A Damage Mechanics-Based Fatigue Life Prediction Model for Solder Joints

2003 ◽  
Vol 125 (1) ◽  
pp. 120-125 ◽  
Author(s):  
Hong Tang ◽  
Cemal Basaran
Keyword(s):  
Fatigue Life ◽  
Prediction Model ◽  
Life Prediction ◽  
Damage Mechanics ◽  
Solder Joints ◽  
Experimental Results ◽  
Fatigue Life Prediction ◽  
Isotropic Hardening ◽  
Cyclic Shear ◽  
Life Prediction Model

A thermomechanical fatigue life prediction model based on the theory of damage mechanics is presented. The damage evolution, corresponding to the material degradation under cyclic thermomechanical loading, is quantified thermodynamic framework. The damage, as an internal state variable, is coupled with unified viscoplastic constitutive model to characterize the response of solder alloys. The damage-coupled viscoplastic model with kinematic and isotropic hardening is implemented in ABAQUS finite element package to simulate the cyclic softening behavior of solder joints. Several computational simulations of uniaxial monotonic tensile and cyclic shear tests are conducted to validate the model with experimental results. The behavior of an actual ball grid array (BGA) package under thermal fatigue loading is also simulated and compared with experimental results.

Thermal Fatigue Life Prediction Model of CCGA Tin-Lead and Lead-Free Interconnects

2006 ◽  
Author(s):  
T. E. Wong ◽  
C. Chu
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Prediction Model ◽  
Thermal Fatigue ◽  
Strain Energy ◽  
Life Prediction ◽  
Solder Joints ◽  
Fatigue Life Prediction ◽  
Thermal Fatigue Life ◽  
Life Prediction Model

A thermal fatigue life prediction model of a ceramic column grid array (CCGA) solder joint assembly has been developed when the 90Pb/10Sn solder columns of the CCGA package are soldered onto the printed circuit board with either tin-lead or lead-free solder paste. This model was evolved from an empirically derived formula by correlating the solder nonelastic strain energy density increment to the fatigue life test data. To develop the solder joint fatigue life prediction model, a nonlinear finite element analysis (FEA) was conducted using the ABAQUS computer code. A thermal fatigue life prediction model was then established. The test results, obtained from various sources in which tin-lead and lead-free solder pastes on PCB were used, combined with the FEA derived nonelastic strain energy density per temperature cycle, ΔW, were used to calibrate the proposed life prediction model. In the analysis, 3-D finite element global- and sub-modeling techniques were used to determine the ΔW of the CCGA solder joints when subjected to temperature cycling. The analysis results show that: 1) solder joint would typically fail across solder column instead of along solder pad interfaces; and 2) higher nonelastic strain energy densities of solder occur at the solder columns at the package corners and these solder joints would fail first. These analysis predictions are consistent with the test observations. In the model calibration process, the 625- and 1657-pin CCGA test results, which were cycled between 20°C/90°C, 0°C/100°C, -55°C/110°C, or -55°C/125°C, were reasonably well correlated to the predicted values of ΔW. Therefore, the developed life prediction model could be used and is recommended to serve as an effective tool to determine the integrity of the CCGA solder joints during temperature cycling. In addition, the following future work is recommended: 1) selecting more study cases with various solder joint configurations, package sizes, environmental profiles, etc. to further calibrate this life prediction model; 2) using this model to conduct parametric studies to identify critical factors impacting solder joint fatigue life and then seek an optimum design; and 3) developing a simplified method instead of the FEA approach to make preliminary thermal fatigue life estimates of the CCGA solder joints.

Experimentally Validated Vibration Fatigue Life Prediction Model for Ball Grid Array Solder Joint

2000 ◽  
Author(s):  
T. E. Wong ◽  
F. W. Palmieri ◽  
L. A. Kachatorian
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Prediction Model ◽  
Life Prediction ◽  
Random Vibration ◽  
Solder Joints ◽  
Fatigue Life Prediction ◽  
Vibration Fatigue ◽  
Joint Vibration ◽  
Life Prediction Model

Abstract A newly developed methodology is used to support test validation of ball grid array (BGA) solder joint vibration fatigue life prediction model. This model is evolved from an empirical formula of universal slopes, which is derived from high-cycle fatigue test data using a curve fitting technique over 29 different materials of metals. To develop the BGA solder joint vibration fatigue life prediction model, a test vehicles (TV), on which various sizes of BGA daisy-chained packages are soldered, is first designed, fabricated and subjected to random vibration tests with continuously monitoring the solder joint integrity. Based on the measurement results, a destructive physical analysis is then conducted to further verify the failure locations and crack paths of the solder joints. Next, a method to determine the stresses/strains of BGA solder joints resulting from exposure of the TV to random vibration environments is developed. In this method, a 3-D modeling technique is used to simulate the vibration responses of the BGA packages. Linear static and dynamic finite element analyses with MSC/NASTRAN™ computer code, combined with a volume-weighted average technique, are conducted to calculate the effective strains of the solder joints. In the calculation process, several in-house developed Fortran programs, in conjunction with the outputs obtained from MSC/NASTRAN™ static and frequency response analyses, are used to perform the required computations. Finally, a vibration fatigue life model is established with two unknown parameters, which can be determined by correlating the derived solder effective strains to the test data. This test-calibrated model is then recommended to serve as an effective tool to determine the integrity of the BGA solder joints during vibration. Selecting more study cases with various package sizes, solder ball configurations, vibration profiles to further calibrate this model is also recommended. An example of a 313-pin plastic and 304-pin ceramic BGAs is illustrated in the present study.

Fatigue Life Prediction of Buckling String with Cracks in Horizontal Wells of Mining Engineering

2012 ◽  
Vol 577 ◽  
pp. 127-131 ◽  
Author(s):  
Peng Wang ◽  
Tie Yan ◽  
Xue Liang Bi ◽  
Shi Hui Sun
Keyword(s):  
Fatigue Life ◽  
Prediction Model ◽  
Life Prediction ◽  
Horizontal Well ◽  
Drill Pipe ◽  
Prediction Method ◽  
Drill String ◽  
Fatigue Life Prediction ◽  
Mining Engineering ◽  
Life Prediction Model

Fatigue damage in the rotating drill pipe in the horizontal well of mining engineering is usually resulted from cyclic bending stresses caused by the rotation of the pipe especially when it is passing through curved sections or horizontal sections. This paper studies fatigue life prediction method of rotating drill pipe which is considering initial crack in horizontal well of mining engineering. Forman fatigue life prediction model which considering stress ratio is used to predict drill string fatigue life and the corresponding software has been written. The program can be used to calculate the stress of down hole assembly, can predict stress and alternating load in the process of rotating-on bottom. Therefore, establishing buckling string fatigue life prediction model with cracks can be a good reference to both operation and monitor of the drill pipe for mining engineering.

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