Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept: Part 2—Verification and Application
1998 ◽
Vol 120
(1)
◽
pp. 48-53
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Keyword(s):
The finite element procedure with the unified disturbed state modeling concept presented in Part I, Basaran et al. (1998), is verified here with respect to laboratory test results for Pb40/Sn60 eutectic solder alloy. This solder alloy is a commonly used interconnection material for surface mount technology packages. It is demonstrated that the proposed procedure provides highly satisfactory correlation with the observed laboratory behavior of materials and with test results for a chip-substrate system simulated in the laboratory.
1987 ◽
Vol 14
(3)
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pp. 302-307
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2011 ◽
Vol 243-249
◽
pp. 1461-1465
Keyword(s):
2020 ◽
Vol 12
(5)
◽
pp. 168781402091868
1996 ◽
Vol 1528
(1)
◽
pp. 155-160
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Keyword(s):
2016 ◽
Vol 231
(10)
◽
pp. 1402-1413
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2013 ◽
Vol 275-277
◽
pp. 1359-1363
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