Overview of Micro Heat Pipe Research and Development

1992 ◽  
Vol 45 (5) ◽  
pp. 175-189 ◽  
Author(s):  
G. P. Peterson

The concept of a micro heat pipe was first proposed in 1984. Since that time, numerous analytical and experimental investigations have been conducted to determine the fundamental parameters that govern the operation of these devices. Micro heat pipes ranging in size from 1 mm in diameter and 60 mm in length to 30 μm in diameter and 10 mm in length have been analyzed, modelled, and fabricated. The following review describes the historical development of these devices, along with the analytical and numerical techniques used to model and predict their performance and the results of several recent experimental investigations. Because of recent advances in the development of micro heat pipes fabricated as an integral part of semiconductor wafers, particular emphasis has been placed on various construction and charging methods currently under investigation.

1995 ◽  
Vol 117 (1) ◽  
pp. 75-81 ◽  
Author(s):  
A. K. Mallik ◽  
G. P. Peterson

An experimental investigation of vapor deposited micro heat pipe arrays was conducted using arrays of 34 and 66 micro heat pipes occupying 0.75 and 1.45 percent of the cross-sectional area, respectively. The performance of wafers containing the arrays was compared with that of a plain silicon wafer. All of the wafers had 8 × 8 mm thermofoil heaters located on the bottom surface to simulate the active devices in an actual application. The temperature distributions across the wafers were obtained using a Hughes Probeye TVS Infrared Thermal Imaging System and a standard VHS video recorder. For wafers containing arrays of 34 vapor deposited micro heat pipes, the steady-state experimental data indicated a reduction in the maximum surface temperature and temperature gradients of 24.4 and 27.4 percent, respectively, coupled with an improvement in the effective thermal conductivity of 41.7 percent. For wafers containing arrays of 66 vapor deposited micro heat pipes, the corresponding reductions in the surface temperature and temperature gradients were 29.0 and 41.7 percent, respectively, and the effective thermal conductivity increased 47.1 percent, for input heat fluxes of 4.70 W/cm2. The experimental results were compared with the results of a previously developed numerical model, which was shown to predict the temperature distribution with a high degree of accuracy, for wafers both with and without the heat pipe arrays.


2020 ◽  
Vol 21 (3) ◽  
pp. 309
Author(s):  
Maryam Fallah Abbasi ◽  
Hossein Shokouhmand ◽  
Morteza Khayat

Electronic industries have always been trying to improve the efficiency of electronic devices with small dimensions through thermal management of this equipment, thus increasing the use of small thermal sinks. In this study micro heat pipes with triangular and square cross sections have been manufactured and tested. One of the main objectives is to obtain an understanding of micro heat pipes and their role in energy transmission with electrical double layer (EDL). Micro heat pipes are highly efficient heat transfer devices, which use the continuous evaporation/condensation of a suitable working fluid for two-phase heat transport in a closed system. Since the latent heat of vaporization is very large, heat pipes transport heat at small temperature difference, with high rates. Because of variety of advantage features these devices have found a number of applications both in space and terrestrial technologies. The theory of operation micro heat pipes with EDL is described and the micro heat pipe has been studied. The temperature distribution have achieved through five thermocouples installed on the body. Water and different solution mixture of water and ethanol have used to investigate effect of the electric double layer heat transfer. It was noticed that the electric double layer of ionized fluid has caused reduction of heat transfer.


Author(s):  
Jin Zhang ◽  
Harris Wong

Micro heat pipes have been used in cooling micro electronic components. However their effective thermal conductivity is low compared with that of conventional heat pipes. Due to the complexity of the coupled heat and mass transport, and to the complicated three-dimensional bubble geometry inside micro heat pipes, there is a lack of rigorous analysis. As a result, the relatively low effective thermal conductivity remains unexplained. We have conceptualized an idealized micro heat pipe that eliminates the complicated geometry, but retains the essential physics. Given the simplified geometry, many effects can be studied, such as thermocapillary flow, and evaporation and condensation physics. In this talk, we will present the flow field induced by evaporation.


Author(s):  
Yao-Hua Zhao ◽  
Fei-Long Zou ◽  
Yan-Hua Diao ◽  
Zhen-Hua Quan

The performance of a new flat plate solar heat collector with perfect combination of high efficiency and low cost is investigated experimentally. The new system described in this study uses a novel micro heat pipe array as a key component for the system. One such flat plate heat collector contains over 300 micro heat pipes per 1m2 and the hydraulic diameter of the micro heat pipes is 0.4–1.0mm. A detailed heat transfer experimental study is conducted during daylight hours over several months, focusing on the collector efficiency and overall efficiency of the system as well as total heat loss factor. The results show that the collector’s maximum instantaneous efficiency is up to 88%. Compared with conventional evacuated glass tube solar water heater, the system offers the additional benefits of high pressure resistance, low weight, good reliability and durability, easy integration into buildings and absence of freezing during winter months. Besides, compared with traditional flat-plate solar water system which is mainly sheet-and-tube concept, the system also shows many advantages: higher efficiency, much cheaper, absence of tube-bonding and freezing etc. Therefore, the system proposes a unique substitute to common solar water heating systems.


2010 ◽  
Vol 2010 (DPC) ◽  
pp. 001760-001807
Author(s):  
Daniel K. Harris ◽  
Robert Dean ◽  
Ashish Palkar ◽  
Gary Wonacott

The concept of heat pipes was introduced by R.S.Gaugler in 1940s and Cotter first introduced the idea of “micro” heat pipes in 1984. Cotter in his paper, defined the micro heat pipe as being one in which the mean curvature of the vapor-liquid interface is comparable in magnitude to the reciprocal of the hydraulic radius of the total flow channel. The Micro Heat Pipes (MHPs) work efficiently through the use of two-phase heat transfer. Various working fluids have been tried in combination with various substrate materials. In this experimental work the main focus was to study the behavior of liquid metal filled MHPs made from silicon as the substrate material. Specially designed MHPs were assembled and charged with mercury as the working fluid. A special test setup was designed and built for the experimental work and the response of the MHPs to the controlled increment in the input power is presented. A number of experiments were carried out on the specimen MHPs to determine their effective thermal conductivity, the variation of the temperature along the axial length and the performance enhancement factor. Effective thermal conductivities as high as 900 W/m-K with a silicon equivalence of 6 were achieved with the liquid metal MHP. Based on the results from the various performance testing parameters, it was observed that the liquid metal charged MHPs performed substantially better than conventional MHPs filled with organic working fluids. The limitations and the possible methods of improving the performance of the MHPs are discussed.


1995 ◽  
Vol 117 (1) ◽  
pp. 82-87 ◽  
Author(s):  
G. P. Peterson ◽  
A. K. Mallik

The transient thermal response of vapor deposited micro heat pipe arrays fabricated as an integral part of silicon wafers was measured to determine if these arrays could be used to reduce the local temperature gradients and improve the reliability of semiconductor devices. Wafers with arrays of 34 and 66 micro heat pipes were evaluated using an IR thermal imaging system in conjunction with a VHS video recorder. These arrays occupied 0.75 and 1.45 percent, of the wafer cross-sectional area, respectively. The wafers with micro heat pipe arrays demonstrated a 30 to 45 percent reduction in the thermal time constant when compared to that obtained for plain silicon wafers. This reduction in response time was shown to lead to a significant reduction in the maximum wafer temperature, due to the increased effective thermal conductivity caused by the vaporization and condensation occurring in the individual micro heat pipes. The experimental results were then used to validate a transient numerical model, capable of accurately predicting the transient temperature profile and thermal time constant of the wafer/heat pipe combinations.


2015 ◽  
Vol 789-790 ◽  
pp. 422-425
Author(s):  
Fun Liang Chang ◽  
Yew Mun Hung

Micro heat pipe is a two-phase heat transfer device offering effective high heat-flux removal in electronics cooling. Essentially, micro heat pipe relies on the phase change processes, namely evaporation and condensation, and the circulation of working fluid to function as heat transfer equipment. The vast applications of micro heat pipe in portable appliances necessitate its functionality under different orientations with respect to gravity. Therefore, its thermal performance is strongly related to its orientation. By incorporating solid wall conduction, together with the continuity, momentum, and energy equations of the working fluid, a mathematical model is developed to investigate the heat and fluid flow characteristics of inclined micro heat pipes. We investigate both the favorable and adverse effects of gravity on the circulation rate which is intimately related to the thermal performance of micro heat pipes. The effects of gravity, through the angle of inclination, on the circulation strength and heat transport capacity are analysed. This study serves as a useful analytical tool in the micro heat pipe design and performance analysis, associated with different inclinations and operating conditions.


2010 ◽  
Vol 29-32 ◽  
pp. 1695-1700
Author(s):  
Shi Gang Wang ◽  
Xi Bing Li ◽  
Bai Rui Tao ◽  
Hong Xia Zhang

Through combination of experimental investigation with theoretical optimum design, this paper determined the crucial factors in affecting the heat transfer capacity in micro heat pipes with a trapezium-grooved wick structure are capillary limit and entrainment limit, and verified the validity of the heat transfer models thus built.


1993 ◽  
Vol 115 (3) ◽  
pp. 751-756 ◽  
Author(s):  
G. P. Peterson ◽  
A. B. Duncan ◽  
M. H. Weichold

An experimental investigation was conducted to determine the thermal behavior of arrays of micro heat pipes fabricated in silicon wafers. Two types of micro heat pipe arrays were evaluated, one that utilized machined rectangular channels 45 μm wide and 80 μm deep and the other that used an anisotropic etching process to produce triangular channels 120 μm wide and 80 μm deep. Once fabricated, a clear pyrex cover plate was bonded to the top surface of each wafer using an ultraviolet bonding technique to form the micro heat pipe array. These micro heat pipe arrays were then evacuated and charged with a predetermined amount of methanol. Using an infrared thermal imaging unit, the temperature gradients and maximum localized temperatures were measured and an effective thermal conductivity was computed. The experimental results were compared with those obtained for a plain silicon wafer and indicated that incorporating an array of micro heat pipes as an integral part of semiconductor devices could significantly increase the effective thermal conductivity; decrease the temperature gradients occurring across the wafer; decrease the maximum wafer temperatures; and reduce the number and intensity of localized hot spots. At an input power of 4 W, reductions in the maximum chip temperature of 14.1°C and 24.9°C and increases in the effective thermal conductivity of 31 and 81 percent were measured for the machined rectangular and etched triangular heat pipe arrays, respectively. In addition to reducing the maximum wafer temperature and increasing the effective thermal conductivity, the incorporation of the micro heat pipe arrays was found to improve the transient thermal response of the silicon test wafers significantly.


1994 ◽  
Vol 116 (3) ◽  
pp. 709-715 ◽  
Author(s):  
J. P. Longtin ◽  
B. Badran ◽  
F. M. Gerner

Micro heat pipes are small structures that will be used to cool microscale devices. They function much like their conventional counterparts, with a few exceptions, most notably the absence of a wick. It is expected that water-filled micro heat pipes will be able to dissipate heat fluxes on the order of 10–15 W/cm2 (100,000–150,000 W/m2). This work addresses the modeling of a micro heat pipe operating under steady-state conditions. A one-dimensional model of the evaporator and adiabatic sections is developed and solved numerically to yield pressure, velocity, and film thickness information along the length of the pipe. Interfacial and vapor shear stress terms have been included in the model. Convection and body force terms have also been included in the momentum equation, although numerical experiments have shown them to be negligible. Pressure, velocity, and film thickness results are presented along with the maximum heat load dependence on pipe length and width. Both simple scaling and the model results show that the maximum heat transport capability of a micro heat pipe varies with the inverse of its length and the cube of its hydraulic diameter, implying the largest, shortest pipes possible should be used.


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