Investigations of Board-Level Drop Reliability of Wafer-Level Chip-Scale Packages

2006 ◽  
Vol 129 (1) ◽  
pp. 105-108 ◽  
Author(s):  
Yi-Shao Lai ◽  
Chang-Lin Yeh ◽  
Ching-Chun Wang
Keyword(s):  
Time Integration ◽  
Implicit Time ◽  
Wafer Level ◽  
Excitation Scheme ◽  
Implicit Time Integration ◽  
Parametric Studies ◽  
Support Excitation ◽  
Board Level ◽  
Board Level Reliability ◽  
Die Thickness

We present in this paper parametric studies of board-level reliability of wafer-level chip-scale packages subjected to a specific pulse-controlled drop test condition. Eighteen experiment cells, constructed by varying joint pitch, die thickness, and die size, are proposed and examined numerically. The transient analysis follows the support excitation scheme and incorporates an implicit time integration solver. Numerical results indicate that the drop reliability of the package enhances as the die thickness as well as the die size decreases. Moreover, the package with smaller solder joints and a smaller joint pitch suffers a greater drop reliability concern.

Finite Element Prediction of Stack-Die Packages under Board Level Drop Test

2008 ◽  
Vol 594 ◽  
pp. 169-174
Author(s):  
Hsiang Chen Hsu ◽  
Yu Chia Hsu ◽  
Chan Lin Yeh ◽  
Yi Shao Lai
Keyword(s):  
Solder Joint ◽  
Equivalent Stress ◽  
Drop Test ◽  
Excitation Scheme ◽  
Joint Reliability ◽  
Solder Balls ◽  
Mesh Density ◽  
Parametric Studies ◽  
Support Excitation ◽  
Board Level

The objective of this research is to investigate the solder joint reliability of board-level drop test based on the support excitation scheme incorporated with the submodel technique for stacked-die packages. Three lead-free materials, SAC405 (Sn4Ag0.5Cu), SAC355(Sn3.5Ag0.5Cu) and Sn3.5Ag were used to demonstrate the transient dynamic response for solder balls subject to JEDEC pulse-controlled board-level drop test standard. In order to evaluate the structure of the interested area, a strip model sliced from the full test vehicle is used in this research. In addition, the submodel region is particularly chosen with strip model by performing the cut boundary interpolation. The envelope of equivalent stress for the outermost solder joint off the end of the strip model is plot to show the potential failure mode and mechanism. The cut boundary of submodel is verified and the mesh density of submodel is examined. For a refinery mesh of submodel, parametric studies for structure and material are carried out to investigate the reliability of the outermost solder joint, and the results are summarized as design rules for the development of stacked-die packages.

Board Level Reliability Enhancement for A Double-bump Wafer Level Chip Scale Package

2004 ◽  
Vol 1 (2) ◽  
pp. 64-71 ◽  
Author(s):  
Xiaowu Zhang ◽  
E. H. Wong ◽  
Mahadevan K. Iyer
Keyword(s):  
Solder Joint ◽  
Design Guidelines ◽  
Wafer Level ◽  
Element Analysis ◽  
Chip Scale Package ◽  
Form Design ◽  
Parametric Studies ◽  
Reliability Enhancement ◽  
Board Level ◽  
Board Level Reliability

This paper presents a nonlinear finite element analysis on board level solder joint reliability enhancement of a double-bump wafer level chip scale package (CSP). A viscoplastic constitutive relation is adopted for the solders to account for its time and temperature dependence in thermal cycling. The fatigue life of solder joint is estimated by the modified Coffin-Manson equation, which has been verified by experimental results using one of the double-bump wafer level CSP packages as the test vehicle. A series of parametric studies were performed by changing the Sn/Ag inner bump size (UBM pad size and standoff height), the eutectic Sn/Pb external solder joint size (pad size and standoff height), pitch, die thickness, and the encapsulant thickness. The results obtained from the modeling are useful to form design guidelines for board level reliability enhancement of the wafer level CSP packages.

scholarly journals Kinetic Simulation of Collisional Magnetized Plasmas with Semi-implicit Time Integration

2018 ◽  
Vol 77 (2) ◽  
pp. 819-849 ◽  
Author(s):  
Debojyoti Ghosh ◽  
Mikhail A. Dorf ◽  
Milo R. Dorr ◽  
Jeffrey A. F. Hittinger
Keyword(s):  
Time Integration ◽  
Implicit Time ◽  
Magnetized Plasmas ◽  
Kinetic Simulation ◽  
Implicit Time Integration

An Explicit-Implicit Time Integration Approach for Finite Element Evaluation of Engine Load Following an FBO Event

2017 ◽  
Author(s):  
Yiliu Weng ◽  
Lipeng Zheng
Keyword(s):  
Finite Element ◽  
Extreme Event ◽  
Time Integration ◽  
Implicit Time ◽  
Engine Load ◽  
Load Following ◽  
Fine Mesh ◽  
Implicit Time Integration ◽  
Integration Approach ◽  
Fan Blade

Engine fan blade-off (FBO) is an extreme event that could well place the flight safety at risk. When it happens, the engine will experience high-velocity impact at first, and then enter into a “high-power” stage due to huge unbalance before coming to a steady state called “windmilling”. The analytical process for FBO can be split into two phases, one for impact simulation and the other for obtaining the FBO load to pylon. Typically, explicit method with fine mesh finite elements is used in the first phase, and implicit method with coarse meshes is adopted in the second one. In most cases, the only connection between these two analyses may be the unbalance level caused by FBO. More structural responses other than the unbalance level due to fan blade impact are actually ignored in the succeeding implicit analysis. Attempts have been made by Boeing, GE and MSC to integrate these two processes by adding some features in MD Nastran. Yet the intermediate binary files created and the restricted input entries make the integration process quite inflexible. This paper introduces an explicit-implicit time integration approach for finite element analysis of engine load following an FBO event. The proposed method attempts to connect the two stages more closely, yet in a more flexible manner. In this approach, the engine structural response under FBO obtained from explicit analysis is transferred to the implicit analysis, together with the unbalance level caused by blade loss. The necessity of the approach is discussed, and sensitivity analysis is conducted to understand the factors that play significant roles in the approach. As the models for explicit and implicit analyses are different in mesh sizes and scales, the authors also develop a tool that can interpolate the load information and further, smooth it to fit calculation. Finally, the approach is tested on a full engine model to show its applicability and advantages over the traditional method for load evaluation of FBO event.

scholarly journals Impact of difference between explicit and implicit second-order time integration schemes on isotropic/anisotropic steady incompressible turbulence field

2021 ◽  
Vol 2090 (1) ◽  
pp. 012145
Author(s):  
Ryuma Honda ◽  
Hiroki Suzuki ◽  
Shinsuke Mochizuki
Keyword(s):  
Kinetic Energy ◽  
Energy Conservation ◽  
Integration Method ◽  
Time Integration ◽  
Second Order ◽  
Implicit Time ◽  
Explicit Time Integration ◽  
Time Integration Method ◽  
Implicit Time Integration ◽  
Time Integration Methods

Abstract This study presents the impact of the difference between the implicit and explicit time integration methods on a steady turbulent flow field. In contrast to the explicit time integration method, the implicit time integration method may produce significant kinetic energy conservation error because the widely used spatial difference method for discretizing the governing equations is explicit with respect to time. In this study, the second-order Crank-Nicolson method is used as the implicit time integration method, and the fourth-order Runge-Kutta, second-order Runge-Kutta and second-order Adams-Bashforth methods are used as explicit time integration methods. In the present study, both isotropic and anisotropic steady turbulent fields are analyzed with two values of the Reynolds number. The turbulent kinetic energy in the steady turbulent field is hardly affected by the kinetic energy conservation error. The rms values of static pressure fluctuation are significantly sensitive to the kinetic energy conservation error. These results are examined by varying the time increment value. These results are also discussed by visualizing the large scale turbulent vortex structure.

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