Fully Lagrangian Modeling of Dynamics of MEMS With Thin Beams—Part I: Undamped Vibrations

2009 ◽  
Vol 76 (5) ◽  
Author(s):  
Ranajay Ghosh ◽  
Subrata Mukherjee

Micro-electro-mechanical systems (MEMSs) often use beam or plate shaped conductors that can be very thin—with h/L≈O(10–2–10–3) (in terms of the thickness h and length L of the beam or side of a square plate). Such MEMS devices find applications in microsensors, micro-actuators, microjets, microspeakers, and other systems where the conducting beams or plates oscillate at very high frequencies. Conventional boundary element method analysis of the electric field in a region exterior to such thin conductors can become difficult to carry out accurately and efficiently—especially since MEMS analysis requires computation of charge densities (and then surface traction) separately on the top and bottom surfaces of such beams. A new boundary integral equation has been proposed to handle the computation of charge densities for such high aspect ratio geometries. In the current work, this has been coupled with the finite element method to obtain the response behavior of devices made of such high aspect ratio structural members. This coupling of electrical and mechanical problems is carried out using a Newton scheme based on a Lagrangian description of the electrical and mechanical domains. The numerical results are presented in this paper for the dynamic behavior of the coupled MEMS without damping. The effect of gap between a beam and the ground, on mechanical response of a beam subjected to increasing electric potential, is studied carefully. Damping is considered in the companion paper (Ghosh and Mukherjee, 2009, “Fully Lagrangian Modeling of Dynamics of MEMS With Thin Beams—Part II: Damped Vibrations,” ASME J. Appl. Mech. 76, p. 051008).

2009 ◽  
Vol 76 (5) ◽  
Author(s):  
Ranajay Ghosh ◽  
Subrata Mukherjee

Micro-electro-mechanical systems (MEMS) often use beam or plate shaped conductors that are very thin with h/L≈O(10−2–10−3) (in terms of the thickness h and length L of a beam or side of a square plate). A companion paper (Ghosh and Mukherjee, 2009, “Fully Lagrangian Modeling of Dynamics of MEMS With Thin Beams—Part I: Undamped Vibrations,” ASME J. Appl. Mech., 76, p. 051007) addresses the coupled electromechanical problem of MEMS devices composed of thin beams. A new boundary element method (BEM) is coupled with the finite element method (FEM) by Ghosh and Mukherjee, and undamped vibrations are addressed there. The effect of damping due to the surrounding fluid modeled as Stokes flow is included in the present paper. Here, the elastic field modeled by the FEM is coupled with the applied electric field and the fluid field, both modeled by the BEM. As for the electric field, the BEM is adapted to efficiently handle narrow gaps between thin beams for the Stokes flow problem. The coupling of the various fields is carried out using a Newton scheme based on a Lagrangian description of the various domains. Numerical results are presented for damped vibrations of MEMS beams.


2017 ◽  
Vol 158 ◽  
pp. 314-327 ◽  
Author(s):  
Y. Guo ◽  
C. Wassgren ◽  
B. Hancock ◽  
W. Ketterhagen ◽  
J. Curtis

Author(s):  
Tim P. Pusch ◽  
Mario D’Auria ◽  
Nima Tolou ◽  
Andrew S. Holmes

While thin beams are widely used structural elements in Micro-Electro-Mechanical-Systems (MEMS) there are very few studies investigating the laser machining of clean high aspect ratio silicon beams. This work presents a systematic study of selected influencing cutting parameters with the goal of machining high aspect ratio beams with low side wall surface roughness (Ra) and high cross section verticality, i.e. low taper angle. The Taguchi method was used to find the optimal setting for each of the selected parameters (pulse frequency, laser diode current, pulse overlap, number of patterns to be marked, gap size between patterns) utilizing orthogonal arrays and signal-to-noise (S/N) ratio analysis. Double-sided clamped beams of 100μm width and 10mm length were machined in silicon wafers of 525μm thickness using a nanosecond solid-state UV laser system (355nm wavelength). Our experimental results show that beams with an aspect ratio as high as 17.5 can be manufactured. Furthermore, a surface roughness of Ra = 0.37μm and taper angle of α = 2.52 degrees can be achieved. This will make the fast fabrication of MEMS devices with aspect ratios as high as those from deep reactive ion etching possible.


2012 ◽  
Vol 1474 ◽  
Author(s):  
K. Mehrotra ◽  
H.P. Howard ◽  
S.D. Jacobs ◽  
J.C. Lambropoulos

ABSTRACTWe measure the mechanical response of optical multilayer dielectric (MLD) diffraction gratings, geometries which are constrained in only one transverse direction but free in the other, using nanoindentation. The results are explained using a stress-strain model, which reveals a uniaxial yield stress of 4.1- 4.6 GPa and predicts a similar dependence of yield stress on loads for both fully-elastic and fully-plastic solutions. Following R. Hill’s model of an expanding cavity under internal pressure, we show that the indentation response of the high-aspect ratio “pillar” geometry can be expressed in terms of uniaxial yield stress rather than material hardness.


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