Bending and Twisting of 60Sn40Pb Solder Interconnects With Creep
Keyword(s):
An exact analysis is presented for the creep deformation of a thin-walled circular solder cylinder under the actions of bending and twisting moments. Dimensionless interaction curves and charts which relate the variables, interconnect geometry, solder material properties, bending moment, twisting moment, curvature rate, and twist rate are also provided for engineering practice convenience.
1984 ◽
Vol 106
(1)
◽
pp. 79-83
◽
1984 ◽
Vol 106
(2)
◽
pp. 188-195
◽
1985 ◽
Vol 107
(1)
◽
pp. 225-230
◽
Keyword(s):
Keyword(s):
2021 ◽
pp. 104562
Keyword(s):
2021 ◽
Vol 62
(2)
◽
pp. 71-81