Effect of Bonding Force on the Conducting Particle With Different Sizes

2003 ◽  
Vol 125 (4) ◽  
pp. 624-629 ◽  
Author(s):  
N. H. Yeung ◽  
Y. C. Chan ◽  
C. W. Tan
Keyword(s):  
Heat Transfer ◽  
Stress Level ◽  
Transfer Problem ◽  
Bonding Temperature ◽  
Heat Transfer Analysis ◽  
Transient Heat Transfer ◽  
Element Analysis ◽  
Bonding Force ◽  
Conducting Particle ◽  
Center Area

Finite element analysis was used to model the transient heat transfer problem and the mechanical influence of the conducting particle in the anisotropic conductive adhesive (ACF). Three-dimensional (3D) brick element was performed for the transient heat transfer analysis, and the result was found that heat was transferred and spread from the die to the ACF and its conducting particle very quickly; in around 0.5 sec the ACF can reach the bonding temperature of 220°C. For the mechanical stress analysis of the conducting particle, the degree of the deformation was increased as the bonding force increased. The conducting particle was subjected to the larger stress level as the smaller of the particle size. The stress concentration was located at the edge area and diminished at the center area. It was also found that the cracks were found at the four corners of the conducting particles which was due to the highest stress level subjected on that location. Moreover, if only considering the plastic particle, the stress level was concentrated at the center area and vanished at the edge area.

scholarly journals Transient Heat Transfer Analysis for Brake Disks Using SPH

2009 ◽  
Vol 417-418 ◽  
pp. 617-620
Author(s):  
Gui Ming Rong ◽  
Hiroyuki Kisu
Keyword(s):  
Heat Transfer ◽  
Transfer Problem ◽  
Calculation Model ◽  
Heat Transfer Analysis ◽  
Transient Heat Transfer ◽  
Transient Temperature ◽  
Approximation Technique ◽  
Model Calculations ◽  
Various Boundary Conditions ◽  
Emergency Braking

Smoothed particle hydrodynamics (SPH) is a mesh-free numerical approximation technique for simulating various physical problems. A calculation system for transient heat transfer problem by SPH has been improved to deal with various boundary conditions and several model calculations are performed to verify it. As a practical application, the transient temperature field of a brake disk under emergency braking is analyzed. Both solid and ventilated disks are modeled with a moving heat source on the sliding surface. The numerical results show that the temperature sharply fluctuates because of the cyclic loading. Improvement of the calculation model is also discussed.

Transient heat-transfer analysis for sub-scale noz...

2005 ◽  
Author(s):  
Dr. Jae-Seok Yoo ◽  
Mr. Byung-Hun Kim ◽  
Dr. Young-Soon Jang ◽  
Dr. Yeong-Moo Yi
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Analysis ◽  
Transient Heat Transfer

scholarly journals A finite element analysis on combined convection and conduction in a channel with a thick walled cavity

2014 ◽  
Vol 24 (8) ◽  
pp. 1888-1905 ◽  
Author(s):  
M.M. Rahman ◽  
Hakan Oztop ◽  
S. Mekhilef ◽  
R. Saidur ◽  
A. Chamkha ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Finite Element ◽  
Mixed Convection ◽  
Conjugate Heat Transfer ◽  
Transfer Problem ◽  
Thick Wall ◽  
Thermal Conductivity Ratio ◽  
Element Analysis ◽  
Content Type ◽  
Combined Convection

Purpose – The purpose of this paper is to examine the effects of thick wall parameters of a cavity on combined convection in a channel. In other words, conjugate heat transfer is solved. Design/methodology/approach – Galerkin weighted residual finite element method is used to solve the governing equations of mixed convection. Findings – The streamlines, isotherms, local and average Nusselt numbers are obtained and presented for different parameters. It is found heat transfer is an increasing function of dimensionless thermal conductivity ratio. Originality/value – The literature does not have mixed convection and conjugate heat transfer problem in a channel with thick walled cavity.

A Coupled Computational Framework for the Transient Heat Transfer in a Circular Pipe Heated Internally With Expanding Heat Sources

2020 ◽  
Vol 142 (6) ◽  
Author(s):  
Chaobin Hu ◽  
Xiaobing Zhang
Keyword(s):  
Heat Transfer ◽  
Heat Exchange ◽  
Energetic Materials ◽  
Transfer Problem ◽  
Lumped Parameter Model ◽  
Heat Transfer Problem ◽  
Transient Heat Transfer ◽  
Combustion Model ◽  
Heat Sources ◽  
Computational Framework

Abstract In the present work, a transient heat transfer problem induced by internal combustion of energetic materials was studied. Most of previous studies utilized a lumped-parameter model to predict the parameter distributions of the hot combustion products, which determine the boundary conditions for the transient heat transfer problem. Moreover, the heat exchange between the solids and the fluids was ignored in the combustion model. In order to improve the modeling accuracy, a one-dimensional (1D) two-phase flow model was utilized to predict the fluid fields and the heat exchange was coupled into the combustion model. Based on the commercial software abaqus, the transient heat transfer in the combustion chamber was studied using a finite element method. The meshes near the inner surface were refined to capture the high temperature gradients along the radial direction of the barrel. Results indicate that the coupled model is capable of solving the transient heat transfer problems heated by distributed moving heat sources. The coupled computational framework provides foundations for the study of local wear and erosion of solids in extreme working conditions.

Evaluation of response characteristics of thin film gauge for conductive heat transfer mode

2020 ◽  
pp. 014233122096066
Author(s):  
Tanweer Alam ◽  
Rakesh Kumar
Keyword(s):  
Thin Film ◽  
Heat Transfer ◽  
Heat Flux ◽  
Short Duration ◽  
Temperature Data ◽  
Heat Transfer Analysis ◽  
Transient Temperature ◽  
Conductive Heat ◽  
Sensing Element ◽  
Element Analysis

Heat transfer analysis is the one of the most important designing aspects for many engineering systems. The design prospect in the preview of heat transfer focuses on the prediction of heat flux with the help of measured transient temperature data. Thin film gauges are one of the most predominant method for the heat flux prediction especially for short duration transient temperature measurement. Thin film gauges are usually exposed to the heated environment for the measurement purpose. However, there are some prominent research areas like ablation phenomenon met to spacecraft thermal shields during re-entry to the atmosphere, for which direct exposure of the thin film gauge to the heated environment causes the functional and working difficulties associated with the gauge. In the present study, it is aimed to investigate the suitability of thin film gauge for the conduction-based short duration measurement. An experimental set up is fabricated, which is used to supply the heat load to the hand-made thin film gauge using platinum as sensing element and quartz as a substrate. The transient temperature data is recorded during experiment is further compared with the simulated temperature histories obtained through finite element analysis. The heat flux estimation for both the analysis is made using measured transient temperature data by convolute integral of one- dimensional heat conduction equation. The estimated heat flux value for the experimental and numerical result is found to be in excellent agreement.

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