Mechanical and Thermomechanical Elastic-Plastic Contact Analysis of Layered Media With Patterned Surfaces

2004 ◽  
Vol 126 (1) ◽  
pp. 9-17 ◽  
Author(s):  
Z.-Q. Gong ◽  
K. Komvopoulos

An elastic-plastic finite element analysis of a sphere in normal and sliding contact with a layered medium possessing a patterned surface with regularly spaced rectangular pads was conducted in order to investigate the effect of pattern geometry on the contact pressure distribution and subsurface stress-strain field. Three-dimensional sliding simulations were performed for lateral displacement of the indenting sphere approximately equal to two times the pad spatial periodicity. Three complete loading cycles, involving indentation, sliding, and unloading of a rigid sphere, were simulated to assess the effect of repeated sliding on the stresses in the first (hard) layer and plastic deformation in the underlying (soft) layer. Thermomechanical sliding contact simulations of an elastic-plastic layered medium with a patterned surface and an elastic-plastic sphere with properties identical to those of the first layer were carried out to examine the effect of frictional heating on the deformation behavior of the medium. Results are presented for the temperature distribution and maximum temperature variation at the surface and the evolution of subsurface plasticity in terms of Peclet number. The likelihood of thermal cracking in the wake of microcontacts during sliding is interpreted in the context of the thermal tensile stress due to the temperature gradients in the layered medium.

Author(s):  
John Moody ◽  
Itzhak Green

This work presents the results from a three dimensional (3D) finite element analysis (FEA) of an elastic-plastic asperity contact model for two spherical bodies sliding across each other with various preset vertical interferences. Stresses, forces, contact areas, deformations, and net energy loss are presented for steel-on-steel and aluminum-on-copper contact.


Author(s):  
John Moody ◽  
Itzhak Green

This work presents a three dimensional (3D) finite element analysis (FEA) of an elastic-plastic hemispherical contact model for two hemispherical bodies sliding across each other with various preset vertical interferences. The boundary conditions, model simplifications, and the normalization scheme are presented. Sample results from this FEA investigation are compared to a semi-analytical solution to validate the methodology.


2012 ◽  
Vol 569 ◽  
pp. 82-87
Author(s):  
Yi Li ◽  
Xiu Chen Zhao ◽  
Ying Liu ◽  
Hong Li

Three dimensional thermo-electrical finite element analysis was employed to simulate the current density and temperature distributions for solder bump joints with different bump shapes. Mean-time-to-failure (MTTF) of electromigration was discussed. It was found that as the bump volume increased from hourglass bump to barrel bump, the maximum current density increased but the maximum temperature decreased. Hourglass bump with waist radius of 240 μm has the longest MTTF.


2002 ◽  
Vol 125 (1) ◽  
pp. 52-59 ◽  
Author(s):  
N. Ye ◽  
K. Komvopoulos

The simultaneous effects of mechanical and thermal surface loadings on the deformation of layered media were analyzed with the finite element method. A three-dimensional model of an elastic sphere sliding over an elastic-plastic layered medium was developed and validated by comparing finite element results with analytical and numerical solutions for the stresses and temperature distribution at the surface of an elastic homogeneous half-space. The evolution of deformation in the layered medium due to thermomechanical surface loading is interpreted in light of the dependence of temperature, von Mises equivalent stress, first principal stress, and equivalent plastic strain on the layer thickness, Peclet number, and sliding distance. The propensity for plastic flow and microcracking in the layered medium is discussed in terms of the thickness and thermal properties of the layer, sliding speed, medium compliance, and normal load. It is shown that frictional shear traction and thermal loading promote stress intensification and plasticity, especially in the case of relatively thin layers exhibiting low thermal conductivity.


2019 ◽  
Vol 10 (5) ◽  
pp. 660-677
Author(s):  
Norwahida Yusoff ◽  
Feizal Yusof

Purpose The purpose of this paper is to present the characteristics of elastic-plastic deformation and stress fields at the intersection of a crack front and the free surface of a three-dimensional body, referred to as corner fields. Design/methodology/approach The structures of elastic-plastic corner deformation field were assessed experimentally by looking at the corner border displacement and strain fields on the surface of a compact tension (CT) specimen using digital image correlation method. For assessment and verification purposes, the results were compared with the fields predicted through finite element analysis. The latter method was used further to assess the corner stress field. Findings The characteristics of displacement, strain and stress fields in the vicinity of a corner vertex in a finite geometry CT specimen in a strain hardening condition are independent of load and geometry. One of the distinctive features that becomes evident in this study is that the stress state at the corner vertex at θ=0° is a simple uniaxial tension. Originality/value This paper provides some insights on the structure of elastic-plastic corner fields that could optimistically be served as a fundamental framework towards the development of analytical solutions for elastic-plastic corner fields.


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