Mechanical Analysis for Thermal Grease Enhanced Modules Enclosing a Silicon Chip
Keyword(s):
In metallized ceramic technology substantial mechanical stresses arise in assembly, insertion and cyclic thermal loading of thermally enhanced modules. This paper describes some experimental and analytical investigations performed for safeguarding the structural integrity of modules in which heat conduction from the chip to the module cap was enhanced by a “thermal grease” compound.
2018 ◽
Vol 28
(3)
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pp. 259-269
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1998 ◽
Vol 33
(1)
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pp. 55-65
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Keyword(s):
2010 ◽
Vol 24
(10)
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pp. 1869-1877
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2003 ◽
Vol 27
(11)
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pp. 883-904
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