The Interface Crack in a Shear Field

1978 ◽  
Vol 45 (2) ◽  
pp. 287-290 ◽  
Author(s):  
Maria Comninou
Keyword(s):  
Shear Stress ◽  
Stress Intensity ◽  
Interface Crack ◽  
Normal Stresses ◽  
Intensity Factors ◽  
Contact Zones ◽  
Frictionless Contact ◽  
Shear Field ◽  
Crack Tips ◽  
Global Nature

The interface crack in a tension field was reconsidered in a recent paper, and the unrealistic oscillatory singularities were eliminated by assuming small frictionless contact zones near the crack tips. In the present paper, the interface crack in a shear field is studied. Some unexpected results emerge: one of the contact zones is large, affecting thus the global nature of the solution; the gap closes extremely abruptly at one of its ends, but the normal stresses remain zero at this point; and the shear stress-intensity factors have opposite signs at the crack tips.

The Interface Crack in a Combined Tension-Compression and Shear Field

1979 ◽  
Vol 46 (2) ◽  
pp. 345-348 ◽  
Author(s):  
Maria Comninou ◽  
D. Schmueser
Keyword(s):  
Shear Stress ◽  
Stress Intensity ◽  
Interface Crack ◽  
Stress Intensity Factors ◽  
Crack Opening ◽  
Intensity Factors ◽  
Contact Zones ◽  
Frictionless Contact ◽  
Applied Tension ◽  
Crack Tips

The interface crack was analyzed in two recent papers which considered applied tension and shear fields separately. The unrealistic oscillatory singularities and the ensuing material interpenetration were eliminated in these solutions by assuming small frictionless contact zones near the crack tips. The present paper presents a solution for the interface crack under combined normal and shear tractions. Both tensile and compressive normal tractions are considered and numerical results of the extents of the contact zones, shear stress-intensity factors, and interface crack opening profiles are presented.

Accurate stress intensity factors for kinked interface crack in bonded dissimilar half-plane

2021 ◽  
pp. 2140030
Author(s):  
Kazuhiro Oda ◽  
Nao-Aki Noda
Keyword(s):  
Stress Intensity ◽  
Interface Crack ◽  
Present Method ◽  
Body Force ◽  
The Body ◽  
Intensity Factors ◽  
Force Method ◽  
Kinked Crack ◽  
Body Force Method ◽  
Crack Tips

In this study, the stress intensity factor (SIF) of an interface kinked crack is analyzed by the singular integral equation of the body force method. The problem can be expressed by distributing the body force doublets of the tension and shear types along all the boundaries of the kinked and interface crack parts. The SIFs can be obtained directly from the densities of the body force doublets at the crack tips. Although the problem has already been calculated using the crack connection model, the accuracy of the analysis has not been clarified. From the analysis results in this study, it can be seen that the SIFs calculated by the crack connection model have a nonnegligible error, and the present method gives more accurate results. The advantage of the present method is that the SIFs of the kinked and the interface crack tips can be obtained at the same time with high accuracy.

The Interface Crack

1977 ◽  
Vol 44 (4) ◽  
pp. 631-636 ◽  
Author(s):  
Maria Comninou
Keyword(s):  
Stress Intensity Factor ◽  
Stress Intensity ◽  
Intensity Factor ◽  
Interface Crack ◽  
Singular Integral ◽  
Singular Integral Equations ◽  
Open Crack ◽  
Intensity Factors ◽  
Frictionless Contact ◽  
Crack Faces

It is known that oscillatory singularities appear in problems involving interface cracks that are assumed to have open tips. An unsatisfactory aspect of the oscillatory singularities is that they lead to overlapping of the crack faces. The interface crack in a tension field, originally treated by England among others, is thus reconsidered on the basis that the crack is not completely open and that its faces are in frictionless contact near the tips. The formulation leads to a pair of coupled singular integral equations. The singularities, no longer oscillatory, exhibit some unusual features and indicate that the spreading of the interface crack in a tension field is intimately connected with failure in shear. A new stress-intensity factor is obtained and compared to the stress-intensity factors for the completely open crack.

scholarly journals Interaction between line cracks in an orthotropic layer

2002 ◽  
Vol 29 (1) ◽  
pp. 31-42 ◽  
Author(s):  
Subir Das
Keyword(s):  
Fourier Transform ◽  
Stress Intensity ◽  
Finite Thickness ◽  
Intensity Factors ◽  
Orthotropic Layer ◽  
Finite Hilbert Transform ◽  
Crack Tips ◽  
The Fourier Transform ◽  
Analytical Expressions ◽  
Elastostatic Problem

We deal with the interaction between three coplanar Griffith cracks located symmetrically in the mid plane of an orthotropic layer of finite thickness2h. The Fourier transform technique is used to reduce the elastostatic problem to the solution of a set of integral equations which have been solved by using the finite Hilbert transform technique and Cooke's result. The analytical expressions for the stress intensity factors at the crack tips are obtained for largeh. Numerical values of the interaction effect have been computed for and results show that interaction effects are either shielding or amplification depending on the location of each crack with respect to each other and crack tip spacing as well as the thickness of the layer.

Reliability Evaluation of Flip Chip Using Stress Intensity Factors of an Interface Crack

2003 ◽  
Author(s):  
Won-Keun Kim ◽  
Toru Ikeda ◽  
Noriyuki Miyazaki
Keyword(s):  
Stress Intensity ◽  
Interface Crack ◽  
Stress Intensity Factors ◽  
Flip Chip ◽  
Liquid Crystal Display ◽  
Dissimilar Materials ◽  
Circuit Board ◽  
Electrical Performance ◽  
Intensity Factors ◽  
Adhesive Film

Anisotropic Conductive Adhesive Film (ACF) has been used for electronic assemblies such as the connection between a Liquid Crystal Display (LCD) panel and a flexible print circuit board (FPC). ACF is expected to be a key technology for flip chip packaging and chip size packaging. The goal of our work is to provide an optimum design scheme to achieve the best combination of electrical performance and mechanical reliability for electronic packages using the ACF. This study presents an evaluation technology for the delamination of the ACF connections. We utilized the stress intensity factors of an interface crack between jointed dissimilar materials. The evaluation technology presented herein was found to provide reliability of an electronic package using the ACF connection during the solder reflow process.

Acousto-elastic measurement of stress and stress intensity factors around crack tips

Ultrasonics ◽  
1983 ◽  
Vol 21 (2) ◽  
pp. 57-64 ◽  
Author(s):  
A.V. Clark ◽  
R.B. Mignogna ◽  
R.J. Sanford
Keyword(s):  
Stress Intensity ◽  
Stress Intensity Factors ◽  
Intensity Factors ◽  
Crack Tips
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