Thermomechanical Modeling of Direct Chip Interconnection Assembly

E. K. Buratynski

doi:10.1115/1.2909347

Thermomechanical Modeling of Direct Chip Interconnection Assembly

Journal of Electronic Packaging ◽

10.1115/1.2909347 ◽

1993 ◽

Vol 115 (4) ◽

pp. 382-391 ◽

Cited By ~ 3

Author(s):

E. K. Buratynski

Keyword(s):

Global Analysis ◽

Numerical Procedure ◽

Calibration Procedure ◽

Global Model ◽

Conductive Adhesive ◽

Local Model ◽

Assembly Process ◽

Anisotropic Properties ◽

Anisotropic Conductive Adhesive ◽

Thermomechanical Modeling

Efforts to model thermomechanical aspects of the Direct Chip Interconnection (DCI) assembly process are described. DCI is a method to simultaneously attach and electrically interconnect bare chips to a substrate using Anisotropic Conductive Adhesive Films (ACAF). Emphasis has been placed on describing the numerical procedure used in the analysis. The major components of the analysis include a calibration procedure to “numerically measure” anisotropic properties of the film, a curing model to capture “frozen-in” stresses, a global analysis that considers the overall assembly station but does not resolve details of the interconnection, and a local model, coupled to the global model, that resolves details about the interconnection. Typical results are shown to demonstrate the capabilities of the model.

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Issues in Assembly Process of Fine Pitch Chip-on-Flex Packages for LCD Applications

Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology ◽

10.1115/imece2004-59155 ◽

2004 ◽

Cited By ~ 2

Author(s):

Changsoo Jang ◽

Seongyoung Han ◽

Jay Ryu ◽

Hangyu Kim

Keyword(s):

Bonding Process ◽

Conductive Adhesive ◽

Assembly Process ◽

Anisotropic Conductive Adhesive ◽

Advantages And Disadvantages ◽

Fine Pitch ◽

Laser Bonding ◽

Material Process ◽

Process Combination ◽

Underfill Material

Some of the current assembly issues of fine pitch chip-on-flex (COF) packages for LCD applications are reviewed. Traditional underfill material, anisotropic conductive adhesive (ACA) and non-conductive adhesive (NCA) are considered in conjunction with two applicable bonding methods including thermal and laser bonding. Advantages and disadvantages of each material/process combination are identified. Their applicability is further investigated to identify a process most suitable to the fine pitch packages (less than 40 μm). Numerical results and subsequent testing results indicate that NCA/laser bonding process produces most reliable joint for the fine pitch packages.

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Novel Self-Assembly Process Using Magnetically Aligned $z$-Axis Anisotropic Conductive Adhesive for High-Density Vertical Interconnection

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2012.2186138 ◽

2012 ◽

Vol 2 (5) ◽

pp. 756-763 ◽

Cited By ~ 2

Author(s):

Sungwook Moon ◽

William J. Chappell

Keyword(s):

Self Assembly ◽

High Density ◽

Conductive Adhesive ◽

Assembly Process ◽

Anisotropic Conductive Adhesive ◽

Vertical Interconnection ◽

Magnetically Aligned

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Characterisation of Anisotropic Conductive Adhesive Compression During the Assembly Process

2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2 ◽

10.1115/ipack2003-35238 ◽

2003 ◽

Cited By ~ 3

Author(s):

David C. Whalley ◽

Helge Kristiansen ◽

Johan Liu

Keyword(s):

Continuous Monitoring ◽

Flow Distribution ◽

Conductive Adhesive ◽

Resin Flow ◽

Assembly Process ◽

Conductive Particle ◽

Compression Process ◽

Adhesive Resin ◽

Anisotropic Conductive Adhesive ◽

Adhesive Thickness

Models of the anisotropic conductive adhesive assembly process have previously been developed. Such models may be used to predict the time for adhesive resin flow out and whether this can be successfully achieved before resin cure. Modelling has also been used to provide significant insights into the effects of component and substrate bond pad geometry on the resin flow distribution and hence on the resulting conductive particle distribution. These models have however only been experimentally validated to a very limited extent. This paper will describe a new experimental technique, which has been developed to allow continuous monitoring of the adhesive thickness throughout the compression process. This technique applies a controlled assembly force through a linear “voice coil” type actuator and the resulting changes in capacitance of the adhesive material can be used to monitor its thickness. The data from tests using this technique show, for example, the effect of the conductor particle stiffness on the rate of adhesive compression during the later stages of the compression process. Such data will be used to further improve more sophisticated models of the ACA assembly process, which will both lead to a better understanding of the process and also facilitate establishment of design rules for different applications.

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Computational modelling of the anisotropic conductive adhesive assembly process

Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506) ◽

10.1109/emap.2001.984016 ◽

2002 ◽

Cited By ~ 5

Author(s):

D.C. Whalley ◽

G. Glinsky ◽

C. Bailey ◽

J. Liu

Keyword(s):

Computational Modelling ◽

Conductive Adhesive ◽

Assembly Process ◽

Anisotropic Conductive Adhesive

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Modeling of the buckstay system of membrane-walls in watertube boiler construction

Thermal Science ◽

10.2298/tsci120204174n ◽

2014 ◽

Vol 18 (suppl.1) ◽

pp. 59-72 ◽

Cited By ~ 3

Author(s):

Hasan Nagiar ◽

Tasko Maneski ◽

Vesna Milosevic-Mitic ◽

Branka Gacesa ◽

Nina Andjelic

Keyword(s):

Finite Element ◽

Orthotropic Plate ◽

Global Model ◽

Local Model ◽

Thermal Loads ◽

Water Tube ◽

Bending Load ◽

Specific Geometry ◽

Structural Parts ◽

Help Model

Membrane walls are very important structural parts of water-tube boiler construction. Based on their specific geometry, one special type of finite element was defined to help model the global boiler construction. That is the element of reduced orthotropic plate with two thicknesses and two elasticity matrixes, for membrane and bending load separately. A global model of the boiler construction showed that the high value of stress is concentrated in plates of the buckstay system in boiler corners. Validation of the new finite element was done on the local model of the part of membrane wall and buckstay. A very precise model of tubes and flanges was compared to the model formed on the element of a reduced orthotropic plate. Pressure and thermal loads were discussed. Obtained results indicated that the defined finite element was quite favorable in the design and reconstruction of the boiler substructures such as a buckstay system.

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Multiscale thermomechanical modeling of short fiber-reinforced composites

Science and Engineering of Composite Materials ◽

10.1515/secm-2015-0487 ◽

2017 ◽

Vol 24 (5) ◽

pp. 765-772 ◽

Cited By ~ 1

Author(s):

Dawei Jia ◽

Huiji Shi ◽

Lei Cheng

Keyword(s):

Thermal Loading ◽

Volume Fraction ◽

Numerical Procedure ◽

Thermal Conditions ◽

Cyclic Hardening ◽

Short Fiber ◽

Fiber Reinforced Composites ◽

Reinforced Composites ◽

Fiber Reinforced ◽

Thermomechanical Modeling

AbstractA study of the micromechanical behavior to predict the overall response of short fiber-reinforced composites under cyclic mechanical and thermal loading is presented. The instantaneous average over a “representative volume” of the material is considered. The influence of the short fiber’s aspect ratio, volume fraction, and spatial orientation has been investigated. The linear combined hardening model is used to describe the cyclic hardening effects in the case of metal matrix. A numerical procedure is used to predict the response of composites under mechanical and thermal conditions. The results of the numerical procedure have been compared to the results of three different models and to published experimental data.

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