Chemically Driven Deformation of Polymers

1989 ◽  
Vol 111 (1) ◽  
pp. 68-73 ◽  
Author(s):  
C.-Y. Hui ◽  
K.-C. Wu ◽  
Ronald C. Lasky ◽  
Edward J. Kramer

Chemically driven deformation of polymer glasses is important in a variety of electronic packaging applications ranging from stripping of photoresists to diffusion of processing liquids into printed circuit boards. The swelling of such glasses by small molecules requires the deformation of polymer chains, a deformation that can be modelled as driven by an osmotic pressure. Equations governing the rate of this process are developed and the predictions are compared with the results of experiments in which the volume fraction φ of iodohexane (IOH) sorbed at the surface of polystyrene is measured as a function of exposure time. Once a critical φ is reached, a diffusion front develops and moves into the polymer at a constant velocity. The velocity V of this front can be predicted quantitatively from V=D(φm)a′(φm)a(φm)∂φ∂tφm where D is the diffusion coefficient of the IOH in the glass, a, and a′ are the activity of IOH and its derivative with respect to φ and the subscript m signifies that the quantities are evaluated at the volume fraction of the maximum osmotic pressure ahead of the front. The φ(t) and V predicted by a pressure dependent viscous swelling model for ∂φ/∂t are in good agreement with the experimental results at low IOH activities.

2020 ◽  
Vol 38 (11) ◽  
pp. 1251-1258 ◽  
Author(s):  
Jingjing Xiong ◽  
Shaoqi Yu ◽  
Daidai Wu ◽  
Xiaoshu Lü ◽  
Junhong Tang ◽  
...  

Advanced thermal treatment of electronic waste offers advantages of volume reduction and energy recovery. In this work, the pyrolysis behaviour of nonmetallic fractions of waste printed circuit boards was studied. The fate of a bromine and thermal decomposition pathway of nonmetallic fractions of waste printed circuit boards were further probed. The thermogravimetric analysis showed that the temperatures of maximum mass loss were located at 319°C and 361°C, with mass loss of 29.6% and 50.6%, respectively. The Fourier transform infrared Spectroscopy analysis revealed that the spectra at temperatures of 300°C–400°C were complicated with larger absorbance intensity. The nonmetallic fractions of waste printed circuit boards decomposed drastically and more evolved products were detected in the temperature range of 600°C–1000°C. The gas chromatography–mass spectrometry analysis indicated that various brominated derivates were generated in addition to small molecules, such as CH4, H2O and CO. The release intensity of CH4 and H2O increased with temperature increasing and reached maximum at 600°C–800°C and 400°C–600°C. More bromoethane (C2H5Br) was formed as compared with HBr and methyl bromide (CH3Br). The release intensity of bromopropane (C3H7Br) and bromoacetone (C3H5BrO) were comparable, although smaller than that of bromopropene (C3H5Br). More dibromophenol (C6H4Br2O) was released than that of bromophenol (C6H5BrO) in the thermal treatment. During the thermal process, part of the ether bonds first ruptured forming bisphenol A, propyl alcohol and tetrabromobisphenol A. Then, the tetrabromobisphenol A decomposed into C6H5BrO and HBr, which further reacted with small molecules forming brominated derivates. It implied debromination of raw nonmetallic fractions of waste printed circuit boards or pyrolysis products should be applied for its environmentally sound treating.


2008 ◽  
Vol 128 (11) ◽  
pp. 657-662 ◽  
Author(s):  
Tsuyoshi Maeno ◽  
Yukihiko Sakurai ◽  
Takanori Unou ◽  
Kouji Ichikawa ◽  
Osamu Fujiwara

2018 ◽  
Vol 23 (2) ◽  
pp. 141-148
Author(s):  
S.Sh. Rekhviashvili ◽  
◽  
M.O. Mamchuev ◽  
V.V. Narozhnov ◽  
M.M. Oshkhunov ◽  
...  

2013 ◽  
Vol 61 (3) ◽  
pp. 731-735
Author(s):  
A.W. Stadler ◽  
Z. Zawiślak ◽  
W. Stęplewski ◽  
A. Dziedzic

Abstract. Noise studies of planar thin-film Ni-P resistors made in/on Printed Circuit Boards, both covered with two different types of cladding or uncladded have been described. The resistors have been made of the resistive-conductive-material (Ohmega-Ply©) of 100 Ώ/sq. Noise of the selected pairs of samples has been measured in the DC resistance bridge with a transformer as the first stage in a signal path. 1/f noise caused by resistance fluctuations has been found to be the main noise component. Parameters describing noise properties of the resistors have been calculated and then compared with the parameters of other previously studied thin- and thick-film resistive materials.


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