Design of Heat Conduction Panel: The Case of Multiple Heating Elements Cooled by a Displaced Heat Sink

2008 ◽  
Vol 130 (4) ◽  
Author(s):  
Wataru Nakayama
Keyword(s):  
Genetic Algorithm ◽  
Heat Conduction ◽  
Heat Source ◽  
Heat Sink ◽  
Thickness Distribution ◽  
Heat Sources ◽  
Optimum Thickness ◽  
Maximum Heat ◽  
Generic Representation ◽  
Spatially Varying

This paper reports the design study performed on a heat conduction panel having several heat sources at separate locations and a heat sink on one of the panel corners. The panel is given a thickness distribution so as to provide spatially varying heat conduction paths from the heat sources to the heat sink. The objective of thickness distribution design is to reduce the variation among heat source temperatures and the maximum heat source temperature simultaneously. The genetic algorithm is used to search for an optimum thickness distribution. The problem is a generic representation of the situations that are becoming common in a compact electronic equipment.

scholarly journals Using Graphene-Based Grease as a Heat Conduction Material for Hectowatt-Level LEDs: A Natural Convection Experiment

Processes ◽  
2021 ◽  
Vol 9 (5) ◽  
pp. 847
Author(s):  
Chih-Neng Hsu ◽  
Keng-Wei Lee ◽  
Chun-Chih Chen
Keyword(s):  
Heat Transfer ◽  
Heat Conduction ◽  
Natural Convection ◽  
Heat Source ◽  
Thermal Performance ◽  
Contact Surface ◽  
Heat Sink ◽  
Heat Sources ◽  
Light Emitting ◽  
Performance Capacity

In this study, a self-adjusting concentration of graphene thermal grease was developed to reduce the contact surface thermal resistance of 50 W light-emitting diodes (LEDs). The purpose was to identify an important type of heat conduction material with a high thermal conductivity coefficient, which can be applied to the contact surface of various high-heat sources or concentrated heat sources to achieve seamless heat transfer with an extremely low thermal resistance state. The contact heat conduction material conductivity reached the highest K value of 13.4 W/m·K with a 15 wt.% self-adjusting concentration of graphene grease. This material could continuously achieve a completely uniform and rapid thermal diffusion of heat energy. Therefore, we performed an analysis of chip-on-board light-emitting diodes (LEDs) with a highly concentrated heat source, which showed excellent heat dissipation under natural convection heat transfer. As such, this study achieved the natural convection mechanism and a heat sink volume thermal performance capacity of 473,750 mm3 for LEDs under 50 W, but those over 50 W require an enhanced forced convection solution and a heat sink volume thermal performance capacity between 473,750 mm3 and 947,500 mm3. If the heat source dissipation reaches 100 W, the volume capacity must be at least 947,500 mm3 for lighting equipment applications. In the experimental study, we also verified and analyzed the research data, including an analysis of the measured data, grease component wt.%, heat sink material selection, increase in heat sink volume, heat transfer path, and contact surface, a discrimination analysis of infrared thermal images, and an analysis of flow visualization, which were conducted to ensure quantitative and qualitative improvement, provide a mechanism for judging the technical performance, and provide research results to enable discussion.

Research on Heat Conductivity with a Time-Varying Heat Source

2014 ◽  
Vol 698 ◽  
pp. 637-642
Author(s):  
Anton Eremin ◽  
Ekaterina Stefanyuk ◽  
Liubov Abisheva
Keyword(s):  
Heat Conduction ◽  
Heat Source ◽  
Heat Balance ◽  
Integral Method ◽  
Approximate Analytical Solution ◽  
Heat Conduction Problem ◽  
Time Varying ◽  
Heat Sources ◽  
Plate Temperature ◽  
The Heat Balance

Using additional boundary conditions in the integral method of the heat balance, an approximate analytical solution to the heat conduction problem for an endless plate with time-varying heat sources has been found. It is shown that with any heat source capacity an unlimited plate temperature increase takes place in the course of time.

scholarly journals Cool Steam Method for Desalinating Seawater

Water ◽  
2019 ◽  
Vol 11 (11) ◽  
pp. 2385
Author(s):  
Pedro Arnau ◽  
Naeria Navarro ◽  
Javier Soraluce ◽  
Jose Martínez-Iglesias ◽  
Jorge Illas ◽  
...  
Keyword(s):  
Temperature Gradient ◽  
Heat Source ◽  
Latent Heat ◽  
Heat Sink ◽  
Low Grade ◽  
Heat Sources ◽  
Working Pressure ◽  
Multi Stage ◽  
Heat Of Evaporation ◽  
Low Grade Heat

Cool steam is an innovative distillation technology based on low-temperature thermal distillation (LTTD), which allows obtaining fresh water from non-safe water sources with substantially low energy consumption. LTTD consists of distilling at low temperatures by lowering the working pressure and making the most of low-grade heat sources (either natural or artificial) to evaporate water and then condensate it at a cooler heat sink. To perform the process, an external heat source is needed that provides the latent heat of evaporation and a temperature gradient to maintain the distillation cycle. Depending on the available temperature gradient, several stages can be implemented, leading to a multi-stage device. The cool steam device can thus be single or multi-stage, being raw water fed to every stage from the top and evaporated in contact with the warmer surface within the said stage. Acting as a heat carrier, the water vapor travels to the cooler surface and condensates in contact with it. The latent heat of condensation is then conducted through the conductive wall to the next stage. Net heat flux is then established from the heat source until the heat sink, allowing distilling water inside every parallel stage.

scholarly journals Heat Conduction Simulation of 2D Moving Heat Source Problems Using a Moving Mesh Method

2020 ◽  
Vol 2020 ◽  
pp. 1-16
Author(s):  
Zhicheng Hu ◽  
Zhihui Liu
Keyword(s):  
Heat Conduction ◽  
Heat Source ◽  
Transient Heat Conduction ◽  
Moving Mesh ◽  
Heat Sources ◽  
Two Dimensional ◽  
Moving Heat Source ◽  
Moving Mesh Method ◽  
Mesh Method ◽  
The One

This paper focuses on efficiently numerical investigation of two-dimensional heat conduction problems of material subjected to multiple moving Gaussian point heat sources. All heat sources are imposed on the inside of material and assumed to move along some specified straight lines or curves with time-dependent velocities. A simple but efficient moving mesh method, which continuously adjusts the two-dimensional mesh dimension by dimension upon the one-dimensional moving mesh partial differential equation with an appropriate monitor function of the temperature field, has been developed. The physical model problem is then solved on this adaptive moving mesh. Numerical experiments are presented to exhibit the capability of the proposed moving mesh algorithm to efficiently and accurately simulate the moving heat source problems. The transient heat conduction phenomena due to various parameters of the moving heat sources, including the number of heat sources and the types of motion, are well simulated and investigated.

Minimization of Heat Sink Mass Using CFD and Mathematical Optimization

1999 ◽  
Vol 121 (3) ◽  
pp. 143-147 ◽  
Author(s):  
K. J. Craig ◽  
D. J. de Kock ◽  
P. Gauche´
Keyword(s):  
Heat Source ◽  
Heat Sink ◽  
Mathematical Optimization ◽  
Optimization Techniques ◽  
Heat Sinks ◽  
Heat Sources ◽  
Cooling Fan ◽  
Design Variables ◽  
Multiparameter Problem ◽  
Heat Sink Temperature

This paper describes the use of CFD and mathematical optimization to minimise heat sink mass given a maximum allowable heat sink temperature, a constant cooling fan power and heat source. Heat sink designers have to consider a number of conflicting parameters. Heat transfer is influenced by, amongst others, heat sink properties (such as surface area), airflow bypass and the location of heat sources, whilst size and/or mass of the heat sink needs to be minimized. This multiparameter problem lends itself naturally to optimization techniques. In this study a commercial CFD code, STAR-CD, is linked to the DYNAMIC-Q method of Snyman. Five design variables are considered for three heat source cases. Optimal designs are obtained within six design iterations. The paper illustrates how mathematical optimization can be used to design compact heat sinks for different types of electronic enclosures.

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