The Effects of Strain Rate and Thickness on the Response of Thin Layers of Solder Loaded in Pure Shear
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A new configuration for testing thin layers of solder is introduced and employed to study the effects of strain rate and thickness on the mechanical response of eutectic Sn-Pb solder. The solder in the test is loaded under a well defined state of pure shear stress. The stress and deformation in the solder are measured very accurately to produce a reliable stress-strain curve. The results show that both the stress needed for plastic deformation and ductility increase with increasing strain rate.
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1990 ◽
Vol 116
(8)
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pp. 1255-1263
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2007 ◽
Vol 558-559
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pp. 441-448
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2013 ◽
Vol 767
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pp. 144-149
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2017 ◽
Vol 48
(6)
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pp. 2960-2970
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