Axisymmetric Torsional Stresses in a Solid Containing Two Partially Bonded Rigid Spherical Inclusions

1967 ◽  
Vol 34 (2) ◽  
pp. 313-320 ◽  
Author(s):  
J. G. Goree ◽  
H. B. Wilson
Keyword(s):  
Stress Field ◽  
Mixed Boundary ◽  
Three Dimensional ◽  
Torsional Stress ◽  
Mixed Boundary Value Problem ◽  
Singular Stress ◽  
Legendre Series ◽  
Spherical Inclusions ◽  
The Matrix ◽  
Singular Stress Field

An analysis of the three-dimensional mixed boundary-value problem of an infinite elastic body containing two identical partially bonded rigid spherical inclusions and subjected to an axisymmetric torsional stress field is presented. The order of the singularity in the stresses at the points of separation between the matrix and the inclusions is determined and the form of this singular stress field is utilized in determining a solution to the dual Legendre series generated from the boundary conditions. Numerical results are presented.

scholarly journals A precise and efficient method for evaluating singular stress field at the vertex in three dimensional bonded body

2018 ◽  
Vol 84 (864) ◽  
pp. 18-00013-18-00013 ◽  
Author(s):  
Tatsujiro MIYAZAKI ◽  
Takuma INOUE ◽  
Nao-Aki NODA ◽  
Yoshikazu SANO
Keyword(s):  
Stress Field ◽  
Efficient Method ◽  
Three Dimensional ◽  
Singular Stress ◽  
Singular Stress Field

Evaluation of the Bonding Strength at the Three-Dimensional Vertex in Silicon-Resin Joints

2009 ◽  
Author(s):  
Hideo Koguchi ◽  
Masato Nakajima
Keyword(s):  
Stress Distribution ◽  
Stress Field ◽  
Boundary Element ◽  
External Force ◽  
Thermal Stresses ◽  
Three Dimensional ◽  
Singular Stress ◽  
Singular Stress Field ◽  
Element Method ◽  
Silicon Resin

Portable electric devices such as mobile phone and portable music player become compact and also their performance improves. High density packaging technology such as CSP (Chip Size Package) and Stacked-CSP is needed to realize advanced functions. CSP is a bonded structure composed of materials with different properties. A mismatch of material properties may cause stress singularity at the edge of interface, which lead to the failure of bonding part in structures. Singular stress field in residual thermal stresses occurs in a cooling process after bonding the joints at a high temperature. In the present paper, the strength of interface in CSP consisted of silicon and resin is investigated. Boundary element method and an eigen value analysis based on finite element method are used for evaluating the intensity of singularity of residual thermal stresses at a vertex in a three-dimensional joint. Three-dimensional boundary element program based on the fundamental solution for two-phase isotropic body is used for calculating the stress distribution in the three-dimensional joint. Angular function in the singular stress field at the vertex in the three-dimensional joint is calculated using eigen vector determined from eigen analysis. The strength of bonding at the interface in several silicon-resin specimens with different thickness of resin is investigated analytically and experimentally. Stress singular analysis applying an external force for the joints is firstly carried out. After that, singular stress field for the residual thermal stresses varying material property of resin with temperature is calculated. Combining singular stress fields for the external force and the residual thermal stress yields a final stress distribution for evaluating the strength of interface. A relationship between the external force for delamination in joints and the thickness of resin is derived. Finally, a critical intensity of singularity for delamination between silicon and resin is determined.

Intensity of Singular Stress Field for Three-Dimensional Butt Joint to Evaluate the Adhesive Strength

2018 ◽  
Vol 2018.71 (0) ◽  
pp. D31
Author(s):  
Mohd Radzi ARIDI ◽  
Nao-Aki NODA ◽  
Kenji TSUBOI ◽  
Rei TAKAKI ◽  
Fei REN ◽  
...  
Keyword(s):  
Stress Field ◽  
Adhesive Strength ◽  
Three Dimensional ◽  
Butt Joint ◽  
Singular Stress ◽  
Singular Stress Field
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