Optical Fiber Shifts and Shear Stains in V-Groove Arrays for Optical MEMS Packaging

2005 ◽  
Vol 127 (1) ◽  
pp. 25-28 ◽  
Author(s):  
Z. W. Zhong ◽  
S. C. Lim ◽  
A. Asundi
Keyword(s):  
Optical Fiber ◽  
Thermal Loading ◽  
Optical Loss ◽  
Epoxy Adhesive ◽  
Temperature Cycling ◽  
Optical Mems ◽  
Element Analysis ◽  
Fiber Array ◽  
Thermally Induced ◽  
Mems Packaging

The objective of this study is to investigate optical fiber shifts and shear stains in V-groove arrays for optical microelectromechanical system packaging, when the arrays are subjected to temperature cycling. Thermally induced optical fiber shifts in the joints consisting of an optical fiber, epoxy adhesive, and silicon substrate were simulated using a finite element analysis (FEA) package ANSYS. Experiments using real-time Moire´ interferometry were also performed at temperatures of 25, 40, 60, 85 and 100°C for confirmation of the analysis results. The study revealed that thermally induced fiber shifts increased with the number of V-groove channels. The shear strains at the fiber and silicon interface in the fiber joints increased as the V-groove channel was further away from the neutral point of the fiber array packages. The optical coupling loss is the greatest during thermal loading for the outer fiber in the four channel V-groove array. Optical loss of 0.334 and 0.346 dB was calculated using the fiber shift values obtained from the FEA and experimental results, respectively. The effect of fiber shifts, especially the shift of the fiber that is positioned at the outermost V-groove in the array, cannot be ignored.

Effects of thermally induced optical fiber shifts in V-groove arrays for optical MEMS

2005 ◽  
Vol 36 (2) ◽  
pp. 109-113 ◽  
Author(s):  
Z.W. Zhong ◽  
S.C. Lim ◽  
A. Asundi
Keyword(s):  
Optical Fiber ◽  
Optical Mems ◽  
Thermally Induced

Analysis of a Virtual Prototype First-Stage Rotor Blade Using Integrated Computer-Based Design Tools

2006 ◽  
Author(s):  
Michel Arnal ◽  
Christian Precht ◽  
Thomas Sprunk ◽  
Tobias Danninger ◽  
John Stokes
Keyword(s):  
Heat Transfer ◽  
Gas Flow ◽  
Thermal Loading ◽  
Cfd Simulation ◽  
Three Dimensional ◽  
Life Assessment ◽  
Element Analysis ◽  
Pressure Losses ◽  
Cooling Channels ◽  
Internally Cooled

The present paper outlines a practical methodology for improved virtual prototyping, using as an example, the recently re-engineered, internally-cooled 1st stage blade of a 40 MW industrial gas turbine. Using the full 3-D CAD model of the blade, a CFD simulation that includes the hot gas flow around the blade, conjugate heat transfer from the fluid to the solid at the blade surface, heat conduction through the solid, and the coolant flow in the plenum is performed. The pressure losses through and heat transfer to the cooling channels inside the airfoil are captured with a 1-D code and the 1-D results are linked to the three-dimensional CFD analysis. The resultant three-dimensional temperature distribution through the blade provides the required thermal loading for the subsequent structural finite element analysis. The results of this analysis include the thermo-mechanical stress distribution, which is the basis for blade life assessment.

Heat Transfer and Thermal Stress Analysis of an Optoelectronic Package

1991 ◽  
Vol 113 (3) ◽  
pp. 258-262 ◽  
Author(s):  
J. G. Stack ◽  
M. S. Acarlar
Keyword(s):  
Heat Transfer ◽  
Thermal Management ◽  
Power Dissipation ◽  
Point Of View ◽  
Optical Data ◽  
Data Link ◽  
Element Analysis ◽  
Thermally Induced ◽  
Temperature Changes ◽  
Induced Stresses

The reliability and life of an Optical Data Link transmitter are inversely related to the temperature of the LED. It is therefore critical to have efficient packaging from the point of view of thermal management. For the ODL® 200H devices, it is also necessary to ensure that all package seals remain hermetic throughout the stringent military temperature range requirements of −65 to +150°C. For these devices, finite element analysis was used to study both the thermal paths due to LED power dissipation and the thermally induced stresses in the hermetic joints due to ambient temperature changes

Fabrication of Lensed Plastic Optical Fiber Array Using Electrostatic Force

2011 ◽  
Vol 133 (3) ◽  
Author(s):  
Yih-Tun Tseng ◽  
Jhong-Bin Huang ◽  
Che-Hsin Lin ◽  
Chin-Lung Chen ◽  
Wood-Hi Cheng
Keyword(s):  
Optical Fiber ◽  
Optical Fibers ◽  
Electrostatic Force ◽  
Coupling Efficiency ◽  
Numerical Aperture ◽  
Uv Curing ◽  
Power Budget ◽  
Fiber Array ◽  
Plastic Optical Fibers ◽  
Efficient Coupling

The GI (graded-index) POFs (Plastic optical fibers), which has been proven to reach distances as long as 1 km at 1.25 Gb/s has a relatively low numerical aperture . Therefore, the efficient coupling of GI POFs to the light source has become critical to the power budget in the system. Efficient coupling for a POFs system normally involves either a separate lens or the direct formation of the lens at the end of the fiber. Forming the lens-like structure directly on the fiber end is preferred for simplicity of fabrication and packaging, such as polishing and fusion, combine different fibers with the cascaded fiber method and hydroflouride (HF) chemical etching. These approaches are well established, but applicable only to glass. Optical assembly architecture for multichannel fibers and optical devices is critical to optical fiber interconnections. Multichannel fiber-pigtail laser diode (LD) modules have potential for supporting higher data throughput and longer transmission distances. However, to be of practical use, these modules must be more precise. This work proposes and manufactures lensed plastic optical fibers (LPOF) array. This novel manipulation can be utilized to fabricate an aspherical lens on a fiber array after the UV curing of the photo-sensitive polymer; the coupling efficiency (CE) is increased and exceeds 47% between the LD array and the fiber array.

Finite Element Analysis of a Gasketed Flange Joint Under Combined Internal Pressure and Thermal Transient Loading

2007 ◽  
Author(s):  
Muhammad Abid ◽  
Javed A. Chattha ◽  
Kamran A. Khan
Keyword(s):  
Finite Element Analysis ◽  
Steady State ◽  
Internal Pressure ◽  
Thermal Loading ◽  
Flange Joint ◽  
Element Analysis ◽  
Transient Loading ◽  
Thermal Transient ◽  
Transient Thermal ◽  
Bolted Flange

Performance of a bolted flange joint is characterized mainly by its ‘strength’ and ‘sealing capability’. A number of analytical and experimental studies have been conducted to study these characteristics only under internal pressure loading. In the available published work, thermal behavior of the pipe flange joints is discussed under steady state loading with and without internal pressure and under transient loading condition without internal pressure. The present design codes also do not address the effects of steady state and thermal transient loading on the structural integrity and sealing ability. It is realized that due to the ignorance of any applied transient thermal loading, the optimized performance of the bolted flange joint can not be achieved. In this paper, in order to investigate gasketed joint’s performance i.e. joint strength and sealing capability under combined internal pressure and transient thermal loading, an extensive nonlinear finite element analysis is carried out and its behavior is discussed.

An Interfacial Delamination Analysis for Multichip Module Thin Film Interconnects

1996 ◽  
Vol 118 (4) ◽  
pp. 206-213 ◽  
Author(s):  
K. X. Hu ◽  
C. P. Yeh ◽  
X. S. Wu ◽  
K. Wyatt
Keyword(s):  
Thin Film ◽  
Phase Angle ◽  
Structural Reliability ◽  
Thermal Loading ◽  
Multichip Module ◽  
Crack Model ◽  
Element Analysis ◽  
Delamination Growth ◽  
Interfacial Delamination ◽  
Functional Behavior

Analysis of interfacial delamination for multichip module thin-film interconnects (MCM/TFI) is the primary objective of this paper. An interface crack model is integrated with finite-element analysis to allow for accurate numerical evaluation of the magnitude and phase angle of the complex stress intensity factor. Under the assumption of quasi-static delamination growth, the fate of an interfacial delamination after inception of propagation is determined. It is established that whether an interfacial delamination will continue to grow or become arrested depends on the functional behavior of the energy release rate and loading phase angle over the history of delamination growth. This functional behavior is numerically obtained for a typical MCM/TFI structure with delamination along die and via base, subjected to thermal loading condition. The effect of delamination interactions on the structural reliability is also investigated. It is observed that the delamination along via wall and polymer thin film can provide a benevolent mechanism to relieve thermal constraints, leading to via stress relaxation.

End preparation and fusion splicing of an optical fiber array with a CO_2 laser

1979 ◽  
Vol 18 (19) ◽  
pp. 3256 ◽  
Author(s):  
Kyoichi Kinoshita ◽  
Morio Kobayashi
Keyword(s):  
Optical Fiber ◽  
Fiber Array ◽  
Optical Fiber Array

Clamp Load Decay Due to Material Creep of Lightweight-Material Joints Under Cyclic Temperature

2015 ◽  
Vol 137 (5) ◽  
Author(s):  
Sayed A. Nassar ◽  
Amir Kazemi
Keyword(s):  
Finite Element ◽  
Temperature Profile ◽  
Thermal Loading ◽  
Substrate Material ◽  
Valuable Insight ◽  
Substrate Thickness ◽  
Element Analysis ◽  
Fea Model ◽  
Cyclic Temperature ◽  
Material Creep

Experimental and finite element techniques are used for investigating the effect of cyclic thermal loading on the clamp load decay in preloaded single-lap bolted joints that are made of multimaterial lightweight alloys. Substrate material combinations include aluminum, magnesium, and steel, with various coupon thicknesses. The range of cyclic temperature profile varies between −20 °C and +150 °C in a computer-controlled environmental chamber for generating the desired cyclic temperature profile and durations. Real time clamp load data are recorded using strain gage-based, high-temperature, load cells. Clamp load decay is investigated for various combinations of joint materials, initial preload level, and substrate thickness. Thermal and material creep finite element analysis (FEA) is performed using temperature-dependent mechanical properties. The FEA model and results provided a valuable insight into the experimental results regarding the vulnerability of some lightweight materials to significant material creep at higher temperatures.

scholarly journals Thermo-hydro-mechanical coupling analysis of a thermo-active diaphragm wall

2018 ◽  
Vol 55 (5) ◽  
pp. 720-735 ◽  
Author(s):  
Yi Rui ◽  
Mei Yin
Keyword(s):  
New Technologies ◽  
Bending Moment ◽  
Diaphragm Wall ◽  
Elastic Model ◽  
Element Analysis ◽  
Thermally Induced ◽  
Mechanical Coupling ◽  
Reversal Effect ◽  
Earth Pressures ◽  
Geotechnical Aspect

Thermo-active diaphragm walls that combine load bearing ability with a ground source heat pump (GSHP) are considered to be one of the new technologies in geotechnical engineering. Despite the vast range of potential applications, current thermo-active diaphragm wall designs have very limited use from a geotechnical aspect. This paper investigates the wall–soil interaction behaviour of a thermo-active diaphragm wall by conducting a thermo-hydro-mechanical finite element analysis. The GSHP operates by circulating cold coolant into the thermo-active diaphragm wall during winter. Soil contraction and small changes in the earth pressures acting on the wall are observed. The strain reversal effect makes the soil stiffness increase when the wall moves in the unexcavated side direction, and hence gives different trends for long-term wall movements compared to the linear elastic model. The GSHP operation makes the wall move in a cyclic manner, and the seasonal variation is approximately 0.5–1 mm, caused by two factors: the thermal effects on the deformation of the diaphragm wall itself and the thermally induced volume change of the soil and pore water. In addition, it is found that the change in bending moment of the wall due to the seasonal GSHP cycle is caused mainly by the thermal differential across the wall during the winter, because the seasonal changes in earth pressures acting on the diaphragm wall are very limited.

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