Influence of Transverse Anisotropy on the Plastic Collapse of Plates and Shells

1975 ◽  
Vol 97 (1) ◽  
pp. 125-130 ◽  
Author(s):  
J. Chakrabarty
Keyword(s):  
Yield Stress ◽  
Plane Stress ◽  
Carrying Capacity ◽  
Yield Criterion ◽  
Anisotropic Materials ◽  
Plastic Collapse ◽  
Thickness Direction ◽  
Transverse Anisotropy ◽  
Plates And Shells

A modification of Tresca’s yield criterion is discussed for plane stress in anisotropic materials, when the yield stress in the thickness direction is higher than in any direction perpendicular to it. Special consideration is given to the determination of collapse loads for symmetrically loaded plates and shells having this kind of anisotropy. It is found that the carrying capacity significantly increases with the degree of transverse anisotropy represented by a single parameter μ.

A theory of the yield locus and flow rule of anisotropic materials

1966 ◽  
Vol 1 (3) ◽  
pp. 204-215 ◽  
Author(s):  
T. C. Hsu
Keyword(s):  
Experimental Data ◽  
Linear Relationship ◽  
Yield Stress ◽  
Plane Stress ◽  
Stress Ratio ◽  
Yield Criterion ◽  
Anisotropic Materials ◽  
Yield Locus ◽  
Flow Rule ◽  
Stress Components

A general yield criterion for anisotropic materials is derived from the linear relationship between strain and stress components. The particular forms of the yield criterion for plane stress and for certain types of symmetry are discussed and are compared with available experimental data. The separate effects of the stress ratio and the direction of the stress axes on the yield stress are also determined.

Determination of Elastic Modulus and Yield Stress of Ultra-thin Cu and low-k Films Using Spherical Nanoindentation Measurement

2005 ◽  
Vol 863 ◽  
Author(s):  
Satoshi Shimizu ◽  
Nobuo Kojima ◽  
Jiping Ye
Keyword(s):  
Thin Film ◽  
Yield Stress ◽  
Yield Criterion ◽  
Fused Silica ◽  
Copper Thin Film ◽  
Reduced Modulus ◽  
Nanoindentation Measurement ◽  
Elastic And Plastic Deformation ◽  
Low K

AbstractA spherical nanoindentation method was developed to evaluate elastic and plastic deformation parameters. The experimental reliability was confirmed by examining fused silica in the elastic deformation range. Yield stress as a quantitative plastic parameter was estimated using the Hertz contact theory and Tresca yield criterion. A copper thin film and two types of low-k thin film were examined. Reduced modulus was almost the same as the value obtained for the Cu (100) plane and yield stress was found to be between single crystals Cu (111) and Cu (100). These mechanical properties were thought to be dependent on the crystal orientation of the copper thin film. The two types of MSQ low-k film exhibited a difference in yield stress, although hardness was estimated to be similar by using the conventional nanoindentation method. These results have never been seen on a micro-mater scale.

scholarly journals A Study of Yielding and Plasticity of Rapid Prototyped ABS

Mathematics ◽  
2021 ◽  
Vol 9 (13) ◽  
pp. 1495
Author(s):  
Dan-Andrei Șerban ◽  
Cosmin Marșavina ◽  
Alexandru Viorel Coșa ◽  
George Belgiu ◽  
Radu Negru
Keyword(s):  
Experimental Data ◽  
Stress State ◽  
Plastic Flow ◽  
Plane Stress ◽  
Yield Criterion ◽  
Numerical Analyses ◽  
Flow Potential ◽  
Stress States ◽  
State Configuration

In this article, the yielding and plastic flow of a rapid-prototyped ABS compound was investigated for various plane stress states. The experimental procedures consisted of multiaxial tests performed on an Arcan device on specimens manufactured through photopolymerization. Numerical analyses were employed in order to determine the yield points for each stress state configuration. The results were used for the calibration of the Hosford yield criterion and flow potential. Numerical analyses performed on identical specimen models and test configurations yielded results that are in accordance with the experimental data.

scholarly journals Determination of Load-Carrying Capacity of C-Profile Glued Ti-Al Column under Temperature Environment

Materials ◽  
2021 ◽  
Vol 14 (11) ◽  
pp. 3013
Author(s):  
Leszek Czechowski
Keyword(s):  
Carrying Capacity ◽  
Tensile Tests ◽  
Discrete Models ◽  
Image Correlation ◽  
Load Carrying Capacity ◽  
Lagrange Equations ◽  
Load Carrying ◽  
Different Temperatures ◽  
Influence Of Temperature On

The paper deals with an examination of the behaviour of glued Ti-Al column under compression at elevated temperature. The tests of compressed columns with initial load were performed at different temperatures to obtain their characteristics and the load-carrying capacity. The deformations of columns during tests were registered by employing non-contact Digital Image Correlation Aramis® System. The numerical computations based on finite element method by using two different discrete models were carried out to validate the empirical results. To solve the problems, true stress-logarithmic strain curves of one-directional tensile tests dependent on temperature both for considered metals and glue were implemented to software. Numerical estimations based on Green–Lagrange equations for large deflections and strains were conducted. The paper reveals the influence of temperature on the behaviour of compressed C-profile Ti-Al columns. It was verified how the load-carrying capacity of glued bi-metal column decreases with an increase in the temperature increment. The achieved maximum loads at temperature 200 °C dropped by 2.5 times related to maximum loads at ambient temperature.

Generalized plane stress in a semi-infinite strip under arbitrary end-load

1964 ◽  
Vol 281 (1385) ◽  
pp. 184-206 ◽  
Keyword(s):  
Differential Equation ◽  
Ordinary Differential Equation ◽  
Boundary Conditions ◽  
Fourth Order ◽  
Plane Stress ◽  
Stress Function ◽  
Infinite Strip ◽  
Order Ordinary Differential Equation ◽  
Orthogonal Functions

The problem involves the determination of a biharmonic generalized plane-stress function satisfying certain boundary conditions. We expand the stress function in a series of non-orthogonal eigenfunctions. Each of these is expanded in a series of orthogonal functions which satisfy a certain fourth-order ordinary differential equation and the boundary conditions implied by the fact that the sides are stress-free. By this method the coefficients involved in the biharmonic stress function corresponding to any arbitrary combination of stress on the end can be obtained directly from two numerical matrices published here The method is illustrated by four examples which cast light on the application of St Venant’s principle to the strip. In a further paper by one of the authors, the method will be applied to the problem of the finite rectangle.

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