Measurement of Thermal Boundary Conductance of a Series of Metal-Dielectric Interfaces by the Transient Thermoreflectance Technique

2005 ◽  
Vol 127 (3) ◽  
pp. 315-322 ◽  
Author(s):  
Robert J. Stevens ◽  
Andrew N. Smith ◽  
Pamela M. Norris

Measurement of the thermal boundary conductance (TBC) by use of a nondestructive optical technique, transient thermoreflectance (TTR), is presented. A simple thermal model for the TTR is presented with a discussion of its applicability and sensitivity. A specially prepared sample series of Cr, Al, Au, and Pt on four different substrates (Si, sapphire, GaN, and AlN) were tested at room temperature and the TTR signal fitted to the thermal model. The resulting TBC values vary by more than a factor of 3 0.71×108-2.3×108 W/m2 K. It is shown that the diffuse mismatch model (DMM) tended to overpredict the TBC of interfaces with materials having similar phonon spectra, while underpredicting the TBC for interfaces with dissimilar phonon spectra. The DMM only accounts for diffuse elastic scattering. Other scattering mechanisms are discussed which may explain the failure of the DMM at room temperature.

2009 ◽  
Vol 131 (2) ◽  
Author(s):  
Patrick E. Hopkins ◽  
Pamela M. Norris

The accuracy of predictions of phonon thermal boundary conductance using traditional models such as the diffuse mismatch model (DMM) varies depending on the types of material comprising the interface. The DMM assumes that phonons, undergoing diffuse scattering events, are elastically scattered, which drives the energy conductance across the interface. It has been shown that at relatively high temperatures (i.e., above the Debye temperature) previously ignored inelastic scattering events can contribute substantially to interfacial transport. In this case, the predictions from the DMM become highly inaccurate. In this paper, the effects of inelastic scattering on thermal boundary conductance at metal/dielectric interfaces are studied. Experimental transient thermoreflectance data showing inelastic trends are reviewed and compared to traditional models. Using the physical assumptions in the traditional models and experimental data, the relative contributions of inelastic and elastic scattering to thermal boundary conductance are inferred.


Author(s):  
Patrick E. Hopkins ◽  
Pamela M. Norris ◽  
Robert J. Stevens

The accuracy of predictions of thermal boundary conductance using traditional models such as the diffuse mismatch model (DMM) varies depending on the types of material comprising the interface. These traditional models assume that phonons are elastically scattered which drives the energy conductance across the interface. It has been shown that at relatively high temperatures (i.e., above the Debye temperature) inelastic scattering events can drive interfacial transport. In this case, the predictions from traditional models become highly inaccurate. In this paper, the effects of inelastic scattering on thermal boundary conductance at metal/dielectric interfaces are studied. Experimental transient thermoreflectance data showing inelastic trends are reviewed and compared to traditional models. Using the physical assumptions in the traditional models and the experimental data, the relative contributions of inelastic and elastic scattering on thermal boundary conductance is inferred.


2015 ◽  
Vol 16 (2) ◽  
pp. 257-260
Author(s):  
І.V. Semkiv ◽  
А.І. Kashuba ◽  
H.A. Ilchuk ◽  
M.V. Chekaylo

Symmetrical analysis of the phonon spectra of  lowtemperature b¢-phase of crystal Ag8SnSe6 carried out. At the room temperature argyrodite Ag8SnSe6 belong to orthorhombic system with space group symmetry Pmn21. Classification of the main phonon modes of crystal carried out. Clarified selection rules for Raman spectra and infrared spectra.


Volume 4 ◽  
2004 ◽  
Author(s):  
Robert J. Stevens ◽  
Pamela M. Norris ◽  
Arthur W. Lichtenberger

Understanding thermal boundary resistance (TBR) is becoming increasingly important for the thermal management of micro and optoelectronic devices. The current understanding of room temperature TBR is often not adequate for the thermal design of tomorrow’s complex micro and nano devices. Theories have been developed to explain the resistance to energy transport by phonons across interfaces. The acoustic mismatch model (AMM) [1, 2], which has had success at explaining low temperature TBR, does not account for the high frequency phonons and imperfect interfaces of real devices at room temperature. The diffuse mismatch model (DMM) was developed to account for real surfaces with higher energy phonons [3, 4]. DMM assumes that all phonons incident on the interface from both sides are elastically scattered and then emitted to either side of the interface. The probability that a phonon is emitted to a particular side is proportional to the phonon density of states of the two interface materials. Inherent to the DMM is that the transport is independent of the interface structure itself and is only dependent on the properties of the two materials. Recent works have shown that the DMM does not adequately capture all the energy transport mechanisms at the interface [5, 6]. In particular, the DMM under-predicts transport across interfaces between non Debye-like materials, such at Pb and diamond, by approximately an order of magnitude. The DMM also tends to over-predict transport for interfaces made with materials of similar acoustic properties, Debye-like materials. There have been several explanations and models developed to explain the discrepancies between the mismatch models and experimental data. Some of these models are based on modification of the AMM and DMM [7–9]. Other works have utilized lattice-dynamical modeling to calculate phonon transmission coefficients and thermal boundary conductivities for abrupt and disordered interfaces [3, 6, 10–13]. Recent efforts to better understand room temperature TBR have utilized molecular dynamics simulations to account for more realistic anharmonic materials and inelastic scattering [14–18]. Models have also been developed to account for electron-phonon scattering and its effect on the thermal boundary conductance for interfaces with one metal side [19–22]. Although there have been numerous thermal boundary resistance theoretical developments since the introduction of the AMM, there still is not an unifying theory that has been well validated for high temperature solid-solid interfaces. Most of the models attempt to explain some of the experimental outliers, such as Pb/diamond and TiN/MgO interfaces [6, 23], but have not been fully tested for a range of experimental data. Part of the problem lies in the fact that very little reliable data is available, especially data that is systematically taken to validate a particular model. To this end, preliminary measurements of TBR are being made on a series of metal on non-metal substrate interfaces using a non-destructive optical technique, transient thermal reflectance (TTR) described in Stevens et al. [5]. Initial testing examines the impact of different substrate preparation and deposition conditions on TBR for Debye-like interfaces for which TBR should be small for clean and abrupt interfaces. Variables considered include sputter etching power and duration, electron beam source clean, and substrate temperature control. The impact of alloying and non-abrupt interfaces on the TBR is examined by fabricating interfaces of both Debye-like and non Debye-like interfaces followed by systematically measuring TBR and altering the interfaces by annealing the samples to increase the diffusion depths at the interfaces. Inelastic electron scattering at the interface has been proposed by Hubermann et al. and Sergeev to decrease TBR at interfaces [19–21]. Two sets of samples are prepared to examine the electron-phonon connection to improved thermal boundary conductance. The first consists of thin Pt and Ag films on Si and sapphire substrates. Pt and Ag electron-phonon coupling factors are 60 and 3.1×1016 W/m3K respectively. Both Pt and Ag have similar Debye temperatures, so electron scattering rates can be examined without much change in acoustic effects. The second electron scattering sample series consist of multiple interfaces fabricated with Ni, Ge, and Si to separate the phonon and electron portions of thermal transport. The experimental data is compared to several of the proposed theories.


2020 ◽  
Vol 239 ◽  
pp. 14003
Author(s):  
Gilles Noguere ◽  
Shuqi Xu ◽  
Alain Filhol ◽  
Jacques Ollivier ◽  
Emmanuel Farhi ◽  
...  

Experimental phonon densities of states of UO2 have been deduced from double-differential neutron scattering data measured at 300 K, 600 K and 900 K using the IN6 time-of-flight spectrometer of the Institute Laue-langevin (ILL). The comparison with ab intio phonon spectra obtained at the North Caroline South University from first-principle calculations confirms that harmonic vibrations of the atoms cannot accurately reproduce the phonon broadening related to the oxygen atoms.


Open Physics ◽  
2015 ◽  
Vol 13 (1) ◽  
Author(s):  
K. Alfaramawi

AbstractDirect analytical calculations of the static dielectric permittivity-dependent electron mobility due to different elastic scattering mechanisms for n-type InSb were carried out. The calculated static dielectric permittivity increases by increasing of donor concentration. The temperature dependence of the electron mobility from 10 K up to 300 K has been demonstrated. Generally, the electron mobility shows peak behavior in this range of temperatures. The direct correlation between the electron mobility and the static dielectric permittivity at 300 K was investigated. The dependence of the electron mobility on donor concentration was discussed both when the static dielectric permittivity is assumed to be varying and when it is assumed to be a constant. The difference in behavior was noticed particularly at high donor concentrations.


2008 ◽  
Vol 130 (2) ◽  
Author(s):  
Patrick E. Hopkins ◽  
Pamela M. Norris ◽  
Robert J. Stevens

Thermal boundary conductance is becoming increasingly important in microelectronic device design and thermal management. Although there has been much success in predicting and modeling thermal boundary conductance at low temperatures, the current models applied at temperatures more common in device operation are not adequate due to our current limited understanding of phonon transport channels. In this study, the scattering processes across Cr∕Si, Al∕Al2O3, Pt∕Al2O3, and Pt∕AlN interfaces were examined by transient thermoreflectance testing at high temperatures. At high temperatures, traditional models predict the thermal boundary conductance to be relatively constant in these systems due to assumptions about phonon elastic scattering. Experiments, however, show an increase in the conductance indicating inelastic phonon processes. Previous molecular dynamic simulations of simple interfaces indicate the presence of inelastic scattering, which increases interfacial transport linearly with temperature. The trends predicted computationally are similar to those found during experimental testing, exposing the role of multiple-phonon processes in thermal boundary conductance at high temperatures.


2009 ◽  
Vol 131 (4) ◽  
Author(s):  
Pamela M. Norris ◽  
Patrick E. Hopkins

Today’s electronic and optoelectronic devices are plagued by heat transfer issues. As device dimensions shrink and operating frequencies increase, ever-increasing amounts of thermal energy are being generated in smaller and smaller volumes. As devices shrink to length scales on the order of carrier mean free paths, thermal transport is no longer dictated by the thermal properties of the materials comprising the devices, but rather the transport of energy across the interfaces between adjacent materials in the devices. In this paper, current theories and experiments concerning phonon scattering processes driving thermal boundary conductance (hBD) are reviewed. Experimental studies of thermal boundary conductance conducted with the transient thermoreflectance technique challenging specific assumptions about phonon scattering during thermal boundary conductance are presented. To examine the effects of atomic mixing at the interface on hBD, a series of Cr/Si samples was fabricated subject to different deposition conditions. The varying degrees of atomic mixing were measured with Auger electron spectroscopy. Phonon scattering phenomena in the presence of interfacial mixing were observed with the trends in the Cr/Si hBD. The experimental results are reviewed and a virtual crystal diffuse mismatch model is presented to add insight into the effect of interatomic mixing at the interface. The assumption that phonons can only transmit energy across the interface by scattering with a phonon of the same frequency—i.e., elastic scattering, can lead to underpredictions of hBD by almost an order of magnitude. To examine the effects of inelastic scattering on hBD, a series of metal/dielectric interfaces with a wide range of vibrational similarity is studied at temperatures above and around materials’ Debye temperatures. Inelastic scattering is observed and new models are developed to predict hBD and its relative dependency on elastic and inelastic scattering events.


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