Anisotropic Elastic Elliptical Inclusion Problem in Generalized Plane Strain

1975 ◽  
Vol 42 (1) ◽  
pp. 236-237 ◽  
Author(s):  
R. D. Bhargava ◽  
H. S. Saxena
Keyword(s):  
Plane Strain ◽  
Inclusion Problem ◽  
Elliptical Inclusion ◽  
Anisotropic Elastic ◽  
Generalized Plane Strain

scholarly journals Generalized Plane Strain Elasticity Problems

1995 ◽  
Author(s):  
A.H.-D. Cheng ◽  
J.J. Rencis ◽  
Y. Abousleiman
Keyword(s):  
Plane Strain ◽  
Elasticity Problems ◽  
Generalized Plane Strain

Curvature and Out-of-Plane-Strain for Generalized Plane Strain

1972 ◽  
Vol 39 (3) ◽  
pp. 827-829 ◽  
Author(s):  
V. J. Parks
Keyword(s):  
Plane Strain ◽  
Cross Section ◽  
Central Region ◽  
Transverse Cross Section ◽  
Infinite Length ◽  
Out Of Plane ◽  
Plane Solution ◽  
Generalized Plane Strain

Out-of-plane strains and stresses are determined using reciprocity for the central region of very long bars (approaching infinite length) of uniform transverse cross section subjected to the same in-plane loads on every cross section. The loading explicitly specifies no end loads on the bars. The results are obtained without recourse to the in-plane solution. Conversely the end force and moment are determined for the case where the out-of-plane strain is zero.

Thermal Stresses in Layered Electrical Assemblies Bonded With Solder

1991 ◽  
Vol 113 (4) ◽  
pp. 350-354 ◽  
Author(s):  
H. S. Morgan
Keyword(s):  
Residual Stresses ◽  
Plane Strain ◽  
3D Model ◽  
Thermal Stresses ◽  
Three Dimensional ◽  
Creep Models ◽  
Strain Model ◽  
Maximum Stresses ◽  
Generalized Plane Strain ◽  
Plane Strain Model

Thermal stresses in a layered electrical assembly joined with solder are computed with plane strain, generalized plane strain, and three-dimensional (3D) finite element models to assess the accuracy of the two-dimensional (2D) modeling assumptions. Cases in which the solder is treated as an elastic and as a creeping material are considered. Comparison of the various solutions shows that, away from the corners, the generalized plane strain model produces residual stresses that are identical to those computed with the 3D model. Although the generalized plane strain model cannot capture corner stresses, the maximum stresses computed with this 2D model are, for the mesh discretization used, within 12 percent of the corner stresses computed with the 3D model when the solder is modeled elastically and within 5 percent when the solder is modeled as a creeping material. Plane strain is not a valid assumption for predicting thermal stresses, especially when creep of the solder is modeled. The effect of cooling rate on the residual stresses computed with creep models is illustrated.

Generalized plane strain analysis of superconducting solenoids

1999 ◽  
Vol 86 (12) ◽  
pp. 7039-7051 ◽  
Author(s):  
W. Denis Markiewicz ◽  
Mohammad Reza Vaghar ◽  
Iain R. Dixon ◽  
Hamid Garmestani
Keyword(s):  
Plane Strain ◽  
Strain Analysis ◽  
Generalized Plane Strain
Sign in / Sign up

Export Citation Format

Share Document