Failure Analysis of Rapid Prototyped Tooling in Sheet Metal Forming—Cylindrical Cup Drawing

2005 ◽  
Vol 127 (1) ◽  
pp. 126-137 ◽  
Author(s):  
Y. Park ◽  
J. S. Colton
Keyword(s):  
Failure Analysis ◽  
Failure Mode ◽  
Failure Modes ◽  
Estimation Method ◽  
Statistical Design ◽  
Statistical Design Of Experiments ◽  
Mode Estimation ◽  
Cylindrical Cup ◽  
Drawing Dies ◽  
Cup Drawing

This paper presents a failure analysis of cylindrical cup drawing dies machined from a polymer composite rapid tooling material. Cup drawing is a complicated process, involving both bending and stretching. In this study, possible die failure modes are identified experimentally. Finite element analyses (FEA) are performed to obtain the stress–strain responses, which are used to determine the dominant failure mode. As cup drawing involves interactions among process parameters, the statistical design of experiments is employed to perform a parametric study. The resulting die failure mode estimation method is verified through experiments.

Study of Thermal Cycle Induced CPI Failure Mode in a Lidded FC-BGA Package

2019 ◽  
Author(s):  
Muhammad Monzur Morshed ◽  
Esther Chen ◽  
Anita Madan
Keyword(s):  
Failure Analysis ◽  
Failure Mode ◽  
Failure Modes ◽  
Material Selection ◽  
Interfacial Stress ◽  
Analysis Techniques ◽  
Bga Package ◽  
Induced Defects ◽  
Fatigue Failures ◽  
Insight Into

Abstract Dissimilarities of thermal expansion coefficient between chip and package materials results in stress and strain at the solder interconnect leading to fatigue failures. Underfill is used between chip and package to reduce the interfacial stress and hence increase reliability. In this work, four flipchip package test vehicles underwent thermal cycling to accelerate the stress and were investigated systematically with different failure analysis techniques to study their failure modes. The prevalent failure mode was observed to be at the corner area between the chip and package using different advanced failure analysis techniques. This work demonstrates the technical complexity of analyzing stress induced defects and provides insight into CPI-based material selection.

scholarly journals Numerical and Experimental Failure Analysis of Carbon Fiber-Reinforced Polymer-Based Pyrotechnic Separation Device

2020 ◽  
Vol 2020 ◽  
pp. 1-12
Author(s):  
Mingfa Ren ◽  
Fei Weng ◽  
Jing Sun ◽  
Zhifeng Zhang ◽  
Zhiguo Ma ◽  
...  
Keyword(s):  
Carbon Fiber ◽  
Failure Analysis ◽  
Failure Mode ◽  
Failure Modes ◽  
Lightweight Design ◽  
Shaped Charge ◽  
Tensile Failure ◽  
Fiber Reinforced ◽  
Metal Materials ◽  
Separation Devices

Current pyrotechnic separation devices are mainly made of metal materials, limiting the capacity of lightweight design in advanced launching vehicles. With the outstanding mechanical properties, such as high mass-specific strength and modulus, carbon fiber-reinforced polymers (CFRPs) have the potential to replace metal materials in pyrotechnic seperaton devices. However, to improve the seperation reliability of these pyrotechnic separation devices, there still needs further understanding on the the failure mode of CFRP composites under linear shaped charge (LSC). In this paper, cutting tests were carried out on CFRPs for the failure analysis of CFRPs under LSC, and nonlinear finite element analysis (FEA) was performed to characterize the evolution of LSC cutting in CFRPs. According to experimental simulation and numerical simulation, it can be found that the three main failure modes in CERPs while subjected to LSC jet are shear failure, delamination failure, and tensile failure. In the early cutting stage, the initial time of damage of the fiber and the matrix near the shaped charge shows less difference and the laminate is directly separated by the energy of high-speed jet. When the jet velocity decreases, the jet morphology collapses and matrix damages precede into the fiber, which would cause tensile failure mode of CFRPs. Meanwhile, the delamination in low jet speed stages is larger than that in the high jet speed stages. These studies on the failure modes of CFRPs under LSC provide important basis for the future design of CFRP-based pyrotechnic separation devices, which is important to the lightweight design of launching vehicles.

Multi criteria FMECA for coal-fired thermal power plants using COPRAS-G

2014 ◽  
Vol 31 (5) ◽  
pp. 601-614 ◽  
Author(s):  
Debasis Das Adhikary ◽  
Goutam Kumar Bose ◽  
Dipankar Bose ◽  
Souren Mitra
Keyword(s):  
Failure Mode ◽  
Power Plants ◽  
Failure Modes ◽  
Thermal Power ◽  
Uncertain Data ◽  
Estimation Method ◽  
Straight Tube ◽  
Thermal Power Plants ◽  
Content Type ◽  
Criticality Analysis

Purpose – The purpose of this paper is to present a multi criterion failure mode effect and criticality analysis for coal-fired thermal power plants using uncertain data as well as substituting the traditional risk priority number estimation method. Design/methodology/approach – Grey-complex proportional assessment (COPRAS-G) method, a multi criteria decision making tool is applied to evaluate the criticalities of the failure modes (alternatives). In this model the criteria (criticality factor) against each alternative are expressed in grey number instead of crisp values. Findings – Rupture failure of the straight tube of economizer (ECO) due to erosion is the highest critical failure mode whereas rupture failure of the stub of ECO due to welding defect is the lowest critical failure mode. Originality/value – This paper incorporates human and environmental factors as additional factors which also influence the failure modes significantly. The COPRAS-G method is modified according this problem. Uncertainty in the scoring of criticality factors against each failure mode by various maintenance personnel is expressed in grey numbers.

Identifying Failure Modes and Effects Through Design for Assembly Analysis

2018 ◽  
Author(s):  
Phyo Htet Hein ◽  
Nate Voris ◽  
Jiaying Dai ◽  
Beshoy W. Morkos
Keyword(s):  
Failure Mode ◽  
Failure Modes ◽  
Estimation Method ◽  
Time Estimation ◽  
Handling Time ◽  
Insertion Time ◽  
Design For Assembly ◽  
Assembly Time ◽  
Time Required ◽  
The Ideal

Design for Assembly (DFA) time estimation method developed by G. Boothroyd and P. Dewhurst allows for estimating the assembly time of artifacts based on analysis of component features using handling and insertion tables by an assembler, who is assumed to assemble the artifact one-part-at-a-time. Using the tables, each component is assigned an assembly time which is based on the time required for the assembler to manipulate (handling time) and the time required for it to interface with the rest of the components (insertion time). Using this assembly time and the ideal assembly time (i.e. the absolute time it takes to assemble the artifact, assuming each component takes the ideal time of three seconds to handle and insert), this method allows to calculate the efficiency of a design’s assembly process. Another tool occasionally used in Design for Manufacturing (DFM) is Failure Modes and Effects Analysis (FMEA). FMEA is used to evaluate and document failure modes and their impact on system performance. Each failure mode is ranked based on its severity, occurrence, and detectability scores, and corrective actions that can be taken to control risk items. FMEA scores of components can address the manufacturing operations and how much effort should be put into each specific component. In this paper, the authors attempt to answer the following two research questions (RQs) to determine the relationships between FMEA scores and the DFA assembly time to investigate if part failure’s severity, occurrence, and detectability can be estimated if handling time and insertion time are known. RQ (1): Can DFA metrics (handling time and insertion time) be utilized to estimate Failure Mode and Effects scores (severity, occurrence, and detectability)? RQ (2): How does each response metric relate to predictor metrics (positive, negative, or no relationship)? This is accomplished by performing Boothroyd and Dewhurst’s DFA time estimation and FMEA on select set of simple products. Since DFA metrics are based on combination of designer’s subjectivity and part’s geometric specifications and FMEA scores are based only on designer’s subjectivity, this paper attempts to estimate part failure severity, occurrence, and detectability less subjectively by using the handling time and insertion time. This will also allow for earlier and faster acquisition of potential part failure information for use in design and manufacturing processes.

STATISTICAL DESIGN OF EXPERIMENTS FOR THE Cr(VI) ADSORPTION ON WEED Salvinia cucullata

2013 ◽  
Vol 12 (3) ◽  
pp. 465-474 ◽  
Author(s):  
Saroj Sundar Baral ◽  
Ganesan Surendran ◽  
Namrata Das ◽  
Polisetty Venkateswara Rao
Keyword(s):  
Design Of Experiments ◽  
Statistical Design ◽  
Statistical Design Of Experiments

Failure Analysis Case Study of a 1.5 Meter Space Flex Harness

2017 ◽  
Author(s):  
Erick Kim ◽  
Kamjou Mansour ◽  
Gil Garteiz ◽  
Javeck Verdugo ◽  
Ryan Ross ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Failure Modes ◽  
Field Of View ◽  
Area Of Interest ◽  
Air Stream ◽  
Novel Method ◽  
Temperature Controlled ◽  
Non Destructive ◽  
Failure Site

Abstract This paper presents the failure analysis on a 1.5m flex harness for a space flight instrument that exhibited two failure modes: global isolation resistances between all adjacent traces measured tens of milliohm and lower resistance on the order of 1 kiloohm was observed on several pins. It shows a novel method using a temperature controlled air stream while monitoring isolation resistance to identify a general area of interest of a low isolation resistance failure. The paper explains how isolation resistance measurements were taken and details the steps taken in both destructive and non-destructive analyses. In theory, infrared hotspot could have been completed along the length of the flex harness to locate the failure site. However, with a field of view of approximately 5 x 5 cm, this technique would have been time prohibitive.

Case Studies of Brittle Interfacial Failures in Area Array Solder Interconnects

2000 ◽  
Author(s):  
George M. Wenger ◽  
Richard J. Coyle ◽  
Patrick P. Solan ◽  
John K. Dorey ◽  
Courtney V. Dodd ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Case Studies ◽  
Failure Modes ◽  
Electroless Nickel ◽  
Electrical Performance ◽  
Printed Wiring Board ◽  
Solder Interconnects ◽  
Area Array ◽  
Surface Finishes ◽  
Soldering Reaction

Abstract A common pad finish on area array (BGA or CSP) packages and printed wiring board (PWB) substrates is Ni/Au, using either electrolytic or electroless deposition processes. Although both Ni/Au processes provide flat, solderable surface finishes, there are an increasing number of applications of the electroless nickel/immersion gold (ENi/IAu) surface finish in response to requirements for increased density and electrical performance. This increasing usage continues despite mounting evidence that Ni/Au causes or contributes to catastrophic, brittle, interfacial solder joint fractures. These brittle, interfacial fractures occur early in service or can be generated under a variety of laboratory testing conditions including thermal cycling (premature failures), isothermal aging (high temperature storage), and mechanical testing. There are major initiatives by electronics industry consortia as well as research by individual companies to eliminate these fracture phenomena. Despite these efforts, interfacial fractures associated with Ni/Au surface finishes continue to be reported and specific failure mechanisms and root cause of these failures remains under investigation. Failure analysis techniques and methodologies are crucial to advancing the understanding of these phenomena. In this study, the scope of the fracture problem is illustrated using three failure analysis case studies of brittle interfacial fractures in area array solder interconnects. Two distinct failure modes are associated with Ni/Au surface finishes. In both modes, the fracture surfaces appear to be relatively flat with little evidence of plastic deformation. Detailed metallography, scanning electron microscopy (SEM), energy dispersive x-ray analysis (EDX), and an understanding of the metallurgy of the soldering reaction are required to avoid misinterpreting the failure modes.

Analysis of Delta Iddq Soft Fails on Pass Chips

2006 ◽  
Author(s):  
I. Österreicher ◽  
S. Eckl ◽  
B. Tippelt ◽  
S. Döring ◽  
R. Prang ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Failure Mode ◽  
Photon Emission ◽  
Complete Analysis ◽  
Functional Tests ◽  
Analysis Techniques ◽  
Atomic Force ◽  
Current Consumption ◽  
Emission Microscopy ◽  
Failure Localization

Abstract Depending on the field of application the ICs have to meet requirements that differ strongly from product to product, although they may be manufactured with similar technologies. In this paper a study of a failure mode is presented that occurs on chips which have passed all functional tests. Small differences in current consumption depending on the state of an applied pattern (delta Iddq measurement) are analyzed, although these differences are clearly within the usual specs. The challenge to apply the existing failure analysis techniques to these new fail modes is explained. The complete analysis flow from electrical test and Global Failure Localization to visualization is shown. The failure is localized by means of photon emission microscopy, further analyzed by Atomic Force Probing, and then visualized by SEM and TEM imaging.

Combine Nanoprobing Technique with Difference Analysis to Identify Nonvisual Failures

2006 ◽  
Author(s):  
Cha-Ming Shen ◽  
Tsan-Cheng Chuang ◽  
Jie-Fei Chang ◽  
Jin-Hong Chou
Keyword(s):  
Failure Mode ◽  
Failure Modes ◽  
Electrical Characteristic ◽  
The Novel ◽  
Difference Analysis ◽  
Original Idea ◽  
Deductive Method ◽  
Complete Measurement

Abstract This paper presents a novel deductive methodology, which is accomplished by applying difference analysis to nano-probing technique. In order to prove the novel methodology, the specimens with 90nm process and soft failures were chosen for the experiment. The objective is to overcome the difficulty in detecting non-visual, erratic, and complex failure modes. And the original idea of this deductive method is based on the complete measurement of electrical characteristic by nano-probing and difference analysis. The capability to distinguish erratic and invisible defect was proven, even when the compound and complicated failure mode resulted in a puzzling characteristic.

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