Prediction of Wire Sweep During the Encapsulation of IC Packaging With Wire Density Effect

2004 ◽  
Vol 127 (3) ◽  
pp. 335-339 ◽  
Author(s):  
Chien-Chang Pei ◽  
Sheng-Jye Hwang
Keyword(s):  
Integrated Circuit ◽  
Three Dimensional ◽  
Density Effect ◽  
Molding Process ◽  
Molding Compound ◽  
Mesh Model ◽  
Ic Packaging ◽  
Filling Analysis ◽  
The Wire ◽  
Mold Flow

More wires in a package and smaller wire gaps are the trend in the integrated circuit (IC) packaging industry. The effect of wire density is becoming increasingly apparent, especially on the flow pattern of the epoxy molding compound during the molding process and, hence, on the amount of wire sweep. In most mold flow simulations, the wire density effect is ignored. In order to consider the wire density effect on the predicted amount of wire sweep in the analysis, several indirect approaches were used by researchers before. But those approaches were not general enough to be applied to all cases. This paper presents a more direct and convenient approach to consider wire density effect by including wires in the mesh model for three-dimensional (3D) mold-filling analysis. A thin small outline package (TSOP) with 53 wires is used as the demonstration example, and all the wires are modeled in the 3D mesh. By comparison with experimental results, it is shown that this approach can accurately describe the wire density effect. When the wires are included in the mesh model, the predicted wire sweep results are better than those without considering the wire density effect.

scholarly journals Confidence Interval Based Fuzzy Evaluation Model for an Integrated-Circuit Packaging Molding Process

2019 ◽  
Vol 9 (13) ◽  
pp. 2623 ◽  
Author(s):  
Chun-Ming Yang ◽  
Kuo-Ping Lin ◽  
Kuen-Suan Chen
Keyword(s):  
Confidence Interval ◽  
Integrated Circuit ◽  
Evaluation Model ◽  
Measurement Data ◽  
Electronics Industry ◽  
Green Economy ◽  
Fuzzy Evaluation ◽  
Molding Process ◽  
Ic Packaging ◽  
Fuzzy Evaluation Model

The electronics industry in Taiwan has achieved a complete information and communication technology chain with a firm position in the global electronics industry. The integrated-circuit (IC) packaging industry chain adopts a professional division of labor model, and each process (including wafer dicing, die bonding, wire bonding, molding, and other subsequent processes) must have enhanced process capabilities to ensure the quality of the final product. Increasing quality can also lower the chances of waste and rework, lengthen product lifespan, and reduce maintenance, which means fewer resources invested, less pollution and damage to the environment, and smaller social losses. This contributes to the creation of a green process. This paper developed a complete quality evaluation model for the IC packaging molding process from the perspective of a green economy. The Six Sigma quality index (SSQI), which can fully reflect process yield and quality levels, is selected as a primary evaluation tool in this study. Since this index contains unknown parameters, a confidence interval based fuzzy evaluation model is proposed to increase estimation accuracy and overcome the issue of uncertainties in measurement data. Finally, a numerical example is given to illustrate the applicability and effectiveness of the proposed method.

Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit Integration

2014 ◽  
Vol 136 (4) ◽  
Author(s):  
John H. Lau
Keyword(s):  
Integrated Circuit ◽  
State Of The Art ◽  
Three Dimensional ◽  
High Volume ◽  
3D Integration ◽  
3D Ic ◽  
3D Ic Packaging ◽  
Ic Packaging ◽  
Circuit Integration ◽  
Three Dimensional Integrated Circuit

3D integration consists of 3D integrated circuit (IC) packaging, 3D Si integration, and 3D IC integration. They are different and in general the through-silicon via (TSV) separates 3D IC packaging from 3D Si/IC integrations since the latter two use TSV but 3D IC packaging does not. 3D Si integration and 3D IC integration are different. 3D IC integration stacks up the thin chips with TSV and microbump, while 3D Si integration stacks up thin wafers with TSV alone (i.e., bumpless). TSV is the heart of 3D Si/IC integrations and is the focus of this investigation. Also, the state-of-the-art, challenge, and trend of 3D integration will be presented and examined. Furthermore, supply chain readiness for high volume manufacturing (HVM) of TSVs is discussed.

scholarly journals Effecting aging time of epoxy molding compound to molding process for integrated circuit packaging

2017 ◽  
Vol 901 ◽  
pp. 012090 ◽  
Author(s):  
Jirayu Tachapitunsuk ◽  
Kessararat Ugsornrat ◽  
Warayoot Srisuwitthanon ◽  
Panakamon Thonglor
Keyword(s):  
Aging Time ◽  
Integrated Circuit ◽  
Molding Process ◽  
Epoxy Molding Compound ◽  
Molding Compound

Scanning Electron Microscopy in Hybrid Microelectronics

1976 ◽  
Vol 34 ◽  
pp. 456-457
Author(s):  
S. Khadpe ◽  
R. Faryniak
Keyword(s):  
Integrated Circuits ◽  
Thick Film ◽  
Integrated Circuit ◽  
Failure Modes ◽  
Three Dimensional ◽  
Circuit Components ◽  
Hybrid Microcircuit ◽  
Electrical Connections ◽  
Scanning Electron

The Scanning Electron Microscope (SEM) is an important tool in Thick Film Hybrid Microcircuits Manufacturing because of its large depth of focus and three dimensional capability. This paper discusses some of the important areas in which the SEM is used to monitor process control and component failure modes during the various stages of manufacture of a typical hybrid microcircuit.Figure 1 shows a thick film hybrid microcircuit used in a Motorola Paging Receiver. The circuit consists of thick film resistors and conductors screened and fired on a ceramic (aluminum oxide) substrate. Two integrated circuit dice are bonded to the conductors by means of conductive epoxy and electrical connections from each integrated circuit to the substrate are made by ultrasonically bonding 1 mil aluminum wires from the die pads to appropriate conductor pads on the substrate. In addition to the integrated circuits and the resistors, the circuit includes seven chip capacitors soldered onto the substrate. Some of the important considerations involved in the selection and reliability aspects of the hybrid circuit components are: (a) the quality of the substrate; (b) the surface structure of the thick film conductors; (c) the metallization characteristics of the integrated circuit; and (d) the quality of the wire bond interconnections.

Acoustic microscopy techniques for the inspection of integrated circuit devices and packages

1992 ◽  
Vol 50 (2) ◽  
pp. 966-967
Author(s):  
Thomas M. Moore
Keyword(s):  
Integrated Circuit ◽  
Acoustic Microscopy ◽  
Hybrid Technique ◽  
Frequency Scanning ◽  
Ic Packaging ◽  
Ic Package ◽  
Microscopy Techniques ◽  
Ic Package Inspection ◽  
Pulse Echo ◽  
Scanning Acoustic Microscope

In the last decade, a variety of characterization techniques based on acoustic phenomena have come into widespread use. Characteristics of matter waves such as their ability to penetrate optically opaque solids and produce image contrast based on acoustic impedance differences have made these techniques attractive to semiconductor and integrated circuit (IC) packaging researchers.These techniques can be divided into two groups. The first group includes techniques primarily applied to IC package inspection which take advantage of the ability of ultrasound to penetrate deeply and nondestructively through optically opaque solids. C-mode Acoustic Microscopy (C-AM) is a recently developed hybrid technique which combines the narrow-band pulse-echo piezotransducers of conventional C-scan recording with the precision scanning and sophisticated signal analysis capabilities normally associated with the high frequency Scanning Acoustic Microscope (SAM). A single piezotransducer is scanned over the sample and both transmits acoustic pulses into the sample and receives acoustic echo signals from the sample.

Analyzing the Impact of X-Ray Tomography on the Reliability of Integrated Circuits

2015 ◽  
Author(s):  
Halit Dogan ◽  
Md Mahbub Alam ◽  
Navid Asadizanjani ◽  
Sina Shahbazmohamadi ◽  
Domenic Forte ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Integrated Circuit ◽  
3D Imaging ◽  
Three Dimensional ◽  
Serial Sectioning ◽  
Promising Technique ◽  
Flash Memories ◽  
X Ray ◽  
3D Information ◽  
The Impact

Abstract X-ray tomography is a promising technique that can provide micron level, internal structure, and three dimensional (3D) information of an integrated circuit (IC) component without the need for serial sectioning or decapsulation. This is especially useful for counterfeit IC detection as demonstrated by recent work. Although the components remain physically intact during tomography, the effect of radiation on the electrical functionality is not yet fully investigated. In this paper we analyze the impact of X-ray tomography on the reliability of ICs with different fabrication technologies. We perform a 3D imaging using an advanced X-ray machine on Intel flash memories, Macronix flash memories, Xilinx Spartan 3 and Spartan 6 FPGAs. Electrical functionalities are then tested in a systematic procedure after each round of tomography to estimate the impact of X-ray on Flash erase time, read margin, and program operation, and the frequencies of ring oscillators in the FPGAs. A major finding is that erase times for flash memories of older technology are significantly degraded when exposed to tomography, eventually resulting in failure. However, the flash and Xilinx FPGAs of newer technologies seem less sensitive to tomography, as only minor degradations are observed. Further, we did not identify permanent failures for any chips in the time needed to perform tomography for counterfeit detection (approximately 2 hours).

Dependence of the Deformation of 128×128 InSb Focal-plane Arrays on the Silicon Readout Integrated Circuit Thickness

2015 ◽  
Vol 9 (1) ◽  
pp. 170-174 ◽  
Author(s):  
Xiaoling Zhang ◽  
Qingduan Meng ◽  
Liwen Zhang
Keyword(s):  
Thermal Shock ◽  
Indium Antimonide ◽  
Integrated Circuit ◽  
Focal Plane ◽  
Three Dimensional ◽  
Fracture Probability ◽  
Focal Plane Arrays ◽  
Thermal Shock Test ◽  
Readout Integrated Circuit ◽  
Three Dimensional Modeling

The square checkerboard buckling deformation appearing in indium antimonide infrared focal-plane arrays (InSb IRFPAs) subjected to the thermal shock tests, results in the fracturing of the InSb chip, which restricts its final yield. In light of the proposed three-dimensional modeling, we proposed the method of thinning a silicon readout integrated circuit (ROIC) to level the uneven top surface of InSb IRFPAs. Simulation results show that when the silicon ROIC is thinned from 300 μm to 20 μm, the maximal displacement in the InSb IRFPAs linearly decreases from 7.115 μm to 0.670 μm in the upward direction, and also decreases linearly from 14.013 μm to 1.612 μm in the downward direction. Once the thickness of the silicon ROIC is less than 50 μm, the square checkerboard buckling deformation distribution presenting in the thicker InSb IRFPAs disappears, and the top surface of the InSb IRFPAs becomes flat. All these findings imply that the thickness of the silicon ROIC determines the degree of deformation in the InSb IRFPAs under a thermal shock test, that the method of thinning a silicon ROIC is suitable for decreasing the fracture probability of the InSb chip, and that this approach improves the reliability of InSb IRFPAs.

Runner Balance Design of Soap Box Compounding Cavity Based on Moldflow

2014 ◽  
Vol 941-944 ◽  
pp. 1678-1681
Author(s):  
Hong Bing Wang ◽  
Zhi Rong Li ◽  
Chun Hua Sun ◽  
Yi Ping Zhang
Keyword(s):  
Three Dimensional ◽  
Simulation Software ◽  
Injection Mold ◽  
Balance Design ◽  
Filling Time ◽  
Critical Defect ◽  
Filling Analysis ◽  
Different Dimensions ◽  
Moldflow Simulation

Filling unbalance is a critical defect for injection mould. When the upper and lower covers of soap plastic box are produced by injection mold at the same time, filling unbalance in injection would appear because of the different dimensions of the two parts. For advancing the quality of the soap plastic box, the runner system is optimized with the filling analysis module and flow runner balance module of moldflow simulation software. The three-dimensional geometrical models of the two covers are constructed using Pro/e software. In moldflow the runner balance optimization of the soap box compounding cavity is analysis. The results indicate the optimized cross section of the runners can reduce the flow unbalance ratio from 3.38% to 0.73%, and the filling time and pressure can satisfy the demands. According to the analysis results moldflow is appropriate for runner balance design of the plastic products.

Three dimensional dielectrophoretic assembly of singlewalled carbon nanotubes for integrated circuit interconnects

2007 ◽  
Author(s):  
Nishant Khanduja ◽  
Selvapraba Selvarasah ◽  
Prashanth Makaram ◽  
Chia-Ling Chen ◽  
Ahmed Busnaina ◽  
...  
Keyword(s):  
Carbon Nanotubes ◽  
Integrated Circuit ◽  
Three Dimensional
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