Nodal Based Mappings Between Finite Element Meshes

2007 ◽  
Vol 7 (4) ◽  
pp. 309-313
Author(s):  
David A. Field
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Physical Properties ◽  
Mathematical Models ◽  
Material Properties ◽  
Element Analysis ◽  
Average Value ◽  
Automotive Components ◽  
And Behaviors ◽  
Finite Element Meshes

Due to the demands on mathematical models that simulate physical properties and behaviors of automotive components, different finite element meshes often partition the same component for each disparate simulation. Commercial packages that transfer mesh dependent results from one finite element analysis to initialize another typically use a variation of a specific nodal based mapping. The simplicity and ease of implementation make this mapping very attractive. In its simplest form, the mapping first assigns a node in the analyzed model the average value of the elements that share the node. A node in the unanalyzed mesh receives its value from the closest node in the analyzed mesh. Nodal based interpolants on the new element initialize elemental values. When an element in the unanalyzed mesh requires a constant value such as its thickness, the element receives the average value at the nodes that define the element. This brief paper documents some undesirable characteristics of this nodal based transfer of material properties from one mesh to another.

scholarly journals On the Design of a Biodegradable POC-HA Polymeric Cardiovascular Stent

2012 ◽  
Author(s):  
Joonas Ponkala ◽  
Mohsin Rizwan ◽  
Panos S. Shiakolas
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Material Properties ◽  
Three Dimensional ◽  
Polymeric Composite ◽  
Coronary Stent ◽  
Element Analysis ◽  
Material Models ◽  
Solid Models ◽  
Biodegradable Stents

The current state of the art in coronary stent technology, tubular structures used to keep the lumen open, is mainly populated by metallic stents coated with certain drugs to increase biocompatibility, even though experimental biodegradable stents have appeared in the horizon. Biodegradable polymeric stent design necessitates accurate characterization of time dependent polymer material properties and mechanical behavior for analysis and optimization. This manuscript presents the process for evaluating material properties for biodegradable biocompatible polymeric composite poly(diol citrate) hydroxyapatite (POC-HA), approaches for identifying material models and three dimensional solid models for finite element analysis and fabrication of a stent. The developed material models were utilized in a nonlinear finite element analysis to evaluate the suitability of the POC-HA material for coronary stent application. In addition, the advantages of using femtosecond laser machining to fabricate the POC-HA stent are discussed showing a machined stent. The methodology presented with additional steps can be applied in the development of a biocompatible and biodegradable polymeric stents.

Warpage Simulation During Fan-Out Wafer-Level Packaging Process with Uncertainty of Material Properties

2021 ◽  
Vol 21 (5) ◽  
pp. 2987-2991
Author(s):  
Geumtaek Kim ◽  
Daeil Kwon
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Material Properties ◽  
Coefficient Of Thermal Expansion ◽  
Input Output ◽  
Wafer Level ◽  
High Input ◽  
Element Analysis ◽  
Packaging Process ◽  
Wafer Level Packaging

Along with the reduction in semiconductor chip size and enhanced performance of electronic devices, high input/output density is a desired factor in the electronics industry. To satisfy the high input/output density, fan-out wafer-level packaging has attracted significant attention. While fan-out wafer-level packaging has several advantages, such as lower thickness and better thermal resistance, warpage is one of the major challenges of the fan-out wafer-level packaging process to be minimized. There have been many studies investigating the effects of material properties and package design on warpage using finite element analysis. Current warpage simulations using finite element analysis have been routinely conducted with deterministic input parameters, although the parameter values are uncertain from the manufacturing point of view. This assumption may lead to a gap between the simulation and the field results. This paper presents an uncertainty analysis of wafer warpage in fan-out wafer-level packaging by using finite element analysis. Coefficient of thermal expansion of silicon is considered as a parameter with uncertainty. The warpage and the von Mises stress are calculated and compared with and without uncertainty.

Damage Length Predictor for High-Speed Craft

1999 ◽  
Vol 36 (04) ◽  
pp. 203-210
Author(s):  
Steven P. McGee ◽  
Armin Troesch ◽  
Nickolas Vlahopoulos
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Material Properties ◽  
High Speed ◽  
Historical Data ◽  
Element Analysis ◽  
Damage Prediction ◽  
Structural Layout ◽  
Vessel Speed ◽  
Indenter Geometry

In 1994 the International Maritime Organization adopted the Code of Safety for High-Speed Craft (HSC Code). After two years of use, several shortfalls were found, one being the damage length predictor, which is based on traditional steel, mono-hulled vessels. Other damage predictors were developed based on historical data, but they do not account for variables such as aluminum or fiberglass construction, transverse members, indenter geometry variation, or for the case where the vessel comes to rest on the grounding object. This paper proposes a damage prediction model based on material properties, structural layout, grounding object geometry, and vessel speed. The model incorporates four grounding mechanisms: plate cutting, plate tearing, crushing of plate behind transverse members, and transverse member failure. The method is used to determine the resistance energy, compared to the kinetic energy, of the vessel, to determine an effective damage length. Finite-element analysis was used to model the failure of both aluminum and steel transverse members with significant differences in the results. It was found that the transverse members provided the majority of the resistance energy in one grounding mechanism and negligible resistance energy in another.

scholarly journals The Optimization of FDM 3D Printer’s Structure Based on Finite Element Analysis

2019 ◽  
Vol 257 ◽  
pp. 02004
Author(s):  
Zhenhai Huang ◽  
Tingchun Shi ◽  
Xiuyan Yue
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Material Properties ◽  
Common Type ◽  
3D Printer ◽  
Deformation Characteristics ◽  
Structure Model ◽  
Element Analysis ◽  
Vibration Model ◽  
The Finite Element Analysis

In view of the forming accuracy of the 3D printer, the paper, from the structure of the printer itself, discussed the influence on the precision of the printer via improving the structure of 3D printer. A typical 3D printer, such as a common type of FDM, was selected, and SOLIDWORKS software was used for solid modeling, after establishing the model, the finite element analysis was carried out on the whole structure model to obtain the deformation characteristics and the main vibration model of the printer. On the basis of finite element analysis, the influence of the level shaft bearing diameter, material properties and symmetry of the parts on the overall mechanical properties of the printer was discussed respectively. On this basis, the overall structure of the machine has been optimized and achieved remarkable results.

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