Surface Profile Measurement During Turning Using Fringe-Field Capacitive Profilometry

1992 ◽  
Vol 114 (2) ◽  
pp. 234-243 ◽  
Author(s):  
J. L. Garbini ◽  
Sih-Ping Koh ◽  
Jens E. Jorgensen ◽  
Mamidala Ramulu

The use of fringe-field capacitive sensing for surface profile measurement during the turning process is described. Measurements of the local surface height are inferred from variations in a fringe electric field induced between the sensing element and the workpiece. The surface profile is determined from high-speed scanning of the sensing element across the surface. The technique is particularly well-suited to the relatively harsh environment of in-process measurement. We have implemented a system in which profile measurements are made continuously, in real-time, and immediately adjacent to the cutting tool. The results of tests conducted to determine the accuracy and sensitivity of this capacitive profilometer are presented. In-process measurements of surfaces generated by turning with roughness in the range of 0.3 to 4.0 μm were made. Comparisons with static profile measurements made using standard stylus instrumentation are presented, and show quantitative agreement.

2018 ◽  
Vol 910 ◽  
pp. 130-136
Author(s):  
Hui Peng ◽  
Xiao Yang Pei ◽  
Ji Dong Yu ◽  
Mei Lan Qi ◽  
Jing Song Bai ◽  
...  

A series of plate-impact experiments were performed to study the damage characteristics of incipient spall in ultrapure aluminum (99.999%). Surface profile measurement system based on the axial chromatic aberration was used to measure the cross section of “soft-recovered” samples and reconstruct the metallographic and 3D surface topography. Statistical analyses show that the size distribution, coalescence condition and connectivity factor of the voids are regularly affected by loading conditions. Based on this finding, the mechanisms that control the damage properties and evolution process of dynamic fracture are analyzed in detail. The results of this research offer an experimental quantitative microstructure description of the ductile fracture process.


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