Extending the Fatigue Life of Solder Grid Array (SGA) Electronic Packages

2003 ◽  
Vol 125 (1) ◽  
pp. 18-23 ◽  
Author(s):  
Michael C. Larson ◽  
Melody A. Verges
Keyword(s):  
Fatigue Crack ◽  
Fatigue Life ◽  
Crack Opening ◽  
Shear Loading ◽  
Electronic Packages ◽  
Printed Wiring Board ◽  
Solder Interconnects ◽  
Force Mode ◽  
Wiring Board ◽  
Crack Growth Model

A fracture mechanics approach is used to investigate how the fatigue life of a solder grid array (SGA) may be increased or decreased by the application of an axial force to individual solder interconnects, such as may be induced by use of an underfill, by warping of a printed wiring board, or by some other mechanical constraint. The predominant loading on the SGA is assumed to be the shear resulting from a difference in thermal expansion between the package and the printed wiring board in the presence of cyclic temperature variations. A fatigue crack growth model, akin to the Paris law, is proposed for the cycles to failure of an individual cracked interconnect which undergoes a cyclic mode-II shear loading in conjunction with either a constant crack opening force (mode-I) or a constant crack closing force. For typical SGA packages in use today, the model predicts that forces on the order of only one newton can significantly impede or accelerate the propagation of a fatigue crack.

Acceleration Factor to relate Thermal Cycles to Power Cycles for Ceramic Ball Grid Area Array Packages

2006 ◽  
Vol 3 (4) ◽  
pp. 177-193 ◽  
Author(s):  
Andy Perkins ◽  
Krishna Tunga ◽  
Suresh Sitaraman
Keyword(s):  
Fatigue Life ◽  
Environmental Parameters ◽  
Acceleration Factor ◽  
Junction Temperature ◽  
Design Parameters ◽  
Substrate Thickness ◽  
Electronic Packages ◽  
Printed Wiring Board ◽  
Ceramic Ball ◽  
Wiring Board

There is a need for a new Acceleration Factor (AF) that can relate Accelerated Thermal Cycle (ATC) fatigue life to Power Cycle (PC) fatigue life quickly and accurately in order to avoid over designing electronic packages for benign environments. An AF, such as the Norris-Landzberg AF, is only applicable when using it to predict fatigue life within the same environment, i.e. ATC to ATC or PC to PC. This work proposes an AF that takes into account the differences between ATC tests and PC tests for ceramic ball grid array (CBGA) packages by considering relevant design and environmental parameters. The new AF is based on relevant design parameters such as substrate size, substrate thermal conductivity, substrate thickness, coefficient of thermal (CTE) mismatch between the substrate and printed wiring board (PWB), PWB thickness, and environmental parameters such as temperature range (ΔT), frequency of cycles (f), and peak/junction temperature (Tj). Finite Element Models (FEM), experimental data, laser moiré interferometry, Design of Simulation (DOS), ANOVA, and regression analysis are used to develop the new AF. The new AF can be used to more accurately assess PC fatigue life from ATC tests so that expensive over-designing of electronic packages can be avoided for desktop/server/laptop applications.

Warpage Measurement Using Projection Moire´ System and Two Automatic Image Segmentation Algorithms

2007 ◽  
Author(s):  
Wei Tan ◽  
I. Charles Ume
Keyword(s):  
Image Segmentation ◽  
Electronic Packages ◽  
Printed Wiring Board ◽  
Segmentation Algorithms ◽  
Out Of Plane ◽  
Cte Mismatch ◽  
Image Models ◽  
Wiring Board ◽  
Plane Displacement ◽  
Projection Moire

Out-of-plane displacement (warpage) has been a major reliability concern for board-level electronic packaging. Printed wiring board (PWB) and component warpage results from CTE mismatch among the materials that make up the PWB assembly (PWBA). Warpage occurring during surface-mount assembly reflow processes and normal operations may lead to serious reliability problems. In this paper, a projection moire´ warpage measurement system and two types of automatic image segmentation algorithms were presented. In order to use the projection moire´ technique to separately determine the warpage of a PWB and assembled electronic packages in a PWBA, two image segmentation algorithms based on mask image models and active contour models (snakes) were developed. They were used to detect package locations in a PWBA displacement image generated by the projection moire´ system. The performances of the mask image and snake approaches based on their resolutions, processing rates, and measurement efficiencies were evaluated in this research. Real-time composite Hermite surface models were constructed to estimate the PWB warpage values underneath the electronic packages. The above automatic image segmentation algorithms were integrated with the projection moire´ system to accurately evaluate the warpage of PWBs and assembled chip packages individually.

Fatigue Life Estimation of Welded Joints Including the Effects of Crack Closure Phenomena

2011 ◽  
Author(s):  
Diego Felipe Sarzosa Burgos ◽  
Claudio Ruggieri ◽  
Leonardo Barbosa Godefroid ◽  
Gustavo H. B. Donato
Keyword(s):  
Finite Element ◽  
Fatigue Crack ◽  
Fatigue Life ◽  
Fatigue Crack Growth ◽  
Crack Growth ◽  
Crack Closure ◽  
Crack Opening ◽  
Weld Strength ◽  
Operating Life ◽  
Mechanical Heterogeneity

The integrity of mechanical components, particularly when they experience considerable fatigue damage during its operating life, can be strongly influenced by the presence of residual stress fields and mechanical heterogeneity. Premature closure of crack flanks greatly influences fatigue crack growth rate. Extensive elastic-plastic finite element analyses have been carried out to investigate detailed crack closure behavior in center cracked welded compact tension (CT) specimens with one level of weld strength mismatch. The finite element results show that homogeneous, soft material has higher crack opening loads than heterogeneous material with 50% overmatch conditions. Fracture testing conducted on C(T) specimens to measure fatigue crack growth rates for an ASTM A516 Gr. 70 steel weldment provide the experimental data to support such behavior. The fatigue life can be reduced by more than 100% for a condition of 50% overmatch when compared with the evenmatch condition. It was verified that most of time spent in fatigue propagation life is consumed at the beginning of the propagation life.

Fatigue life prediction based on an equivalent initial flaw size approach and a new normalized fatigue crack growth model

2016 ◽  
Vol 69 ◽  
pp. 15-28 ◽  
Author(s):  
J.A.F.O. Correia ◽  
S. Blasón ◽  
A.M.P. De Jesus ◽  
A.F. Canteli ◽  
P.M.G.P. Moreira ◽  
...  
Keyword(s):  
Fatigue Crack ◽  
Fatigue Life ◽  
Fatigue Crack Growth ◽  
Crack Growth ◽  
Growth Model ◽  
Life Prediction ◽  
Flaw Size ◽  
Fatigue Life Prediction ◽  
Crack Growth Model

The Fatigue Life Estimation Method From the Stress Concentration Region With Zero Defect: An Application to the Fatigue Crack Growth Simulation Code “FLARP” for the In-Plane Gusset Welded Joint

2004 ◽  
Author(s):  
Masahiro Toyosada ◽  
Koji Gotoh ◽  
Keitaro Konuma ◽  
Akira Sueda
Keyword(s):  
Fatigue Crack ◽  
Fatigue Life ◽  
Fatigue Crack Growth ◽  
Crack Growth ◽  
Crack Opening ◽  
Simulation Code ◽  
Growth Simulation ◽  
Life Estimation ◽  
Crack Growth Simulation ◽  
Fatigue Life Estimation

In-plane gusset welded joints are very popular and used in many steel constructed structures. Fatigue life estimations for this type of joint have been performed by applying the fatigue crack growth simulation code “FLARP” developed by the authors. The fatigue crack shows the typical opening/closing behavior during fatigue crack growth. The plastic deformed layer in the crack wake, which represents the loading history indirectly, contributes to the behavior. The consideration of crack closure is essential in the estimation of the fatigue life. FLARP enables the quantitative simulation of the fatigue crack opening/closing. By considering the cyclic plastic behavior ahead of a fatigue crack tip, the improved effective stress intensity factor range (ΔKRPG) to denote the fatigue crack propagation law, which is formulated by replacing the crack opening load with the Retensile Plastic zone Generating load (RPG load), was defined. ΔKRPG is adopted as the parameter for the fatigue life estimation by FLARP. The validity of the fatigue life estimation by FLARP is confirmed by comparing the estimated S-N curves with the experimental results for the in-plane gusset welded joints.

Three- and Four-Point Bend Testing for Electronic Packages

2003 ◽  
Vol 125 (4) ◽  
pp. 556-561 ◽  
Author(s):  
Santosh Shetty ◽  
Tommi Reinikainen
Keyword(s):  
Bending Test ◽  
Electronic Packages ◽  
Reliability Model ◽  
Test Results ◽  
Printed Wiring Board ◽  
Reliability Models ◽  
Four Point Bending ◽  
Three Point Bend Test ◽  
Point Bend ◽  
Wiring Board

This study demonstrates the application of three-point and four-point bending tests for evaluating the reliability of chip scale packages under curvature loads. A three-point bend test is conducted on 0.5-mm-pitch chip-scale packages (CSPs) mounted on FR4 (Flame Retardant) substrates. This test is simulated by using the finite element method and the results are calibrated experimentally to formulate a reliability model. A three-point bend scheme is an ideal choice for generating reliability models because multiple packages can be tested under multiple loads in a single test. This reliability model can be used to predict the durability of the packages in the real product under any printed wiring board (PWB) curvature loading conditions. A four-point bending simulation is also demonstrated on the test substrate. Four-point bending test is an ideal method for testing a larger sample size of packages under a particular predefined stress level. This paper describes the bending simulation and testing on packages in a generic sense. Due to the confidentiality of the test results, the package constructional details, material properties, and the actual test data have not been presented here.

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