Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Boards

2006 ◽  
Vol 129 (1) ◽  
pp. 90-97 ◽  
Author(s):  
Tohru Suwa ◽  
Hamid Hadim
Keyword(s):  
Genetic Algorithm ◽  
Printed Circuit Boards ◽  
Line Length ◽  
Junction Temperature ◽  
Superposition Method ◽  
Circuit Boards ◽  
Electronic Components ◽  
Printed Circuit ◽  
Placement Optimization ◽  
Optimization Methodology

A multidisciplinary placement optimization methodology for heat generating electronic components on printed circuit boards (PCBs) is presented. The methodology includes thermal, electrical, and placement criteria involving junction temperature, wiring density, line length for high frequency signals, and critical component location which are optimized simultaneously using the genetic algorithm. A board-level thermal performance prediction methodology which is based on a combination of a superposition method and artificial neural networks is developed for this study. Two genetic algorithms with different thermal prediction modules are used in a cascade in the optimization process. The first genetic algorithm uses simplified thermal network modeling and it is mainly aimed at finding component locations that avoid any overlap. Compact thermal models are used in the second genetic algorithm leading to more accurate thermal prediction which improves the placement optimization obtained using the first algorithm. Using this optimization methodology, large calculation time reduction is achieved without losing accuracy. To demonstrate its capabilities, the present methodology is applied to a test case involving placement optimization of several heat generating electronics components on a PCB.

Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Boards Using Artificial Neural Networks

2005 ◽  
Author(s):  
Tohru Suwa ◽  
Hamid A. Hadim
Keyword(s):  
Genetic Algorithm ◽  
Neural Networks ◽  
Artificial Neural Networks ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Electronic Components ◽  
Printed Circuit ◽  
Placement Optimization ◽  
Artificial Neural ◽  
Optimization Methodology

A multidisciplinary placement optimization methodology for heat generating electronic components on printed circuit boards (PCBs) is presented. The methodology includes thermal, electrical and placement criteria involving junction temperature, wiring density, line length for high frequency signals, and critical component location which are optimized simultaneously using the genetic algorithm. A board-level thermal performance prediction methodology which is based on a combination of a superposition method and artificial neural networks (ANNs) is developed for this study. Two genetic algorithms with different thermal prediction methods are used in a cascade in the optimization process. The first genetic algorithm is based on simplified thermal network modeling and it is mainly aimed at finding component locations that avoid any overlap. Compact thermal models are used in the second genetic algorithm leading to more accurate thermal prediction which improves the placement optimization obtained using the first algorithm. Using this optimization methodology, large calculation time reduction is achieved without losing accuracy. To demonstrate the capabilities of the present methodology, a test case involving component placement on a PCB is presented.

Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Board in Channel Flow Forced Convection Using Artificial Neural Networks

2005 ◽  
Author(s):  
Tohru Suwa ◽  
Hamid Hadim
Keyword(s):  
Neural Networks ◽  
Heat Flux ◽  
Artificial Neural Networks ◽  
Forced Convection ◽  
Channel Flow ◽  
Superposition Method ◽  
Electronic Components ◽  
Printed Circuit ◽  
Placement Optimization ◽  
Optimization Methodology

A multidisciplinary placement optimization methodology for heat generating electronic components on printed circuit boards (PCBs) in channel flow forced convection is presented. In this methodology, thermal, electrical, and placement criteria involving junction temperature, wiring density, line length for high frequency signals, and critical component location are optimized simultaneously using the genetic algorithm. A board-level thermal performance prediction methodology based on channel flow forced convection boundary conditions is developed. The methodology consists of a combination of artificial neural networks (ANNs) and a superposition method that is able to predict PCB surface and component junction temperatures in a much shorter calculation time than the existing numerical methods. Three ANNs are used for predicting temperature rise at the PCB surface caused by a single heat flux at an arbitrary location on the board, while temperature rise due to multiple heat flux is calculated using a superposition method. Compact thermal models are used for the electronic components thermal modeling. Using this optimization methodology, large calculation time reduction is achieved without losing accuracy. For thermal model validation, the present thermal methodology predicts junction temperatures with maximum error of 1.8°C comparing to the conjugate solid/ fluid heat transfer analysis result. The present thermal modeling takes 12 seconds, while the conjugate analysis takes 30 hours for the validation on the same computer. To demonstrate the capabilities of the present methodology, a test case of component placement on a PCB is presented.

PHM Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

2021 ◽  
Author(s):  
Alexander Otto ◽  
Eberhard Kaulfersch ◽  
Prashant Kumar Singh ◽  
Claudio Romano ◽  
Marcus Hildebrandt ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Experimental Methods ◽  
Accelerated Ageing ◽  
Deformation Analysis ◽  
Electronic Control ◽  
Circuit Boards ◽  
Electronic Components ◽  
Printed Circuit ◽  
Early Warning Indicators ◽  
Warning Indicators

Abstract Canary structures being used as early warning indicators represent an important tool for condition and health monitoring of electronic components and systems. In this paper, printed circuit boards with canary structures based on SMD 2512 ceramic chip resistors with reduced solder pad sizes were studied. Focus of these investigations was set on thermo-mechanical and mechanical stresses caused by passive thermal cycling as well as by vibrational loads. For this purpose, experimental methods such as deformation analysis and accelerated ageing tests as well as finite element based methods were applied. In addition, an outlook on the implementation of these canary structures into dual inverter electronic control boards for electrical powertrain applications will be given.

scholarly journals Dismantling of Waste Printed Circuit Boards with the Simultaneous Recovery of Copper: Experimental Study and Process Modeling

Materials ◽  
2021 ◽  
Vol 14 (18) ◽  
pp. 5186
Author(s):  
Szabolcs Fogarasi ◽  
Árpád Imre-Lucaci ◽  
Florica Imre-Lucaci
Keyword(s):  
Environmental Performance ◽  
Printed Circuit Boards ◽  
Electrochemical Process ◽  
Circuit Boards ◽  
Electronic Components ◽  
Printed Circuit ◽  
Waste Printed Circuit Boards ◽  
Different Types ◽  
Leaching Solution ◽  
The Impact

The study was carried out with the aim to demonstrate the applicability of a combined chemical–electrochemical process for the dismantling of waste printed circuit boards (WPCBs) created from different types of electronic equipment. The concept implies a simple and less polluting process that allows the chemical dismantling of WPCBs with the simultaneous recovery of copper from the leaching solution and the regeneration of the leaching agent. In order to assess the performance of the dismantling process, various tests were performed on different types of WPCBs using the 0.3 M FeCl3 in 0.5 M HCl leaching system. The experimental results show that, through the leaching process, the electronic components (EC) together with other fractions can be efficiently dismounted from the surface of WPCBs, with the parallel electrowinning of copper from the copper rich leaching solution. In addition, the process was scaled up for the dismantling of 100 kg/h WPCBs and modeled and simulated using process flow modelling software ChemCAD in order to assess the impact of all steps and equipment on the technical and environmental performance of the overall process. According to the results, the dismantling of 1 kg of WPCBs requires a total energy of 0.48 kWh, and the process can be performed with an overall low environmental impact based on the obtained general environmental indexes (GEIs) values.

Selective Desoldering Separation of Tin–Lead Alloy for Dismantling of Electronic Components from Printed Circuit Boards

2015 ◽  
Vol 3 (8) ◽  
pp. 1696-1700 ◽  
Author(s):  
Xiaojiao Zhang ◽  
Jie Guan ◽  
Yaoguang Guo ◽  
Xingru Yan ◽  
Hao Yuan ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Lead Alloy ◽  
Circuit Boards ◽  
Electronic Components ◽  
Printed Circuit
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