A Three-Dimensional Numerical Modeling of Atmospheric Pool Boiling by the Coupled Map Lattice Method

2006 ◽  
Vol 128 (11) ◽  
pp. 1149 ◽  
Author(s):  
A. Gupta ◽  
P. S. Ghoshdastidar
2005 ◽  
Author(s):  
A. Gupta ◽  
P. S. Ghoshdastidar

In the present paper, the characteristic atmospheric pool boiling curve is qualitatively reproduced for water on a temperature controlled thin copper strip having comparable length and breadth by the coupled map lattice (CML) method using a three-dimensional boiling field model. The basic objective of the work is to improve the prediction of the critical heat flux (CHF) with respect to the 2D CML model of Ghoshdastidar et al. [10]. The work models saturated pool boiling of water at 1 bar on a large (much larger than the minimum wavelength of 2D Taylor waves) and thin horizontal copper strip. The pool height is 0.7 mm, indicating thin film boiling. In the present model, it is assumed that boiling is governed by (a) nucleation from cavities on a heated surface, (b) thermal diffusion, (c) bubble rising motion and associated convection, (d) phase change and (e) Taylor instability. The changes with respect to 2D model are primarily with respect to 3D modelling of thermal diffusion and 2D distribution of nucleating cavity sizes. The predicted CHF is 1.57 MW/m2 as compared to the actual value of 1.3 MW/m2 and 0.36 MW/m2 predicted by the 2D CML model of Ghoshdastidar et al. [10]. It can be said that for the first time a coupled map lattice method which is essentially qualitative in nature has been able to predict the CHF of saturated pool boiling of water at 1 bar very close to the actual value.


Author(s):  
P S Ghoshdastidar ◽  
S Kabelac ◽  
A Mohanty

In the present paper, the characteristic atmospheric saturated pool boiling curve is qualitatively reproduced for water on a temperature-controlled long and thin copper strip using the coupled map lattice (CML) method known in non-linear spatio-temporal chaos dynamics. The pool height is 0.7 mm, indicating that the boiling is of the thin-film type. The work modifies the basic theoretical model proposed by Shoji in 1998 in terms of nucleation superheat distribution and mixing. The stirring action of the bubbles is modelled by increasing the fluid thermal diffusivity by an enhancement factor. It is assumed that boiling is governed by (a) nucleation from cavities on a heated surface, (b) thermal diffusion, (c) bubble rising motion and associated convection, (d) phase change and (e) Taylor instability. The effectiveness of the enhancement factor approach in the present model is clearly seen in its capability of reproducing the saturated pool boiling curve well and predicting the critical heat flux (CHF) in the same order of magnitude of the actual value.


Author(s):  
Lianjie Li ◽  
Jianxin Li ◽  
Haibo Xie ◽  
Hongqiang Liu ◽  
Li Sun ◽  
...  

2015 ◽  
Vol 33 (11) ◽  
pp. 1350-1359 ◽  
Author(s):  
Jonathan H. Perez ◽  
Fumina Tanaka ◽  
Fumihiko Tanaka ◽  
Daisuke Hamanaka ◽  
Toshitaka Uchino

2001 ◽  
Author(s):  
Abhay A. Watwe ◽  
Ravi S. Prasher

Abstract Traditional methods of estimating package thermal performance employ numerical modeling using commercially available finite-volume or finite-element tools. Use of these tools requires training and experience in thermal modeling. This methodology restricts the ability of die designers to quickly evaluate the thermal impact of their die architecture due to the added throughput time required to enlist the services of a thermal analyst. This paper describes the development of an easy to use spreadsheet tool, which performs quick-turn numerical evaluations of the impact of non-uniform die heating. The tool employs well-established finite-volume numerical techniques to solve the steady-state, three-dimensional Fourier equation of conduction in the package geometry. Minimal input data is required and the inputs are customized using visual basic pull-down menus to assist die designers who may not be thermal experts. Data showing comparison of the estimates from the spreadsheet tool with that obtained from a conventional analysis using the commercially available finite element code ANSYS™ is also presented.


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