A Micromechanics Based Representation of Combined Mode I and II Toughness of Brittle Materials and Interfaces

1993 ◽  
Vol 115 (1) ◽  
pp. 101-105 ◽  
Author(s):  
J. Ahmad
Keyword(s):  
Experimental Data ◽  
Fracture Toughness ◽  
Brittle Materials ◽  
Mode I ◽  
Mode Ii ◽  
Mode Fracture ◽  
Bimaterial Interfaces ◽  
Mode Ii Fracture Toughness ◽  
Micromechanics Modeling ◽  
Combined Mode

The work of Evans and Hutchinson (1989) on micromechanics modeling of combined mode fracture is used as the basis for proposing an expression for combined Mode I and Mode II fracture toughness of brittle monolithic materials as well as bimaterial interfaces. The results of the proposed expression are compared with experimental data.

Combined Mode Fracture Toughness Measurement by the Disk Test

1978 ◽  
Vol 100 (2) ◽  
pp. 175-182 ◽  
Author(s):  
Hideo Awaji ◽  
Sennosuke Sato
Keyword(s):  
Fracture Toughness ◽  
Internal Crack ◽  
Mode I ◽  
Mode Ii ◽  
Mode Fracture ◽  
Fracture Toughness Measurement ◽  
Circular Specimen ◽  
Combined Mode ◽  
Toughness Measurement ◽  
Disk Test

The disk test in which a circular specimen with an internal crack is subjected to diametral compression is used to investigate combined mode I and mode II fracture. The stress intensity factors in the disk test are calculated numerically by means of the boundary collocation procedure and the dislocation method. Special care was taken to analyze the effect of the compression anvils. This method has the advantage, of allowing successive measurement of mode I, mode II and the combined mode fracture toughness under the same conditions. Some kinds of graphite, plaster and marble are examined to obtain the fracture toughness values, KIC, KIIC and the combined mode fracture criterion.

Mixed Mode Fracture in Electronic Packages

1996 ◽  
Vol 445 ◽  
Author(s):  
W. O. Soboyejo ◽  
V. Sinha ◽  
V. Kenner
Keyword(s):  
Fracture Toughness ◽  
Mixed Mode ◽  
Mode I ◽  
Mode Ii ◽  
Mixed Mode Fracture ◽  
Electronic Packages ◽  
Mixed Mode Loading ◽  
Molding Compound ◽  
Mode Fracture ◽  
Mode Ii Fracture Toughness

AbstractIn this paper, mixedmode (mode I + mode II) fracture toughness data are presented for the prediction of molding compound (silica filled epoxy resin) failure. The stresses necessary to cause the package cracking under mixed mode loading are experimentally determined. Measured toughness values are presented as a function of modemixity and temperature

Comparison of mode I and mode II fracture toughness of an 8090 AlLi alloy

1991 ◽  
Vol 149 (1) ◽  
pp. L1-L3 ◽  
Author(s):  
S.V. Kamat ◽  
N. Eswara Prasad ◽  
G. Malakondaiah
Keyword(s):  
Fracture Toughness ◽  
Mode I ◽  
Mode Ii ◽  
Mode Ii Fracture ◽  
Mode Ii Fracture Toughness
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