An Experimental Study of Transient Heat Transfer From Discrete Heat Sources in Water Cooled Vertical Rectangular Channel

2004 ◽  
Vol 127 (3) ◽  
pp. 193-199 ◽  
Author(s):  
H. Bhowmik ◽  
K. W. Tou
Keyword(s):  
Heat Transfer ◽  
Reynolds Number ◽  
Heat Source ◽  
Rectangular Channel ◽  
Convection Heat Transfer ◽  
Uniform Heat Flux ◽  
Heat Sources ◽  
Discrete Heat Sources ◽  
Wide Range ◽  
Transfer Behavior

Experiments are performed to study the single-phase transient forced convection heat transfer on an array of 4×1 flush-mounted discrete heat sources in a vertical rectangular channel during the pump-on transient operation. Water is the coolant media and the flow covers the wide range of laminar flow regime with Reynolds number, based on heat source length, from 800 to 2625. The applied uniform heat flux ranges from 1 to 7W∕cm2. For flush-mounted heaters the heat transfer characteristics are studied and correlations are presented for four chips as well as for overall data in the transient regime. The experimental results indicate that the heat transfer coefficient is affected strongly by the number of chips and the Reynolds number. Finally the general impacts of heat source protrusions (B=1, 2 mm) on heat transfer behavior of four chips are investigated by comparing the results obtained from flush-mounted (B=0) heaters.

Air Cooling Study of Transient Natural Convection Heat Transfer From Simulated Electronic Chips

2004 ◽  
Author(s):  
H. Bhowmik ◽  
K. W. Tou
Keyword(s):  
Heat Transfer ◽  
Rectangular Channel ◽  
Convection Heat Transfer ◽  
Heat Fluxes ◽  
Working Fluid ◽  
Air Cooling ◽  
Heat Sources ◽  
Heat Transfer Characteristics ◽  
Discrete Heat Sources ◽  
Transient Period

Experiments are performed to study the heat transfer characteristics during the power-on transient period from an array of 4 × 1 discrete heat sources in a vertical rectangular channel using air as the working fluid. The heat flux ranges from 1000 W/m2 to 5000 W/m2. For 2 mm protrusion of the heater, the effect of heat fluxes and chip numbers are investigated and observed that the transient Nul strongly depends on the number of chips. Correlations are presented for individual chips as well as for overall data in the transient regime.

An Experimental Study on Forced Convection Heat Transfer From Flush-Mounted Discrete Heat Sources

1999 ◽  
Vol 121 (2) ◽  
pp. 326-332 ◽  
Author(s):  
C. P. Tso ◽  
G. P. Xu ◽  
K. W. Tou
Keyword(s):  
Heat Transfer ◽  
Reynolds Number ◽  
Heat Source ◽  
Forced Convection ◽  
Rectangular Channel ◽  
Convection Heat Transfer ◽  
Channel Height ◽  
Air Cooling ◽  
Convection Heat ◽  
Forced Convection Heat Transfer

Experiments have been performed using water to determine the single-phase forced convection heat transfer from in-line four simulated electronic chips, which are flush-mounted to one wall of a vertical rectangular channel. The effects of the most influential geometric parameters on heat transfer including chip number, and channel height are tested. The channel height is varied over values of 0.5, 0.7, and 1.0 times the heat source length. The heat flux is set at the three values of 5 W/cm2, 10 W/cm2, and 20 W/cm2, and the Reynolds number based on the heat source length ranges from 6 × 102 to 8 × 104. Transition Reynolds numbers are deduced from the heat transfer data. The experimental results indicate that the heat transfer coefficient is affected strongly by the number of chips and the Reynolds number and weakly by the channel height. Finally, the present results from liquid-cooling are compared with other results from air-cooling, and Prandtl number scaling between air and water is investigated.

Single- and Two-Phase Convective Heat Transfer From Smooth and Enhanced Microelectronic Heat Sources in a Rectangular Channel

1989 ◽  
Vol 111 (4) ◽  
pp. 1045-1052 ◽  
Author(s):  
D. E. Maddox ◽  
I. Mudawar
Keyword(s):  
Heat Transfer ◽  
Reynolds Number ◽  
Heat Source ◽  
Convective Heat Transfer ◽  
Forced Convection ◽  
Convective Heat ◽  
Single Phase ◽  
Rectangular Channel ◽  
Heat Sources ◽  
Two Phase

Experiments have been performed to assess the feasibility of cooling microelectronic components by means of single-phase and two-phase forced convection. Tests were conducted using a single heat source flush mounted to one wall of a vertical rectangular channel. An inert fluorocarbon liquid (FC-72) was circulated upward through the channel at velocities up to 4.1 m/s and with subcooling up to 46°C. The simulated microelectronic heat sources tested in this study include a smooth surface and three low-profile microstud surfaces of varying stud height, each having a base area of 12.7×12.7 mm2. Correlations were developed for the single-phase convective heat transfer coefficient over the Reynolds number range from 2800 to 1.5 × 105, where Reynolds number is based on the length of the heater. The results demonstrate that the low thermal resistances required for cooling of microelectronic heat sources may be achieved with single-phase forced convection by using high fluid velocity coupled with surface enhancement. Experiments were also performed to understand better the parametric trends of boiling heat transfer from the simulated microelectronic heat source. It was found that increased velocity and subcooling and the use of microstud surfaces enhance nucleate boiling, increase the critical heat flux, and reduce the magnitude of temperature overshoot upon the inception of nucleation.

Analyses of Convection Heat Transfer From Discrete Heat Sources in a Vertical Rectangular Channel

2004 ◽  
Vol 127 (3) ◽  
pp. 215-222 ◽  
Author(s):  
H. Bhowmik ◽  
C. P. Tso ◽  
K. W. Tou
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Reynolds Number ◽  
Rectangular Channel ◽  
Convection Heat Transfer ◽  
Working Fluid ◽  
Convection Heat ◽  
Empirical Correlations ◽  
Flux Flow ◽  
Wide Range

Steady-state experiments are performed to study the convection heat transfer from four in-line simulated chips in a vertical rectangular channel using water as the working fluid. The experimental data cover a wide range for laminar flow under natural, mixed, and forced convection conditions with the Reynolds number based on the channel hydraulic diameter ranging from 40 to 2220 and on the heat source length ranging from 50 to 2775. The heat flux ranges from 0.1W∕cm2to0.6W∕cm2. The effects of heat flux, flow rates, and chip number are investigated and results indicate that the Nusselt number is strongly affected by the Reynolds number. To develop empirical correlations, the appropriate value of the exponent n of ReD is determined to collapse all the lines into a single line to show the independence of heat flux. Based on experimental results, the empirical correlations are developed for relations using Nuℓ, ReD, and GrD. The results are compared to predictions from a three-dimensional numerical simulation, and a numerical correlation is also developed.

Influence of Discrete Heat Source Location on Natural Convection Heat Transfer in a Vertical Square Enclosure

1991 ◽  
Vol 113 (3) ◽  
pp. 268-274 ◽  
Author(s):  
G. Refai Ahmed ◽  
M. M. Yovanovich
Keyword(s):  
Heat Transfer ◽  
Natural Convection ◽  
Heat Source ◽  
Convection Heat Transfer ◽  
Natural Convection Heat Transfer ◽  
Heat Sources ◽  
Convection Heat ◽  
Square Enclosure ◽  
Discrete Heat Sources ◽  
Scale Length

A numerical study is carried out to investigate the influence of discrete heat sources on natural convection heat transfer in a square enclosure filled with air. The enclosure has two vertical boundaries of height H; one of them is cooled at Tc and the other has discrete heat sources [isoflux (q = c) or isothermal (Th = c)]. The enclosure has two horizontal adiabatic boundaries of length L. Results are reported for 0 ≤ Ra ≤ 106, Pr = 0.72, A = 1, aspect ratio ε, the relative size of the heat source to the total height, lies in the range 0.25 ≤ ε ≤ 1 and the discrete heat sources are located at the top or the bottom of the enclosure. Verification of numerical results is obtained at Ra = 0 (conduction limit) with analytical conduction solutions. In addition, a comparison with experimental and numerical data is made which also shows good agreement. The relationships between both Nu, ΔNu (change of thermal conductance) and Ra based on scale length (the size of the heat source S divided by the aspect ratio A) are also investigated here. A relationship Nu and Ra, based on scale length obtained from analytical solutions is correlated as Nu = Nu(Ra, ε). In addition, extrapolation correlations of Nu over the very high range of Rayleigh numbers (Ra ≥ 108) are developed.

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