Creep-Fatigue Life Evaluation for Sn-3.5Ag Solder
2005 ◽
Vol 128
(2)
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pp. 142-150
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Keyword(s):
This paper studies the creep-fatigue life evaluation of Sn-3.5Ag solder under push-pull loading using fast-fast, fast-slow, slow-fast, slow-slow, and strain-hold strain waves. Extensive creep-fatigue data were generated using these strain waves and the applicability of four conventional creep-fatigue damage rules, the linear damage rule, the frequency modified fatigue life, the ductility exhaustion model, and the strain range partitioning method, was examined. No conventional damage rules evaluated creep-fatigue lives accurately. Only the grain boundary sliding model, developed recently for solders, predicted creep-fatigue lives with a small scatter.
2004 ◽
Vol 127
(4)
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pp. 407-414
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Keyword(s):
1992 ◽
Vol 114
(3)
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pp. 280-291
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Keyword(s):
Dynamic surrogate modeling approach for probabilistic creep-fatigue life evaluation of turbine disks
2019 ◽
Vol 95
◽
pp. 105439
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Keyword(s):
2018 ◽
Vol 2018
(0)
◽
pp. J0320102
Keyword(s):
2018 ◽
Vol 2018
(0)
◽
pp. OS0907
Keyword(s):
2021 ◽
pp. 104515
2018 ◽
Vol 84
(867)
◽
pp. 18-00236-18-00236
Keyword(s):
1994 ◽
Vol 60
(577)
◽
pp. 2054-2060
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Keyword(s):