An Overview of High-Temperature Electronics and Sensor Development at NASA Glenn Research Center

2003 ◽  
Vol 125 (4) ◽  
pp. 658-664 ◽  
Author(s):  
Gary W. Hunter ◽  
Philip G. Neudeck ◽  
Robert S. Okojie ◽  
Glenn M. Beheim ◽  
J. A. Powell ◽  
...  

This paper gives a brief overview of the status of high-temperature electronics and sensor development at NASA Glenn Research Center supported in part or in whole by the Ultra Efficient Engine Technology Program. These activities contribute to the long-term development of an intelligent engine by providing information on engine conditions even in high temperature, harsh environments. The technology areas discussed are: 1) high-temperature electronics, 2) sensor technology development (pressure sensor and high-temperature electronic nose), 3) packaging of harsh environment devices and sensors, and 4) improved silicon carbide electronic materials. A description of the state-of-the-art and technology challenges is given for each area. It is concluded that the realization of a future intelligent engine depends on the development of both hardware and software including electronics and sensors to make smart components. When such smart components become available, an intelligent engine composed of smart components may become a reality.title

Author(s):  
Gary W. Hunter ◽  
Philip G. Neudeck ◽  
Robert S. Okojie ◽  
Glenn M. Beheim ◽  
J. A. Powell ◽  
...  

This paper gives a brief overview of the status of high temperature electronics and sensor development at NASA Glenn Research Center supported in part or in whole by the Ultra Efficient Engine Technology Program. These activities contribute to the long-term development of an intelligent engine by providing information on engine conditions even in high temperature, harsh environments. The technology areas discussed are: 1) High temperature electronics, 2) Sensor technology development (Pressure sensor and High temperature electronic nose), 3) Packaging of harsh environment devices and sensors, and 4) Improved Silicon Carbide electronic materials. A description of the state-of-the-art and technology challenges is given for each area. It is concluded that the realization of a future intelligent engine depends on the development of both hardware and software including electronics and sensors to make smart components. When such smart components become available, an intelligent engine composed of smart components may become a reality.


Instruments ◽  
2019 ◽  
Vol 3 (4) ◽  
pp. 62 ◽  
Author(s):  
Xiaorong Wang ◽  
Stephen A. Gourlay ◽  
Soren O. Prestemon

To enable the physics research that continues to deepen our understanding of the Universe, future circular colliders will require a critical and unique instrument—magnets that can generate a dipole field of 20 T and above. However, today’s maturing magnet technology for low-temperature superconductors (Nb-Ti and Nb 3 Sn) can lead to a maximum dipole field of around 16 T. High-temperature superconductors such as REBCO can, in principle, generate higher dipole fields but significant challenges exist for both conductor and magnet technology. To address these challenges, several critical research needs, including direct needs on instrumentation and measurements, are identified to push for the maximum dipole fields a REBCO accelerator magnet can generate. We discuss the research needs by reviewing the current results and outlining the perspectives for future technology development, followed by a brief update on the status of the technology development at Lawrence Berkeley National Laboratory. We present a roadmap for the next decade to develop 20 T-class REBCO accelerator magnets as an enabling instrument for future energy-frontier accelerator complex.


2010 ◽  
Vol 2010 (HITEC) ◽  
pp. 000089-000096 ◽  
Author(s):  
S T Riches ◽  
K Cannon ◽  
C Johnston ◽  
M Sousa ◽  
P Grant ◽  
...  

The requirement to install electronic power and control systems in high temperature environments has posed a challenge to the traditional limit of 125°C for high temperature exposure of electronics systems. The leap in operating temperature to above 200°C in combination with high pressures, vibrations and potentially corrosive environments means that different semiconductors, passives, circuit boards and assembly processes will be needed to fulfil the target performance specifications. Bare die mounted onto ceramic and insulated metal substrates can withstand higher temperatures than soldered surface mount devices on printed circuit boards. The results of the evaluation of electronic interconnect and substrate materials that have been submitted to temperatures of 250°C for up to 2000 hours will be presented, including details on novel adhesive formulations and high temperature insulated metal substrates. The materials and processes developed have been applied to the manufacture of high temperature circuits representative of analogue signal conditioning and processing, using silicon on insulator devices and passive components mounted into HTCC packages and onto thick film on ceramic substrates. Results of the characterisation of these devices and circuits at temperatures of 250°C for up to 2000 hours will be presented. This work forms part of the UPTEMP project has been set-up with support from UK Technology Strategy Board and the EPSRC, which started in March 2007 with 3 years duration. The project brings together a consortium of end-users (Sondex Wireline and Vibro-Meter UK), electronic module manufacturers (GE Aviation Systems Newmarket) and material suppliers (Gwent Electronic Materials and Thermastrate Ltd) with Oxford University-Materials Department, the leading UK high temperature electronics research centre.


2000 ◽  
Author(s):  
Vladimir Dmitriev ◽  
T. P. Chow ◽  
Steven P. DenBaars ◽  
Michael S. Shur ◽  
Michael G. Spencer

2006 ◽  
Vol 40 (2) ◽  
pp. 67-74
Author(s):  
E. Clausner ◽  
W.J. Greenert

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