High Thermal Conductive Si3N4 Particle Filled Epoxy Composites With a Novel Structure

2007 ◽  
Vol 129 (4) ◽  
pp. 469-472 ◽  
Author(s):  
Hong He ◽  
Renli Fu ◽  
Yanchun Han ◽  
Yuan Shen ◽  
Deliu Wang

Traditionally, large quantities of ceramic fillers are added to polymers in order to obtain high thermally conductive polymer composites, which are used for electronic encapsulants. However, that is not cost effective enough. In this study, Si3N4 particle filled epoxy composite with a novel structure was fabricated by a processing method and structure design. Epoxy resin used in particle form was obtained by premixing and crushing. Different particle sizes were selected by sieving. High thermal conductivity was achieved at relative low volume fraction of the filler. The microstructure of the composites indicates that a continuous network is formed by the filler, which mainly completes the heat conduction. Thermal conductivity of the composites increases as the filler content increases, and the samples exhibit a highest thermal conductivity of 1.8W∕mK at 30% volume fraction of the filler in the composites using epoxy particles of 2mm. The composites show low dielectric constant and low dielectric loss.

2017 ◽  
Vol 51 (26) ◽  
pp. 3657-3668 ◽  
Author(s):  
Muthuraman Namasivayam ◽  
Joe Shapter

Thermally conductive polymer composites have opened up new possibilities in various applications including solar cells, power generators, electronics, biomedical applications, etc. Polymer matrices have some interesting advantages to offer such as being lightweight, cost effective, corrosion resistant, and many more. However, the thermal conductivity of a polymer matrix is relatively low for some commercial applications. Recent research has focused on enhancing the thermal conductivity of polymer composites through addition of nanofillers such as nanotubes, graphite, carbon fibers, etc. Among these possibilities, carbon nanotubes are considered to be promising candidates due to their unusually high thermal conductivity. This article discusses the properties of nanotube fillers that should be taken into account in order to fabricate a thermally conductive polymer nanocomposite and reviews the status of research in terms of thermal conductivity and nanotubes.


Author(s):  
Chongjian Zhou ◽  
Yong Kyu Lee ◽  
Yuan Yu ◽  
Sejin Byun ◽  
Zhong-Zhen Luo ◽  
...  

AbstractThermoelectric materials generate electric energy from waste heat, with conversion efficiency governed by the dimensionless figure of merit, ZT. Single-crystal tin selenide (SnSe) was discovered to exhibit a high ZT of roughly 2.2–2.6 at 913 K, but more practical and deployable polycrystal versions of the same compound suffer from much poorer overall ZT, thereby thwarting prospects for cost-effective lead-free thermoelectrics. The poor polycrystal bulk performance is attributed to traces of tin oxides covering the surface of SnSe powders, which increases thermal conductivity, reduces electrical conductivity and thereby reduces ZT. Here, we report that hole-doped SnSe polycrystalline samples with reagents carefully purified and tin oxides removed exhibit an ZT of roughly 3.1 at 783 K. Its lattice thermal conductivity is ultralow at roughly 0.07 W m–1 K–1 at 783 K, lower than the single crystals. The path to ultrahigh thermoelectric performance in polycrystalline samples is the proper removal of the deleterious thermally conductive oxides from the surface of SnSe grains. These results could open an era of high-performance practical thermoelectrics from this high-performance material.


2019 ◽  
Vol 33 (8) ◽  
pp. 1017-1029 ◽  
Author(s):  
Honglin Luo ◽  
Jikui Liu ◽  
Zhiwei Yang ◽  
Quanchao Zhang ◽  
Haiyong Ao ◽  
...  

Electrically insulating yet thermally conductive polymer-based composites are highly sought after in aerospace field. In this work, for the first time, electrically insulating but thermally conductive polyimide (PI) composites are fabricated by simultaneously incorporating micro- and nano-sized aluminum nitride (AlN) particles via a simple, economic, and scalable method of ball milling and subsequent hot-pressing process. The thermal conductivity, dielectric, and mechanical properties of the PI composites depend on the ratio of micro-sized AlN (m-AlN) to nano-sized AlN (n-AlN) and the total content of AlN in the PI composites. The thermal conductivity of the PI composites with 40 wt% m-AlN and 20 wt% n-AlN is 1.5 ± 0.05 W·m−1·K−1, which is 10 times higher than that of bare PI. The PI composites hold a great potential in aerospace industries.


RSC Advances ◽  
2018 ◽  
Vol 8 (40) ◽  
pp. 22846-22852 ◽  
Author(s):  
Seokgyu Ryu ◽  
Taeseob Oh ◽  
Jooheon Kim

Boron nitride (BN) particles surface-treated with different amounts of aniline trimer (AT) were used to prepare thermally conductive polymer composites with epoxy-terminated dimethylsiloxane (ETDS).


Polymers ◽  
2019 ◽  
Vol 11 (3) ◽  
pp. 484 ◽  
Author(s):  
Heeseok Song ◽  
Byoung Kim ◽  
Yong Kim ◽  
Youn-Sang Bae ◽  
Jooheon Kim ◽  
...  

In this study, thermally conductive composite films were fabricated using an anisotropic boron nitride (BN) and hybrid filler system mixed with spherical aluminum nitride (AlN) or aluminum oxide (Al2O3) particles in a polyimide matrix. The hybrid system yielded a decrease in the through-plane thermal conductivity, however an increase in the in-plane thermal conductivity of the BN composite, resulting from the horizontal alignment and anisotropy of BN. The behavior of the in-plane thermal conductivity was theoretically treated using the Lewis–Nielsen and modified Lewis–Nielsen theoretical prediction models. A single-filler system using BN exhibited a relatively good fit with the theoretical model. Moreover, a hybrid system was developed based on two-population approaches, the additive and multiplicative. This development represented the first ever implementation of two different ceramic conducting fillers. The multiplicative-approach model yielded overestimated thermal conductivity values, whereas the additive approach exhibited better agreement for the prediction of the thermal conductivity of a binary-filler system.


Author(s):  
Muhammad Omer Khan ◽  
Ellen Chan ◽  
Siu N. Leung ◽  
Hani Naguib ◽  
Francis Dawson ◽  
...  

This paper studies the development of new multifunctional liquid crystal polymeric composites filled with graphene nano platelets (GNPs) for electronic packaging applications. A series of parametric studies were conducted to study the effect of GNP content on the thermal conductivity of LCP-based nanocomposites. Graphene, ranging from 10 wt. % to 50 wt. %, were melt-compounded with LCP using a twin-screw compounder. The extrudates were ground and compression molded into small disc-shaped specimens. The thermal conductivity of LCP matrix was observed to have increased by more than 1000% where as the electrical conductivity increased by 13 orders of magnitude with the presence of 50 wt% GNP fillers. The morphology of the composites was analyzed using SEM micrographs to observe the dispersion of filler within the matrix. These thermally conductive composites represent potential cost-effective materials to injection mold three-dimensional, net-shape microelectronic enclosures with superior heat dissipation performance.


Author(s):  
Tyler J. Sonsalla ◽  
Leland Weiss ◽  
Arden Moore ◽  
Adarsh Radadia ◽  
Debbie Wood ◽  
...  

Waste heat is a major energy loss in manufacturing facilities. Thermally conductive polymer composite heat exchangers could be utilized in the ultralow temperature range (below 200° C) for waste heat recovery. Fused deposition modeling (FDM), also known as three-dimensional (3-D) printing, has become an increasingly popular technology and presents one approach to fabrication of these exchangers. The primary challenge to the use of FDM is the low-conductivity of the materials themselves. This paper presents a study of a new polymer-Zn composite designed for enhanced thermal conductivity for usage in FDM systems. Thermal properties were assessed in addition to basic printability. Filler volume percentages were varied to study the effects on material properties. Scanning electron microscope (SEM) images were taken of the 3-D printed test pieces to determine filler orientation and filler distribution. Lastly, experimentally obtained thermal conductivity values were compared to the theoretical thermal conductivity values predicted from the Lewis-Nielsen model.


2021 ◽  
Author(s):  
RUIMIN MA ◽  
Hanfeng Zhang ◽  
Tengfei Luo

Developing amorphous polymers with desirable thermal conductivity has significant implications, as they are ubiquitous in applications where thermal transport is critical. Conventional Edisonian approaches are slow and without guarantee of success in material development. In this work, using a reinforcement learning scheme, we design polymers with thermal conductivity above 0.4 W/m- K. We leverage a machine learning model trained against 469 thermal conductivity data calculated from high-throughput molecular dynamics (MD) simulations as the surrogate for thermal conductivity prediction, and we use a recurrent neural network trained with around one million virtual polymer structures as a polymer generator. For all newly generated polymers with thermal conductivity > 0.400 W/m-K, we have evaluated their synthesizability by calculating the synthesis accessibility score and validated the thermal conductivity of selected polymers using MD simulations. The best thermally conductive polymer designed has a MD-calculated thermal conductivity of 0.693 W/m-K, which is also estimated to be easily synthesizable. Our demonstrated inverse design scheme based on reinforcement learning may advance polymer development with target properties, and the scheme can also be generalized to other materials development tasks for different applications.


2012 ◽  
Vol 729 ◽  
pp. 80-84 ◽  
Author(s):  
András Suplicz ◽  
József Gábor Kovács

In the recent years a remarkable development can be observed in the electronics. New products of electronic industry generate more and more heat. To dissipate this heat, thermally conductive polymers offer new possibilities. The goal of this work was to develop a novel polymer based material, which has a good thermal conduction. The main purpose during the development was that this material can be processed easily with injection molding. To eliminate the weaknesses of the traditional conductive composites low-melting-point alloy was applied as filler. Furthermore in this work the effect of the filler content on thermal conductivity, on structure and on mechanical properties was investigated.


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