Control of Surface Finishing Residual Stresses in Magnetic Recording Head Materials

1988 ◽  
Vol 110 (1) ◽  
pp. 87-92 ◽  
Author(s):  
S. Chandrasekar ◽  
B. Bhushan
Keyword(s):  
Residual Stress ◽  
Residual Stresses ◽  
Magnetic Recording ◽  
Surface Finishing ◽  
Recording Head ◽  
Surface Residual Stresses ◽  
Mechanical And Physical Properties ◽  
Magnetic Recording Head ◽  
Processing Techniques

Surface finishing of magnetic recording head materials, such as ferrites, by diamond grinding and lapping results in a residual compressive stress on the surface. Residual stresses alter the magnetic properties of the ferrite causing the recording head performance to deteriorate. Hence, they need to be minimized. This paper considers the role of two processing techniques—annealing and chemical lapping—in controlling residual stress in ferrites. The effect of these processing techniques on various mechanical and physical properties of finished ferrites and the mechanism of residual stress control are discussed.

Nondestructive Measurement of In-Plane Residual Stress in Silicon Strips

1999 ◽  
Vol 591 ◽  
Author(s):  
Tieyu Zheng ◽  
Steven Danyluk
Keyword(s):  
Residual Stress ◽  
Residual Stresses ◽  
Large Deflection ◽  
Thin Plates ◽  
Nondestructive Measurement ◽  
Three Point Bending ◽  
Phase Stepping ◽  
Bending Load ◽  
Bending Loads ◽  
Processing Techniques

ABSTRACTThis paper reports the development of a shadow moiré technique to measure the in-plane residual stresses of thin, flat strips. This is an extension of prior work on the measurement of in-plane residual stresses in silicon plates and wafers. Phase stepping shadow moir6 and digital image processing techniques are employed to measure the deflections of the silicon plate specimens subjected to three-point-bending at several different loads. The measured deflections over the area of the silicon plates are fitted with an equation represented by a 2-D polynomial. With the theory of thin plates with large deflection, the fitting coefficients are used to extract the in-plane stresses at the different bending load. The residual stress is resolved by linear regression of the in-plane stresses versus bending loads.

Magnetic recording head using ribbon-Sendust

1981 ◽  
Vol 17 (6) ◽  
pp. 3111-3113 ◽  
Author(s):  
N. Tsuya ◽  
T. Tsukagoshi ◽  
K. Arai ◽  
K. Ogasawara ◽  
K. Ohmori ◽  
...  
Keyword(s):  
Magnetic Recording ◽  
Recording Head ◽  
Magnetic Recording Head

Study on the Correlativity between Grinding Parameters and Surface Residual Stresses in Ceramic

2008 ◽  
Vol 375-376 ◽  
pp. 480-484 ◽  
Author(s):  
Guang Xiu Zhang ◽  
Bin Lin ◽  
Zhen Peng Shi
Keyword(s):  
Residual Stress ◽  
Finite Element ◽  
Residual Stresses ◽  
Mechanical Effect ◽  
Diffraction Measurement ◽  
Depth Of Penetration ◽  
Surface Residual Stress ◽  
Grinding Parameters ◽  
Surface Residual Stresses ◽  
Element Simulation

The generation and distribution of workpiece surface and sub-surface residual stress were predicted through the dynamic finite element simulation of the grinding ceramic process. The base of the simulation is that the thermo elastic-plastic finite element theory and the coupling of grinding forces and temperature were adopted. The results obtained from X-ray diffraction measurement compared well with the values calculated from theory. The correlation between grinding parameters and the ceramic residual stresses was investigated. The research results show that the normal grinding force is the primary factor responsible for the generation of residual stress in grinding ceramic. The mechanical effect of the grains is to affect the magnitude, the depth of penetration and the gradient of the residual stresses.

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