Numerical and Experimental Analysis of Solder Joint Self-Alignment in Fiber Attachment Soldering

2008 ◽  
Vol 130 (1) ◽  
Author(s):  
Wei Zhang ◽  
Chunqing Wang ◽  
Yanhong Tian
Keyword(s):  
Solder Joint ◽  
Low Cost ◽  
Three Dimensional ◽  
Major Axis ◽  
The Self ◽  
Alignment Error ◽  
Surface Evolver ◽  
Confocal Scanning Laser Microscope ◽  
Solder Volume ◽  
Public Domain Software

Fiber attachment soldering is low cost and high-precision technology in direct-coupling optoelectronic packaging. For accurate alignment, it is crucial to understand the self-alignment behavior of solder joint. In this research, the self-alignment method by using surface tension of molten solder and by adopting specific pad shape was proposed. First, the self-alignment model of solder joint in fiber attachment soldering was developed by using the public domain software called SURFACE EVOLVER and the three-dimensional geometry of solder joint with different solder volume was analyzed. Then, the self-alignment behavior of solder joint with an initial yaw misalignment was discussed and the theoretical equilibrium positions of ellipse and square pad were calculated. Next, based on the minimum potential energy theorem and data from geometry simulation, the influences of design and material parameters on the standoff height (SOH) were analyzed. Furthermore, experiments were done to examine the theoretical equilibrium positions of ellipse and square pad and the SOHs of solder joints were measured by using confocal scanning laser microscope. The numerical results show that the theoretical equilibrium positions of ellipse and square pad are the major axis of ellipse and the diagonal of square, respectively. SOH can be controlled by adopting proper solder volume, which is above the critical value for specific pad. The experimental results show that the solder joint with initial yaw angle can be self-aligned to the theoretical equilibrium position of pad and solder joint with ellipse pad substrate demonstrates smaller alignment error than those with square pad substrate. The measurement results of SOH are in agreement with the simulation results.

Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow

1998 ◽  
Vol 120 (2) ◽  
pp. 141-144 ◽  
Author(s):  
X. Wu ◽  
X. Dou ◽  
C.-P. Yeh ◽  
K. Waytt
Keyword(s):  
Solder Joint ◽  
Model Simulation ◽  
Software Tool ◽  
Solder Paste ◽  
Reflow Process ◽  
Surface Evolver ◽  
Joint Formation ◽  
Geometry Design ◽  
Reliability Performance ◽  
Public Domain Software

The failure of electrical devices associated with solder joints has become one of the most critical reliability issues for surface-mounted devices. Solder joint reliability performance has been found to be highly dependent on the solder joint configuration, which, in turn, is governed by bond pad size, alloy material, and leadframe structure, as well as solder reflow characteristics. To investigate tombstone effects causing solder joint failure during leadless component reflow process, this work has focused on (1) developing a numerical model for the simulations of the solder joint formation during the reflow process, and (2) determining possibility that a tombstone effect for the leadless component may occur by analyzing the force and torque in the problem. Using this methodology, the tombstone effect associated with different pad geometry configurations and solder paste amount has been analyzed through the application of the public domain software tool Surface Evolver. Simulations show that the tombstoning is very sensitive to pad/component geometry design, solder surface tension, solder paste volume, wetting area, and wetting angle. This model simulation can be used to determine optimal solder paste volume, pad geometry configurations, and solder material for avoiding tombstone effects.

The Modeling and Prediction Study of BLP Device Solder Joint Three-Dimensional Shape

2011 ◽  
Vol 121-126 ◽  
pp. 2338-2342
Author(s):  
Zhao Hua Wu
Keyword(s):  
Solder Joint ◽  
Metal Surface ◽  
Three Dimensional ◽  
The Other ◽  
Joint Surface ◽  
Solder Volume ◽  
Study Results ◽  
Dimensional Shape ◽  
Joint Shape ◽  
Three Dimensional Shape

Solder joint shape refers to geometry that molten solder can be achieved with spreading and wetting along the metal surface in the junction between components solder pins and printed circuit board (PCB) pad, to the metal surface contact angle and solder fillet shape[1]. BLP (Bottom Leaded Plastic) [2] which is not a type of thin out-line surface mount device(SMD) without the side lead is widely used in manufacturing of new generation memory such as SDRAM \ RDRAM \ DDR. For this non-lead SMD, the shape and reliability of solder joint is the focus of the study. In this paper, we select the C-BLP of 28-pin device as the research object, complete the forming model of solder joint shape based on minimum energy principle and the solder joint shape theory by using Surface Evolver software, and analyze two critical process parameters (solder volume and solder pad width ) impacting on the solder joint shape. The study results show that the solder volume and pad width have a significant impact on the three-dimensional shape of BLP solder joint. The law of which is that: in the case of the other fixed parameters, as the increase of the solder volume, solder joint surface gradually changes from the relatively flat to the convex, solder joint gradually changes from the completely soldered to the partly soldered in the pad connections, and solder joint heights are gradually decreased; in the case of the other fixed parameters, as the increase of the pad in width, the solder joint surface gradually changes from the convex to the flat, solder joint gradually changes from the completely soldered to the partly soldered in the pad connections, and solder joint heights are gradually decreased. The actual solder joint shape designs of BLP devices can be instructed based on predicted results.

Quasi-Static Modeling of the Self-Alignment Mechanism in Flip-Chip Soldering—Part I: Single Solder Joint

1991 ◽  
Vol 113 (4) ◽  
pp. 337-342 ◽  
Author(s):  
S. K. Patra ◽  
Y. C. Lee
Keyword(s):  
Flip Chip ◽  
Three Dimensional ◽  
The Self ◽  
Vertical Loading ◽  
Solder Volume ◽  
Static Modeling ◽  
Restoring Forces ◽  
Alignment Mechanism ◽  
Soldering Technology ◽  
Surface Profiles

A three-dimensional mathematical model simulating the self-alignment mechanism in the flip-chip soldering of a single joint has been developed. Based on the principle of energy minimization, it calculates the quasi-static surface profiles defined by the size of the solder pads, the solder volume, the surface tension coefficient, the vertical loading and the misalignment. The model is capable of calculating initial, intermediate and final profiles and their associated restoring forces during the solder reflow. It can provide the guidelines to improve the assembly yield and the stress-related reliability of the flip-chip soldering technology.

scholarly journals Rapid quantification of cryoconite: granule geometry and in situ supraglacial extents, using examples from Svalbard and Greenland

2010 ◽  
Vol 56 (196) ◽  
pp. 297-308 ◽  
Author(s):  
Tristram D.L. Irvine-Fynn ◽  
Jonathan W. Bridge ◽  
Andrew J. Hodson
Keyword(s):  
Spatial Scales ◽  
Low Cost ◽  
Image Data ◽  
Major Axis ◽  
Primary Data ◽  
Digital Cameras ◽  
The Public ◽  
Automated Processing ◽  
Public Domain Software

AbstractSupraglacial dust (cryoconite) is an important but poorly understood component of the glacial system. There is a lack of primary data on cryoconite form, extent and dynamics. Here we present a suite of rapid, low-cost methodologies for quantification of granule geometry and supraglacial cryoconite coverage using image data captured by commercially available digital cameras. We develop robust, transferable protocols for analysis of (1) cryoconite granule geometry (major axis, Feret diameter, circularity); (2) centimetre–metre scale supraglacial extent (m2cryoconite m−2surface); and (3) temporal change in supraglacial extent at hourly intervals over several days. Image-processing methodologies were developed using the public domain software ImageJ. Manual (supervised) controls were used to estimate sources of error, and measurements then automated using simple scripting tools (macros). Fully automated processing successfully identified ∼90% of a sample of isolated granules ranging between 2.5 and 39.2 mm, with uncertainties of <20%. Particle sphericity (inferred from circularity) decreased as particle size increased. Supraglacial cryoconite extent was obtained with a mean uncertainty of 37% and 22% for data from field sites in Greenland and Svalbard, respectively. These methods will facilitate acquisition and analysis of datasets for cryoconite across a range of spatial scales, supporting research into cryoconite impacts on supraglacial hydrological connections, nutrient and carbon cycling, and initiation of primary succession in deglaciating environments.

Measurements in 3D images

1991 ◽  
Vol 49 ◽  
pp. 408-409
Author(s):  
John C. Russ
Keyword(s):  
Three Dimensional ◽  
Image Plane ◽  
X Rays ◽  
Traditional Use ◽  
3D Images ◽  
Confocal Scanning Laser Microscope ◽  
Hard Materials ◽  
Depth Direction ◽  
Confocal Scanning ◽  
Confocal Scanning Laser

Three-dimensional (3D) images consisting of arrays of voxels can now be routinely obtained from several different types of microscopes. These include both the transmission and emission modes of the confocal scanning laser microscope (but not its most common reflection mode), the secondary ion mass spectrometer, and computed tomography using electrons, X-rays or other signals. Compared to the traditional use of serial sectioning (which includes sequential polishing of hard materials), these newer techniques eliminate difficulties of alignment of slices, and maintain uniform resolution in the depth direction. However, the resolution in the z-direction may be different from that within each image plane, which makes the voxels non-cubic and creates some difficulties for subsequent analysis.

Nanoscale Self-Assembly Using Ion and Electron Beam Techniques: A Rapid Review

MRS Advances ◽  
2020 ◽  
Vol 5 (64) ◽  
pp. 3507-3520
Author(s):  
Chunhui Dai ◽  
Kriti Agarwal ◽  
Jeong-Hyun Cho
Keyword(s):  
Electron Beam ◽  
Self Assembly ◽  
Ion Beam ◽  
Three Dimensional ◽  
The Self ◽  
Stress Generation ◽  
Rapid Review ◽  
High Yield ◽  
3D Nanostructures ◽  
Self Assembled

AbstractNanoscale self-assembly, as a technique to transform two-dimensional (2D) planar patterns into three-dimensional (3D) nanoscale architectures, has achieved tremendous success in the past decade. However, an assembly process at nanoscale is easily affected by small unavoidable variations in sample conditions and reaction environment, resulting in a low yield. Recently, in-situ monitored self-assembly based on ion and electron irradiation has stood out as a promising candidate to overcome this limitation. The usage of ion and electron beam allows stress generation and real-time observation simultaneously, which significantly enhances the controllability of self-assembly. This enables the realization of various complex 3D nanostructures with a high yield. The additional dimension of the self-assembled 3D nanostructures opens the possibility to explore novel properties that cannot be demonstrated in 2D planar patterns. Here, we present a rapid review on the recent achievements and challenges in nanoscale self-assembly using electron and ion beam techniques, followed by a discussion of the novel optical properties achieved in the self-assembled 3D nanostructures.

Fabrication of 3D Temperature Sensor Using Magnetostrictive Inkjet Printhead

2020 ◽  
Vol 64 (5) ◽  
pp. 50405-1-50405-5
Author(s):  
Young-Woo Park ◽  
Myounggyu Noh
Keyword(s):  
Flexible Electronics ◽  
Inkjet Printing ◽  
Temperature Sensor ◽  
Computer Aided Design ◽  
Low Cost ◽  
Three Dimensional ◽  
Drop On Demand ◽  
Aided Design ◽  
Nanoparticle Ink ◽  
Inkjet Printhead

Abstract Recently, the three-dimensional (3D) printing technique has attracted much attention for creating objects of arbitrary shape and manufacturing. For the first time, in this work, we present the fabrication of an inkjet printed low-cost 3D temperature sensor on a 3D-shaped thermoplastic substrate suitable for packaging, flexible electronics, and other printed applications. The design, fabrication, and testing of a 3D printed temperature sensor are presented. The sensor pattern is designed using a computer-aided design program and fabricated by drop-on-demand inkjet printing using a magnetostrictive inkjet printhead at room temperature. The sensor pattern is printed using commercially available conductive silver nanoparticle ink. A moving speed of 90 mm/min is chosen to print the sensor pattern. The inkjet printed temperature sensor is demonstrated, and it is characterized by good electrical properties, exhibiting good sensitivity and linearity. The results indicate that 3D inkjet printing technology may have great potential for applications in sensor fabrication.

Simulating Self-Regeneration and Self-Replication Processes Using Movable Cellular Automata with a Mutual Equilibrium Neighborhood

2020 ◽  
Vol 29 (4) ◽  
pp. 741-757
Author(s):  
Kateryna Hazdiuk ◽  
◽  
Volodymyr Zhikharevich ◽  
Serhiy Ostapov ◽  
◽  
...  
Keyword(s):  
Cellular Automata ◽  
Cellular Automaton ◽  
Three Dimensional ◽  
Computer Models ◽  
The Self ◽  
Model Construction ◽  
Natural Phenomena ◽  
Different Types ◽  
Movable Cellular Automata ◽  
Self Replication

This paper deals with the issue of model construction of the self-regeneration and self-replication processes using movable cellular automata (MCAs). The rules of cellular automaton (CA) interactions are found according to the concept of equilibrium neighborhood. The method is implemented by establishing these rules between different types of cellular automata (CAs). Several models for two- and three-dimensional cases are described, which depict both stable and unstable structures. As a result, computer models imitating such natural phenomena as self-replication and self-regeneration are obtained and graphically presented.

Constructive Optimisation of the Propeller Type Mixing Devices Using the Virtual and Rapid Prototyping

2017 ◽  
Vol 68 (3) ◽  
pp. 453-458 ◽  
Author(s):  
Daniel Besnea ◽  
Alina Spanu ◽  
Iuliana Marlena Prodea ◽  
Gheorghita Tomescu ◽  
Iolanda Constanta Panait
Keyword(s):  
Rapid Prototyping ◽  
Low Cost ◽  
Scale Up ◽  
Three Dimensional ◽  
Rapid Identification ◽  
Multidisciplinary Optimization ◽  
External Diameter ◽  
Process Industries ◽  
Parametric Cad ◽  
Shaft Torque

The paper points out the advantages of rapid prototyping for improving the performances/constructive optimization of mixing devices used in process industries, here exemplified to propeller types ones. The multidisciplinary optimization of the propeller profile affords its design using parametric CAD methods. Starting from the mathematical curve equations proposed for the blade profile, it was determined its three-dimensional virtual model. The challenge has been focused on the variation of propeller pitch and external diameter. Three dimensional ranges were manufactured using the additive manufacturing process with Marker Boot 3D printer. The mixing performances were tested on the mixing equipment measuring the minimum rotational speed and the correspondent shaft torque for complete suspension achieved for each of the three models. The virtual and rapid prototyping method is newly proposed by the authors to obtain the basic data for scale up of the mixing systems, in the case of flexible production (of low quantities), in which both the nature and concentration of the constituents in the final product varies often. It is an efficient and low cost method for the rapid identification of the optimal mixing device configuration, which contributes to the costs reduction and to the growing of the output.

scholarly journals Detecting the Mechanism behind the Transition from Fixed Two-Dimensional Patterned Sika Deer (Cervus nippon) Dermal Papilla Cells to Three-Dimensional Pattern

2021 ◽  
Vol 22 (9) ◽  
pp. 4715
Author(s):  
Guanning Wei ◽  
Hongmei Sun ◽  
Haijun Wei ◽  
Tao Qin ◽  
Yifeng Yang ◽  
...  
Keyword(s):  
Culture Condition ◽  
Sika Deer ◽  
Three Dimensional ◽  
Cervus Nippon ◽  
Dermal Papilla ◽  
Growth Patterns ◽  
The Self ◽  
Dermal Papilla Cells ◽  
Aggregative Behavior ◽  
Cell Pattern

The hair follicle dermal papilla is critical for hair generation and de novo regeneration. When cultured in vitro, dermal papilla cells from different species demonstrate two distinguishable growth patterns under the conventional culture condition: a self-aggregative three dimensional spheroidal (3D) cell pattern and a two dimensional (2D) monolayer cell pattern, correlating with different hair inducing properties. Whether the loss of self-aggregative behavior relates to species-specific differences or the improper culture condition remains unclear. Can the fixed 2D patterned dermal papilla cells recover the self-aggregative behavior and 3D pattern also remains undetected. Here, we successfully constructed the two growth patterns using sika deer (Cervus nippon) dermal papilla cells and proved it was the culture condition that determined the dermal papilla growth pattern. The two growth patterns could transit mutually as the culture condition was exchanged. The fixed 2D patterned sika deer dermal papilla cells could recover the self-aggregative behavior and transit back to 3D pattern, accompanied by the restoration of hair inducing capability when the culture condition was changed. In addition, the global gene expressions during the transition from 2D pattern to 3D pattern were compared to detect the potential regulating genes and pathways involved in the recovery of 3D pattern and hair inducing capability.

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