An Analytical Solution of a One-Dimensional Thermal Contact Conductance Problem With One Heat Flux and One Insulated Boundary Condition

1992 ◽  
Vol 114 (2) ◽  
pp. 503-505 ◽  
Author(s):  
Y. M. Tsai ◽  
R. A. Crane
Keyword(s):  
Boundary Condition ◽  
Heat Flux ◽  
Analytical Solution ◽  
Thermal Contact ◽  
Thermal Contact Conductance ◽  
Contact Conductance ◽  
One Dimensional

A Model for Predicting Temperature of Electrofusion Joints for Polyethylene Pipes

2009 ◽  
Vol 131 (6) ◽  
Author(s):  
Jianfeng Shi ◽  
Jinyang Zheng ◽  
Weican Guo ◽  
Ping Xu ◽  
Yongquan Qin ◽  
...  
Keyword(s):  
Thermal Contact ◽  
Power Input ◽  
Ultrasonic Test ◽  
Thermal Contact Conductance ◽  
Transfer Model ◽  
Contact Conductance ◽  
One Dimensional ◽  
Polyethylene Pipes ◽  
Heating Wire ◽  
Good Agreement

With the increasing application of electrofusion (EF) welding in connecting polyethylene (PE) pipes for gas distribution, more effort has been invested to ensure the safety of the pipeline systems. The objective of this paper is to investigate and understand the temperature distribution during EF welding. A one-dimensional transient heat-transfer model was proposed, taking the variation in the rate of power input, the phase transition of PE, and the thermal contact conductance between heating wire and PE into consideration. Then, experiments were designed to verify the power input and the temperature. The measured values of the power input were shown to be in good agreement with the analytical results. Based on ultrasonic test (UT), a new “Eigen-line” method was presented, which overcomes the difficulties found in the thermocouples’ temperature measurements. The results demonstrate good agreements between prediction and experiment. Finally, based on the presented model, a detailed parametric study was carried out to investigate the influences of the variation in the power input, the physical properties of PE, and the thermal contact conductance between heating wire and surrounding PE.

Review of models for thermal contact conductance of metals

10.2514/3.870 ◽  
1997 ◽  
Vol 11 ◽  
pp. 129-140
Author(s):  
B. Merci ◽  
J. Steelant ◽  
J. Vierendeels ◽  
K. Riemslagh ◽  
E. Dick ◽  
...  
Keyword(s):  
Thermal Contact ◽  
Thermal Contact Conductance ◽  
Contact Conductance

Thermal contact conductance of adhesives for microelectronic systems

10.2514/3.871 ◽  
1997 ◽  
Vol 11 ◽  
pp. 141-145
Author(s):  
Andreas Haselbacher ◽  
Jiri Blazek ◽  
S. R. Mirmira ◽  
E. Marotta ◽  
L. S. Fletcher
Keyword(s):  
Thermal Contact ◽  
Thermal Contact Conductance ◽  
Contact Conductance
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