 (11) ◽  
pp. 1292-1299
Author(s):  
I. M. Razumovskii ◽  
V. I. Razumovskiy ◽  
I. A. Logachev ◽  
A. O. Rodin ◽  
M. I. Razumovsky

Author(s):  
Gustavo Henrique B. Donato ◽  
Felipe Cavalheiro Moreira

Fracture toughness and Fatigue Crack Growth (FCG) experimental data represent the basis for accurate designs and integrity assessments of components containing crack-like defects. Considering ductile and high toughness structural materials, crack growing curves (e.g. J-R curves) and FCG data (in terms of da/dN vs. ΔK or ΔJ) assumed paramount relevance since characterize, respectively, ductile fracture and cyclic crack growth conditions. In common, these two types of mechanical properties severely depend on real-time and precise crack size estimations during laboratory testing. Optical, electric potential drop or (most commonly) elastic unloading compliance (C) techniques can be employed. In the latter method, crack size estimation derives from C using a dimensionless parameter (μ) which incorporates specimen’s thickness (B), elasticity (E) and compliance itself. Plane stress and plane strain solutions for μ are available in several standards regarding C(T), SE(B) and M(T) specimens, among others. Current challenges include: i) real specimens are in neither plane stress nor plane strain - modulus vary between E (plane stress) and E/(1-ν2) (plane strain), revealing effects of thickness and 3-D configurations; ii) furthermore, side-grooves affect specimen’s stiffness, leading to an “effective thickness”. Previous results from current authors revealed deviations larger than 10% in crack size estimations following existing practices, especially for shallow cracks and side-grooved samples. In addition, compliance solutions for the emerging clamped SE(T) specimens are not yet standardized. As a step in this direction, this work investigates 3-D, thickness and side-groove effects on compliance solutions applicable to C(T), SE(B) and clamped SE(T) specimens. Refined 3-D elastic FE-models provide Load-CMOD evolutions. The analysis matrix includes crack depths between a/W=0.1 and a/W=0.7 and varying thicknesses (W/B = 4, W/B = 2 and W/B = 1). Side-grooves of 5%, 10% and 20% are also considered. The results include compliance solutions incorporating all aforementioned effects to provide accurate crack size estimation during laboratory fracture and FCG testing. All proposals revealed reduced deviations if compared to existing solutions.


2021 ◽  
pp. 161441
Author(s):  
Yuantao Zhao ◽  
Rui Wang ◽  
Yanle Sun ◽  
Lianbo Wang ◽  
Xinfeng Wu ◽  
...  

Sign in / Sign up

Export Citation Format

Share Document